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56-Lead*

Catalog Datasheet Results Type PDF Document Tags
Abstract: Switches S Low-Profile 56-Lead TQFN Package Applications Ordering Information VR12/IMVP-7 VR12/IMVP-7 CPU ... Original
datasheet

1 pages,
49.82 Kb

MAX17039GTN MAX8791 IMVP intel IMVP7 VR12 intel VR12 single phase fully controlled rectifier VR12 INTEL IMVP7 MAX17039 VR12/IMVP-7 MAX17491 VR12/ VR12/IMVP-7 abstract
datasheet frame
Abstract: UHH Package 56-Lead Plastic QFN (5mm - 9mm) (Reference LTC DWG # 05-08-1727 Rev A) 0.70 ± 0.05 5.50 ± 0.05 (2 SIDES) 4.10 ± 0.05 (2 SIDES) 3.60 REF (2 SIDES) 3.45 ±0.05 7.13 ±0.05 PACKAGE OUTLINE 0.20 ± 0.05 0.40 BSC 6.80 REF (2 SIDES) 8.10 ± 0.05 (2 SIDES) 9.50 ± 0.05 (2 SIDES) RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 5.00 ± 0.10 (2 SIDES) 0.75 ± 0.05 PIN 1 NOTCH R = 0.30 TYP OR 0.35 - 45° CHAMFER 3.60 REF 55 56 0.00 ­ ... Original
datasheet

1 pages,
23.77 Kb

datasheet abstract
datasheet frame
Abstract: LGA Package 56-Lead (11.25mm - 9.00mm - 2.82mm) (Reference LTC DWG# 05-08-1825 Rev Ø) aaa Z 9.00 BSC Y PADS SEE NOTES 2.72 ­ 2.92 X DETAIL A 7.62 BSC DIA (0.635) PAD 1 3 A 0.605 ­ 0.665 PAD 1 CORNER MOLD CAP 4 11.25 BSC B SUBSTRATE C D 8.89 BSC 0.27 ­ 0.37 2.45 ­ 2.55 E Z bbb Z DETAIL B F 1.27 BSC G H aaa Z 7 PACKAGE TOP VIEW 5 4 3 2 1 PACKAGE BOTTOM VIEW DETAIL B 0.630 ±0.025 SQ. 56x 6 ... Original
datasheet

1 pages,
150.17 Kb

SPP-010 datasheet abstract
datasheet frame
Abstract: FW Package 56-Lead Plastic TSSOP (6.1mm) (Reference LTC DWG # 05-08-1652 Rev 0) 56 29 0.95 ±0.10 13.90 ­ 14.10* (.548 ­ .556) 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 8.4 ±0.10 6.2 ±0.10 7.9 ­ 8.3 (.311 ­ .327) 1 28 0.32 ±0.05 0.50 BSC RECOMMENDED SOLDER PAD LAYOUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 6.0 ­ 6.2* (.236 ­ .244) 1.10 (.0433) MAX 0.25 REF 0° ­ 8° -T0.10 C ... Original
datasheet

1 pages,
20.93 Kb

datasheet abstract
datasheet frame
Abstract: representative of the company. Rev. 0.06 sharp LHF64P05 LHF64P05 1 CONTENTS PAGE PAGE 56-Lead TSOP , Erase Cycles 56-Lead TSOP (Normal Bend) CMOS Process (P-type silicon substrate) ETOXTM* Flash , 22 23 24 25 26 27 28 56-LEAD TSOP STANDARD PINOUT 14mm x 20mm TOP VIEW 3 56 55 54 , VCC DQ9 DQ1 DQ8 DQ0 A0 BYTE# NC CE2 Figure 1. 56-Lead TSOP (Normal Bend) Pinout Rev. ... Original
datasheet

47 pages,
524.53 Kb

LHF64P05 LH28F640SPHT-PTL12 FUM03201 LH28F640SPHT-PTL12A LH28F640SPHT-PTL12A abstract
datasheet frame
Abstract: LM94 TruThermTM Hardware Monitor with PI Loop Fan Control for Server Management 1.0 General Description The LM94 hardware monitor has a two wire digital interface compatible with SMBus 2.0. Using a ADC, the LM94 measures the temperature of four remote diode connected transistors as well as its own die and 16 power supply voltages. The LM94 has new TruTherm technology that supports precision thermal diode measurements of processors on submicron processes. To set fan speed, the LM94 has tw ... Original
datasheet

112 pages,
836.85 Kb

amd athlon PIN LAYOUT 9698 8928 33-Df 24428 201124 LM60 VRD10 MTD56 MMBT3904 LM94CIMTX LM94CIMT LM94 LM93 BB 8615 datasheet abstract
datasheet frame
Abstract: -40°C to 85°C Package 56-Lead, Thin Shrink Small Outline Package (TSSOP), JEDEC M0-153 M0-153, 6.1mm Wide , 56-Lead Thin-Shrink Small Outline Package (TSSOP), JEDEC MO153 MO153, 6.1mm Wide Package drawings are provided ... Original
datasheet

7 pages,
288.33 Kb

MO153 FSLV16211MTDX FSLV16211 2A12 1B12 1A12 FSLV16211 abstract
datasheet frame
Abstract: SL28540 SL28540 Package Diagrams 56-Lead QFN 8x 8mm LF56A LF56A TOP VIEW BOTTOM VIEW SIDE VIEW 0.08[0.003 ... Original
datasheet

25 pages,
265.79 Kb

SL28540ALC DOT96 ck505 SL28540 CK540 SL28540 abstract
datasheet frame
Abstract: to 85°C Rev 1.0, November 20, 2006 Page 22 of 23 CY28443-2 CY28443-2 Package Diagrams 56-Lead Thin , [0.030] 0°-8° 0.100[0.003] 0.200[0.008] SEATING PLANE 56-Lead Shrunk Small Outline Package ... Original
datasheet

23 pages,
242.4 Kb

LVDS100M DOT96 CY28443-2 318M CY28443-2 abstract
datasheet frame
Abstract: , November 24, 2006 Page 15 of 16 CY28329 CY28329 \ Package Drawing and Dimensions 56-Lead Shrunk Small Outline Package O56 51 85062 *C 56-Lead Thin Shrunk Small Outline Package, Type II (6 mm x 12 mm ... Original
datasheet

16 pages,
218.77 Kb

CY28329 2TDKACB2012L-120 CY28329 abstract
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Over 1.1 million files (1986-2014): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
devices can be treated as a DIP component for breadboarding as well as for programming. (56-lead TSOP breadboarding adapters are suitable for breadboarding only). For programming of devices mounted on 56-lead
www.datasheetarchive.com/files/intel/products two & tools/design/flcomp/devtools/7f65e1a6.htm
Intel 12/05/1999 4.61 Kb HTM 7f65e1a6.htm
Texas Instruments sockets (Programming/Burn-in) (PSOP/SSOP) Texas Instruments, Inc. Architecture: Type : Last Update: Flash Memory Components FlashFile(TM) Memory Sockets 6/2/98 12:33:37 PM Vendor Information Tool Description: Burn-in and Programming sockets for Intel® 56-lead Shrink Small Outline Package and 44-lead Plastic Small Outline Package. See attached file for
www.datasheetarchive.com/files/intel/products two & tools/design/flcomp/devtools/82bf61a6.htm
Intel 12/05/1999 4.23 Kb HTM 82bf61a6.htm
General's HSP adapter for 56-lead SSOP (Intel® HSP_TSOP32 TSOP32 TSOP32 TSOP32.pdf - StrataFlash™ HSP_TSOP40-1 TSOP40-1 TSOP40-1 TSOP40-1.pdf General's HSP adapter for 56-lead TSOP (Intel® HSP_uBGA48-3A.pdf - StrataFlash™
www.datasheetarchive.com/files/intel/products two & tools/design/flcomp/devtools/8278a1a6.htm
Intel 12/05/1999 11.39 Kb HTM 8278a1a6.htm
Texas Instruments sockets (Programming/Burn-in) (PSOP/SSOP) Texas Instruments, Inc. Architecture: Type : Last Update: Flash Memory Components Intel(R) StrataFlash(TM) Memory Sockets 6/2/98 12:33:37 PM Vendor Information Tool Description: Burn-in and Programming sockets for Intel® 56-lead Shrink Small Outline Package and 44-lead Plastic Small Outline Package. See attached
www.datasheetarchive.com/files/intel/products two & tools/design/flcomp/devtools/82c0e1a6.htm
Intel 12/05/1999 4.23 Kb HTM 82c0e1a6.htm
treated as a DIP component for breadboarding as well as for programming. (56-lead TSOP breadboarding adapters are suitable for breadboarding only). For programming of devices mounted on 56-lead adapters, a
www.datasheetarchive.com/files/intel/products two & tools/design/flcomp/devtools/7f6561a6.htm
Intel 12/05/1999 4.47 Kb HTM 7f6561a6.htm
General's HSP adapter for 56-lead SSOP (Intel® HSP_TSOP32 TSOP32 TSOP32 TSOP32.pdf - StrataFlash™ HSP_TSOP40-1 TSOP40-1 TSOP40-1 TSOP40-1.pdf General's HSP adapter for 56-lead TSOP (Intel® HSP_uBGA48-3A.pdf - StrataFlash™
www.datasheetarchive.com/files/intel/products two & tools/design/flcomp/devtools/8276a1a6.htm
Intel 12/05/1999 11.67 Kb HTM 8276a1a6.htm
General's HSP adapter for 56-lead SSOP (Intel® HSP_TSOP32 TSOP32 TSOP32 TSOP32.pdf - StrataFlash™ HSP_TSOP40-1 TSOP40-1 TSOP40-1 TSOP40-1.pdf General's HSP adapter for 56-lead TSOP (Intel® HSP_uBGA48-3A.pdf - StrataFlash™
www.datasheetarchive.com/files/intel/products two & tools/design/flcomp/devtools/827721a6.htm
Intel 12/05/1999 11.62 Kb HTM 827721a6.htm
programming. (56-lead TSOP breadboarding adapters are suitable for breadboarding only). For programming of devices mounted on 56-lead adapters, a 56-pin DIP to 40 or 48-pin DIP adapter is necessary. Conversion of
www.datasheetarchive.com/files/intel/products two & tools/design/flcomp/devtools/7f6761a6.htm
Intel 12/05/1999 4.45 Kb HTM 7f6761a6.htm
Texas Instruments sockets (Programming/Burn-in) (PSOP/SSOP) Texas Instruments, Inc. Architecture: Type : Last Update: Flash Memory Components Fast Flash Sockets 6/2/98 12:33:37 PM Vendor Information Tool Description: Burn-in and Programming sockets for Intel® 56-lead Shrink Small Outline Package and 44-lead Plastic Small Outline Package. See attached file for additional
www.datasheetarchive.com/files/intel/products two & tools/design/flcomp/devtools/82bf21a6.htm
Intel 12/05/1999 4.15 Kb HTM 82bf21a6.htm
treated as a DIP component for breadboarding as well as for programming. (56-lead TSOP breadboarding adapters are suitable for breadboarding only). For programming of devices mounted on 56-lead adapters, a
www.datasheetarchive.com/files/intel/products two & tools/design/flcomp/devtools/7f65a1a6.htm
Intel 12/05/1999 4.43 Kb HTM 7f65a1a6.htm