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54TSOP

Catalog Datasheet MFG & Type PDF Document Tags

1Mx16x4

Abstract: PC100 100 3.3 6 4K/64 `PC100' 3.3 6 4K/64 `PC100' 3.3 Package 54TSOP II 54TSOP II 54TSOP II 54TSOP II 54TSOP II 54TSOP II 54TSOP II 54TSOP II 54TSOP II SQP £ each POA POA POA POA POA POA POA POA POA · · · ·
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1Mx16x4 UPD4564163G5-A10B 54-TSOP 54PIN PD4564441G5-A10B PD4564441G5-A10 PD4564441G5-A80 PD4564841G5-A10B PD4564841G5-A10

pc2-5300

Abstract: elpida 1gb pc2 -E 75-E 6B-E 75-E 6B-E 75-E 75-E 75-E 6B-E 75-E 75-E 6B-E 75-E 3.3+/-0.3V 54-TSOP II 90-FBGA 2.5+/-0.2V Product Status Ask MP MP UD 4K/64ms 1.8+/-0.1V G 54-TSOP II , 54-TSOP II Ask J 2.5+/-0.2V H 3.3+/-0.3V 2.5+/-0.2V 3.3+/-0.3V UD: Under , status Selection Guide E0853E70 (Ver.7.0) Package 7 ES F 2K/32ms 60-FBGA 54-TSOP II , Rev. 1.8+/-0.1V 8K/64ms B Package 54-TSOP II Product Status Ask A75T A75I-E
Elpida Memory
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pc2-5300 elpida 1gb pc2 ELPIDA PC2-3200 ECL120ACECN ELPIDA DDR2 M01E0107

MR4A16BC

Abstract: MR4A16BCMA35 MRAM 48-BGA 3.3 V 1Mx16 MRAM 48-BGA 3.3 V 1Mx16 MRAM 54-TSOP 3.3 V 1Mx16 MRAM 54-TSOP 3.3 V 1Mx16 MRAM 54-TSOP Commercial Industrial Automotive Commercial Industrial Automotive Note 1: These , © 2010 13 Document Number: MR4A16B Rev. 5, 4/2010 MR4A16B 5. MECHANICAL DRAWING Figure 5.2 54-TSOP , , 2010 Added 54-TSOP package options. How to Reach Us: Home Page: www.everspin.com E-Mail
Everspin Technologies
Original
MR4A16BC MR4A16BCMA35 tsop-ii tray 11.76 MR4A16BMYS3 MR4A BGA Package 0.35mm pitch EST00352
Abstract: 1Mx16 MRAM 48-BGA 3.3 V 1Mx16 MRAM 54-TSOP 3.3 V 1Mx16 MRAM 54-TSOP 3.3 V 1Mx16 MRAM 54-TSOP , Document Number: MR4A16B Rev. 4, 3/2010 MR4A16B 5. MECHANICAL DRAWING Figure 5.2 54-TSOP D 54 28 A2 , 54-TSOP package options. How to Reach Us: Home Page: www.everspin.com E-Mail Everspin Technologies
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K9F2G08U0C

Abstract: K9K8G08U0D www.samsung.com/semi/dram SDRAM COMPONENTS Notes: Refresh Remarks 8Mx8 K4S640832N-LC75000 54-TSOP 133 4K EOL with no replacement 4Mx16 K4S641632N-LC(L)(75/60)000 54-TSOP 133/166 4K EOL with no replacement 16Mx8 K4S280832O-LC(L)75000 54-TSOP 133 4K 8Mx16 K4S281632O-LC(L)(75/60)000 54-TSOP 133/166 4K K4S560432N-LC(L)75000 54-TSOP 133 8K 32Mx8 K4S560832N-LC(L)75000 54-TSOP 133 8K K4S561632N-LC(L)(75/60)000 54-TSOP 133/166 8K
Samsung Semiconductor
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K9F2G08U0C K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C BR-10-ALL-001

mr4a16bmys351

Abstract: BGA OUTLINE DRAWING 54-TSOP2 Commercial 3.3 V 1Mx16 MRAM 54-TSOP 2 Industrial 3.3 V 1Mx16 MRAM 54-TSOP2 AEC3.3 V 1Mx16 MRAM 54-TSOP2 T&R Commercial 3.3 V 1Mx16 MRAM 54-TSOP 2 T&R Industrial 3.3 V 1Mx16 MRAM 54-TSOP2 T&R , : MR4A16B Rev. 6, 10/2011 MR4A16B 5. MECHANICAL DRAWING Figure 5.2 54-TSOP2 D 54 28 A2 A1 A 2 3 , . Changed speed marking and timing specs to 35 ns part. Changed BGA package to 10 mm x 10mm Added 54-TSOP
Everspin Technologies
Original
mr4a16bmys351 BGA OUTLINE DRAWING AEC-Q100 EST352

K9F2G08U0B

Abstract: K9HCG08U1M-PCB0 Speed (Mbps) Refresh Remarks 8Mx8 K4S640832N-UC(75)000 54-TSOP 133 4K K-die changing to N-die 4Mx16 K4S641632N-UC(L)(75/60)000 54-TSOP 133/143/166 4K K-die changing to N-die 16Mx8 K4S280832K-UC(L)(75)000 54-TSOP 133 4K I-die changing to K-die 8Mx16 K4S281632K-UC(L)(75/60)000 54-TSOP 133/166 4K I-die changing to K-die K4S560432J-UC(L)(75)000 54-TSOP 133 8K H-die changing to J-die 32Mx8 K4S560832J-UC(L)(75)000
Samsung Semiconductor
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K9F2G08U0B K9HCG08U1M-PCB0 K9NCG08U5M-PCB0 K9F2G08U0B-PCB0 K9F4G08U0B K9WBG08U1M BR-09-ALL-001

MR4A16BCYS35R

Abstract: aec-q100 package Parts Grade Temp Range Package 48-BGA Commercial 0 to +70 °C 54-TSOP 48-BGA Industrial -40 to +85°C 54-TSOP2 , MR4A16B 5. MECHANICAL DRAWING Figure 5.2 54-TSOP2 D 54 28 A2 A1 A 2 3 E1 E 1 0.20(0.008 , marking and timing specs to 35 ns part. Changed BGA package to 10 mm x 10mm Added 54-TSOP package options , View. Figure 2.1 Power Up and Power Down Timing redrawn. Added 54-TSOP illustrations. Reformatted all
Everspin Technologies
Original
MR4A16BCYS35R aec-q100 package 1-877-347-MRAM
Abstract: Package 48-BGA Commercial 0 to +70 °C 54-TSOP 48-BGA Industrial -40 to +85°C 54-TSOP2 , Figure 5.2 54-TSOP2 A2 D A1 A 54 28 θ3 L1 E E1 θ2 c 27 1 â•0.20 , mm x 10mm 5 Apr 7, 2010 Added 54-TSOP package options. 6 Oct 7, 2011 Added , . Added 54-TSOP illustrations. Reformatted all parametric tables. Reformatted Table 4.1 Ordering Part Everspin Technologies
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EDE2116ACBG

Abstract: EDE2116ACBG-1J-F 4 166MHz(3-3-3) 133MHz(3-3-3) EDS2516AFTA 6B-E 75-E 3.3+/-0.3V 8K/64ms F 54-TSOP , -E 3.3+/-0.3V 4K/64ms H 54-TSOP II Ask 4M x 32 4 166MHz(3-3-3) 133MHz(3-3-3
Elpida Memory
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EDE2116ACBG EDE2116ACBG-1J-F EDE1116AGBG-1J-F DDR3-800D ELPIDA lpddr DDR3-800E E1454E90 M01E0706

CY14B108N-BA25XI

Abstract: 54TSOP A18 A8 Figure 2. Pin Diagram - 44/54-Pin TSOP II 44-TSOP II 54-TSOP II (x8) NC [4 , to Case) Test Conditions 48-FBGA 44-TSOP II 54-TSOP II Test conditions follow standard test , values for 48-FBGA,44-TSOP II and 54-TSOP II packages Changed tCW value from 16ns to 15ns *B
Cypress Semiconductor
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CY14B108N-BA25XI CY14B108L-BA25XI CY14B108L CY14B108N 1024K 8/512K CY14B108L/CY14B108N 44/54-P

samsung ddr3 ram MTBF

Abstract: KLMAG2GE4A-A001 Organization K4S560432N-LC(L)75 54-TSOP 133 8K EOL end of 2011 32Mx8 K4S560832N-LC(L)75 54-TSOP 133 8K EOL end of 2011 16Mx16 128Mb Notes: 8 K4S561632N-LC(L)(75/60) 54-TSOP 133/166 8K EOL end of 2011 16Mx8 K4S280832O-LC(L)75 54-TSOP 133 4K EOL end of 2011 8Mx16 K4S281632O-LC(L)(75/60) 54-TSOP 133/166 4K Voltage: 3.3V All
Samsung Semiconductor
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samsung ddr3 ram MTBF KLMAG2GE4A-A001 KLMAG KLM4G1FE3B-B001 KLM8G2FE3B-B001 KLM2G1HE3F-B001 BR-12-ALL-001

PC2-6400

Abstract: DDR3-800D Supply Voltage 3.3+/-0.3V 3.3+/-0.3V Refresh Cycles 8K/64ms 4K/64ms Rev. F H Package 54-TSOP II 54-TSOP
Elpida Memory
Original
PC2-6400 PC3-8500 DDR3-1066E DDR3-1333G ELPIDA DRAM selection guide elpida pc2-6400 J1241E80 166MH 133MH 100MH 105MH ECL5432CAC1

CY14B108N-BA20XIT

Abstract: 54-TSOP 2. Pin Diagram - 44/54-Pin TSOP II 44-TSOP II (x8) 54-TSOP II (x16) NC [4] NC A0 A1 A2 A3 , thermal impedance, in accordance with EIA/JESD51. Figure 4. AC Test Loads 48-FBGA 44-TSOP II 54-TSOP II , resistance values for 48-FBGA,44-TSOP II and 54-TSOP II packages Changed tCW value from 16ns to 15ns Added
Cypress Semiconductor
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CY14B108N-BA20XIT

cy14b108l-zs20xi

Abstract: 164uf ) 54-TSOP II (x16) NC [4] NC A0 A1 A2 A3 A4 CE DQ0 DQ1 VCC VSS DQ2 DQ3 WE A5 A6 A7 A8 A9 NC NC 1 , Loads 48-FBGA 44-TSOP II 54-TSOP II 28.82 7.84 31.11 5.56 30.73 6.08 Unit °C/W °C/W JA JC 3.0V , -FBGA,44-TSOP II and 54-TSOP II packages Changed tCW value from 16ns to 15ns Added maximum accumulated
Cypress Semiconductor
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cy14b108l-zs20xi 164uf CY14B108L-ZS45XI

cy14b108n

Abstract: ] HSB NC A18 A8 A18 A8 Figure 2. Pin Diagram - 44/54-Pin TSOP II 44-TSOP II 54-TSOP , (Junction to Case) Test Conditions 48-FBGA 44-TSOP II 54-TSOP II Test conditions follow standard , resistance values for 48-FBGA,44-TSOP II and 54-TSOP II packages Changed tCW value from 16ns to 15ns *B
Cypress Semiconductor
Original

54-pin TSOP thermal resistance junction to case

Abstract: 44/54-Pin TSOP II 44-TSOP II (x8) 54-TSOP II (x16) NC [4] NC A0 A1 A2 A3 A4 CE DQ0 DQ1 VCC , accordance with EIA/JESD51. Figure 4. AC Test Loads 48-FBGA 44-TSOP II 54-TSOP II 28.82 7.84 31.11 5.56 30.73 , resistance values for 48-FBGA,44-TSOP II and 54-TSOP II packages Changed tCW value from 16ns to 15ns Added
Cypress Semiconductor
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54-pin TSOP thermal resistance junction to case

TSOP II 54

Abstract: -Pin TSOP II 44-TSOP II 54-TSOP II (x8) NC [4] NC A0 A1 A2 A3 A4 CE DQ0 DQ1 VCC VSS , (Junction to Case) Test Conditions 48-FBGA 44-TSOP II 54-TSOP II Test conditions follow standard , industrial and Commercial temperature Grade Updated Thermal resistance values for 48-FBGA,44-TSOP II and 54-TSOP
Cypress Semiconductor
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TSOP II 54

R32237

Abstract: CPU-A13 ViaTP VCC_3V MEM_CLK_OUT2 37 38 CKE CLK NC NC uPD4564163 54-TSOP II 4M x 16 3130-00194 3V 40 36 VCC_3V MEM_CLK_OUT2 37 38 CKE CLK NC NC uPD4564163 54-TSOP II 4M x 16 3130-00194 3V 40 36
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R32237 CPU-A13 10uf,16v 10uf16v CER-0805 CTD12 MT9044 MT9042 16OMT9044 32MHZ NDTACK10K 1/10W
Abstract: 44/54-Pin TSOP II 44-TSOP II (x8) 54-TSOP II (x16) NC [4] NC A0 A1 A2 A3 A4 CE DQ0 DQ1 VCC , Loads 48-FBGA 44-TSOP II 54-TSOP II 28.82 7.84 31.11 5.56 30.73 6.08 Unit °C/W °C/W JA JC 3.0V , values for 48-FBGA,44-TSOP II and 54-TSOP II packages Changed tCW value from 16ns to 15ns Added maximum Cypress Semiconductor
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TSOP 86 Package

Abstract: A11E -E 75-E 6B-E 75-E 6B-E 75-E 75-E 75-E 6B-E 75-E 75-E 6B-E 75-E 3.3+/-0.3V 54-TSOP II 90-FBGA 2.5+/-0.2V Product Status Ask MP MP UD 4K/64ms 1.8+/-0.1V G 54-TSOP II , 54-TSOP II Ask J 2.5+/-0.2V H 3.3+/-0.3V 2.5+/-0.2V 3.3+/-0.3V UD: Under , status Selection Guide E0853E70 (Ver.7.0) Package 7 ES F 2K/32ms 60-FBGA 54-TSOP II , Rev. 1.8+/-0.1V 8K/64ms B Package 54-TSOP II Product Status Ask A75T A75I-E
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TSOP 86 Package A11E 128MB PC266 TSOP 54 Package 4mx32 DDR 8MX16 tsop 2 66 pin PC100/133 A0-A11 A0-A12 A0-A10 PC266 PC200
Abstract: MRAM 48-BGA 3.3 V 1Mx16 MRAM 48-BGA 3.3 V 1Mx16 MRAM 54-TSOP 3.3 V 1Mx16 MRAM 54-TSOP 3.3 V 1Mx16 MRAM 54-TSOP Commercial Industrial Automotive Commercial Industrial Automotive Note 1: These , © 2010 13 Document Number: MR4A16B Rev. 5, 4/2010 MR4A16B 5. MECHANICAL DRAWING Figure 5.2 54-TSOP , , 2010 Added 54-TSOP package options. How to Reach Us: Home Page: www.everspin.com E-Mail White Electronic Designs
Original
WEDPNF8M721V-XBX 750TM 125MH WED3C750A8M-200BX

W364M72V-XSBX

Abstract: www.samsung.com/semi/dram SDRAM COMPONENTS Notes: Refresh Remarks 8Mx8 K4S640832N-LC75000 54-TSOP 133 4K EOL with no replacement 4Mx16 K4S641632N-LC(L)(75/60)000 54-TSOP 133/166 4K EOL with no replacement 16Mx8 K4S280832O-LC(L)75000 54-TSOP 133 4K 8Mx16 K4S281632O-LC(L)(75/60)000 54-TSOP 133/166 4K K4S560432N-LC(L)75000 54-TSOP 133 8K 32Mx8 K4S560832N-LC(L)75000 54-TSOP 133 8K K4S561632N-LC(L)(75/60)000 54-TSOP 133/166 8K
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W364M72V-XSBX 512MB
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