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77313-518-12LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 12 Positions |
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77313-518-10LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 10 Positions |
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77313-518-18LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 18 Positions |
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131-3518-11H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP. |
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77313-518-14LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 14 Positions |
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86093518114740TELF
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Amphenol Communications Solutions
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DIN Standard Receptacle, Vertical, Through Hole, Style C, 51 ways, Class III |
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