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JM38510/50604BRA
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Texas Instruments
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High-Performance Impact PAL Circuits 20-CDIP -55 to 125 |
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M38510/50604BRA
|
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Texas Instruments
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High-Performance Impact PAL Circuits 20-CDIP -55 to 125 |
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54242-506041150LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 4 Positions, 2.54mm (0.100in) Pitch. |
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66506-049
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Amphenol Communications Solutions
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Quickie Header, Wire to Board Connector, 4 wall, Double Row, 10 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating. |
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66506-043LF
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Amphenol Communications Solutions
|
Quickie Header, Wire to Board Connector, 4 wall, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating. |
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66506-043
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Amphenol Communications Solutions
|
Quickie Header, Wire to Board Connector, 4 wall, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating. |
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