NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| PNX1700EH,557 | NXP Semiconductors | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other | 
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| PNX1700EH | NXP Semiconductors | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other |
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| PNX1700EH/G,557 | NXP Semiconductors | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other |
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| PNX1700EH/G | NXP Semiconductors | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, LEAD FREE, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other |
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| PNX1701EH,557 | NXP Semiconductors | IC SPECIALTY CONSUMER CIRCUIT, PBGA456, 27 X 27MM, 1.75 MM HEIGHT, PLASTIC, MS-034, SOT900-1, BGA-456, Consumer IC:Other |
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| Part | Manufacturer | Description | Type | Ordering |
| 27 mm potentiometers with metal shaft | N/A |
3 pages, |
Original | |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: 105.0 150°C MAX A' 27.00 18.6 21.00 MQFP 14Ã-20 2.7mm A 15.45 24.6 22.50 270.0 315.0 (322.6) SECTION A  A' 24.6 4.82 6.35 19.6 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) Tray 64-pin Plastic QFP (2.7mm thick) MAX. 66 Material 80-pin Plastic QFP (2.7mm thick) MAX. 66 Heat Proof Temp. 100-pin Plastic QFP (2.7mm thick) MAX. 66 Surface resistance MQFP 14 Ã- 20 2.7mm Carbon PPE 135°C 12 less than 1 Ã- 10 ... | Original |
1 pages, |
QFP JEDEC tray datasheet abstract |
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| Abstract: TRAY CONTAINER 105.0 150°C MAX A' 27.00 18.6 21.00 MQFP 14Ã-20 2.7mm A 15.45 24.6 22.50 270.0 315.0 (322.6) SECTION A  A' 24.6 Applied Package 4.82 6.35 19.6 7.62 135.9 UNIT : mm Quantity (pcs) MQFP 14 Ã- 20 2.7mm Tray Carbon PPE 64-pin Plastic QFP (2.7mm thick) MAX. 66 Material 80-pin Plastic QFP (2.7mm thick) MAX. 66 Heat Proof Temp. 135°C 100-pin Plastic QFP (2.7mm thick) MAX. 66 Surface ... | Original |
1 pages, |
QFP JEDEC tray datasheet abstract |
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| Abstract: DUTLINE DRAWING 27MM X 27MM, 256 BALLS, WITH 4 CSBGA â- 27MM PITCH 56-G6010-001 56-G6010-001 N/A ^ 1 of 1.06 TYP 2.97 , 05/01 ÃŒ9 Dallas Semiconductor MARKETING MDDULE DUTLINE DRAWING 27MM X 27MM, 256 BALLS, WITH 4 CSBGA , METALLIZED MARKINGS. 4, THE 27MM X 27MM SUBSTRATE IS CDMPRISED DF FDUR METAL LAYERS, I DOC. CONTROL, nSEBtEOrT nssworr TWM JFD 05/01 05/01 Dallas Semiconductor MARKETING MDDULE DUTLINE DRAWING 27MM X 27MM, 256 ... | OCR Scan |
3 pages, |
datasheet abstract |
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| Abstract: HEAT PROOF 150°C MAX 20.70 30.40 29 PPE ! A' 20.70 31.50 94.5 A MQFP 24Ã-24 2.7mm 135.9 UNIT : mm 29 273.6 315.0 (322.6) SECTION A  A' 29.0 4.62 6.35 7.62 23.5 Applied Package 160-pin Plastic QFP (Fine Pitch)(2.7mm thick) 176-pin Plastic QFP (Fine Pitch)(2.7mm thick) Quantity (pcs) MAX. 40 Tray Material Heat Proof Temp. Surface resistance MQFP 24 Ã- 24 2.7mm Carbon PPE 135°C 12 less than 1 Ã- 10 / The tolerance of tray's ... | Original |
1 pages, |
QFP JEDEC tray datasheet abstract |
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| Abstract: Unit : mm 335�0 23.5�5 288�5 27.5�1 18.8 A A' 137.5�5 180�0 21.25�5 32�1 NEC HEAT PROOF 24.8 TRAY TYPE NUMBER LA-2244A-1 LA-2244A-1 LA-1244A-1 LA-1244A-1 SECTION A � A' 24.8 5.45 5.8 8.8 19.7 Applied Package Quantity (pcs) Tray LA-2244A-1 LA-2244A-1 LA-1244A-1 LA-1244A-1 64pin Plastic QFP (2.7mm thick) MAX. 60 Material Carbon PP 80pin Plastic QFP (2.7mm thick) MAX. 60 Heat Proof Temp. 100pin Plastic QFP (2.7mm thick) MAX. 60 Surface resistance ... | Original |
1 pages, |
datasheet abstract |
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| Abstract: Unit : mm 335�0 23.5�5 288�5 27.5�1 137.5�5 180�0 21.25�5 32�1 A' 24 A NEC LA-3243A LA-3243A 24 HEAT PROOF 13.8 4.5 5.8 8.8 1.95 1.5 ... | Original |
1 pages, |
LA-3243A datasheet abstract |
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| Abstract: HEAT PROOF 23.4 A' 17.55 25.2 MQFP 20Ã-20 2.7mm A PPE 7 100.8 135.9 UNIT : mm 23.4 25.4 17.8 279.4 315 322.6 SECTION A  A' 23.4 3.92 6.35 7.62 19.55 Applied Package Quantity (pcs) 144-pin Plastic QFP (Fine Pitch)(2.7mm thick) MAX. 60 Tray Material Heat Proof Temp. Surface resistance MQFP 20Ã-20 2.7mm Carbon PPE 135°C 12 less than 1 Ã- 10 / The tolerance of tray's dimensions are based on JEDEC STANDARD. ... | Original |
1 pages, |
QFP JEDEC tray datasheet abstract |
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| Abstract: Unit : mm 335�0 20.5�5 294�5 27.5�1 PS 137.5�5 180�0 21.25�5 21�1 A A' 18.4 LA-0568A-1 LA-0568A-1 50癈 MAX. 18.4 SECTION A-A' 18.4 (5.8) 8.8 13.9 5.45 Applied Package Quantity (pcs) 64-pin稰lastic QFP (2.55mm, 2.7mm thick) 80-pin稰lastic QFP (2.7mm thick) MAX. 90 LA-0568A-1 LA-0568A-1 Material 52-pin稰lastic QFP (2.7mm thick) Tray Carbon PS Heat Proof Temp. 50癈 Surface resistance less than 1 � 106/ ... | Original |
1 pages, |
la-0568a-1 datasheet abstract |
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| Abstract: TRAY CONTAINER Unit : mm 335�0 23.5�5 288�5 27.5�1 PPE 137.5�5 A' 19.4 A LA-3569A-1 LA-3569A-1 135癈 MAX 25.4 SECTION A-A' 25.4 5.45 (5.8) 19.6 8.8 180�0 21.25�5 32�1 Applied Package Quantity (pcs) Tray LA-3569A-1 LA-3569A-1 Carbon PPE 64-pin稰lastic QFP (2.55mm, 2.7mm thick) MAX. 60 Material 80-pin稰lastic QFP (2.55mm, 2.7mm thick) MAX. 60 Heat Proof Temp. 135癈 100-pin稰lastic QFP (2.55mm, 2.7mm thick) MAX. 60 Surface resistance less ... | Original |
1 pages, |
LA-3569A-1 datasheet abstract |
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| Abstract: TRAY CONTAINER Unit : mm 335�0 20.5�5 294�5 27.5�1 PS 137.5�5 180�0 21.25�5 21�1 A A' 18.4 LA-0568A-1 LA-0568A-1 50癈 MAX. 18.4 SECTION A-A' 18.4 (5.8) 8.8 13.9 5.45 Applied Package Quantity (pcs) 64-pin稰lastic QFP (2.55mm, 2.7mm thick) 80-pin稰lastic QFP (2.7mm thick) MAX. 90 LA-0568A-1 LA-0568A-1 Material 52-pin稰lastic QFP (2.7mm thick) Tray Carbon PS Heat Proof Temp. 50癈 Surface resistance less than 1 � 106/ SSD-A-H6203-2 SSD-A-H6203-2 NEC ... | Original |
1 pages, |
SSD-A-H6203-2 LA-0568A-1 datasheet abstract |
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| Abstract: Product catalogue | Installation Products | Markings | Device markers | MultiCard | SwitchMark | Blank General ordering data Order No. Part designation Version EAN Qty. 1699860000 SM 27/18 NEUTRAL WS Device markers, Length: 18 mm, Width: 27 mm, Polyamide 66, white 4008190892302 80 pc(s). Markings Cadmium Can be labelled with thermal transfer printers Can be printed with plotter Can be written with dot-matrix printer Can be written with laser printer Function Halogen He ... | Original |
3 pages, |
SM marking code marking code SM diode 1699840000 1079520000 marking sm datasheet abstract |
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| Abstract: Product catalogue | Installation Products | Markings | Device markers | MultiCard | SwitchMark | Blank General ordering data Order No. Part designation Version EAN Qty. 1699820000 SM 27/8 NEUTRAL WS Device markers, Length: 8 mm, Width: 27 mm, Polyamide 66, white 4008190892265 80 pc(s). Markings Cadmium Can be labelled with thermal transfer printers Can be printed with plotter Can be written with dot-matrix printer Can be written with laser printer Function Halogen Heig ... | Original |
3 pages, |
marking code SM diode marking sm datasheet abstract |
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| Abstract: Product catalogue | Installation Products | Markings | Device markers | MultiCard | SwitchMark | Blank General ordering data Order No. Part designation Version EAN Qty. 1699840000 SM 27/12.5 NEUTRAL WS Device markers, Length: 12.5 mm, Width: 27 mm, Polyamide 66, white 4008190892289 80 pc(s). Markings Cadmium Can be labelled with thermal transfer printers Can be printed with plotter Can be written with dot-matrix printer Can be written with laser printer Function Halogen ... | Original |
3 pages, |
marking sm marking code SM diode datasheet abstract |
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| Abstract: Product catalogue | Installation Products | Markings | Device markers | MultiCard | SwitchMark | Blank General ordering data Order No. Part designation Version EAN Qty. 1131860000 SM 27/12.5 MC NE GE Device markers, MultiCard, 12.5 x 27 mm, Polyamide 66, yellow 4032248912421 80 pc(s). Dimensions Length Width Height 12.5 mm 27 mm 0.8 mm Markings Cadmium Can be labelled with thermal transfer printers Can be printed with plotter Can be written with dot-matrix print ... | Original |
2 pages, |
marking sm marking code SM diode datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| National Semiconductor, The Sight And Sound Of Information, Welcomes You Package Name Package Codes Metal Leaded Chip Carrier, J Bend AA MQUAD AW, MO MicroSMD BP SIP CA, C Sidebrazed, Hermetic Dip (Metal Seal) DH, D, DA Leadless Chip Carrier (LCC) EA, E Leaded Hermetic Quad Package www.datasheetarchive.com/files/national/packageids.html |
National | 25/09/2003 | 14.45 Kb | HTML | packageids.html |
| New Package IDs Please enable Javascript in your browser. National Semiconductor Products Package Name Package Codes Metal Leaded Chip Carrier, J Bend AA MQUAD AW, MO MicroSMD BP SIP CA, C Sidebrazed, Hermetic Dip (Metal Seal) DH, D, DA Leadless Chip Carrier (LCC) www.datasheetarchive.com/files/national/htm/nsc00910.htm |
National | 01/11/2002 | 20.21 Kb | HTM | nsc00910.htm |
| New Package IDs Please enable Javascript in your browser. National Semiconductor Products Package Name Package Codes Metal Leaded Chip Carrier, J Bend AA MQUAD AW, MO MicroSMD BP SIP CA, C Sidebrazed, Hermetic Dip (Metal Seal) DH, D, DA Leadless Chip Carrier (LCC) EA, E www.datasheetarchive.com/files/national/htm/nsc02383-v3.htm |
National | 16/08/2002 | 19.15 Kb | HTM | nsc02383-v3.htm |
| New Package IDs Please enable Javascript in your browser. Package Name Package Codes Metal Leaded Chip Carrier, J Bend AA MQUAD AW, MO MicroSMD BP SIP CA, C Sidebrazed, Hermetic Dip (Metal Seal) DH, D, DA Leadless Chip Carrier (LCC) EA, E Leaded Hermetic Quad Pac www.datasheetarchive.com/files/national/htm/nsc03087.htm |
National | 28/06/2001 | 18.72 Kb | HTM | nsc03087.htm |
| Please enable Javascript in your browser. New Package IDs Design Purchasing Quality Company Jobs Package Name Package Codes Metal Leaded Chip Carrier, J Bend AA MQUAD AW, MO MicroSMD BP SIP CA, C Sidebrazed, Herme www.datasheetarchive.com/files/national/htm/nsc01986-v2.htm |
National | 14/09/2000 | 18.84 Kb | HTM | nsc01986-v2.htm |
| Flat Cables (Pitch 0.635mm / 1.00mm / 1.27mm and up to 100 conductors) Full Data Sheet ) 1.27mm Pitch (50 MIL) OKIFLEX-B Type (300V, 105°C) 1.27 ) 1.27mm Pitch (50 MIL) OKIFLEX-FS Type (shielded, 150V, 60°C) 1.27mm Pitch (50 MIL) OKIFLEX-S Type (Bonded-Unbonded, 300V, 105°C) Flex Series Round Cables (Pitch 0.635mm / 1.27mm and up to 100 conductors) Full www.datasheetarchive.com/files/yamaichi/cc/cables/c_main.htm |
Yamaichi | 15/10/1998 | 8.65 Kb | HTM | c_main.htm |
| Title: 1.27mm High Density FLEX (300V, 105°C .27mm pitch flat cable with 28AWG 28AWG 28AWG 28AWG (7/0.127mm) conductors www.datasheetarchive.com/files/yamaichi/cables/cables/spec/d05-dk-10.htm |
Yamaichi | 02/07/2001 | 11.98 Kb | HTM | d05-dk-10.htm |
| Voltage) = 1.8V V DDQ (Operating Supply Voltage for I/O) = 2.5 or 3.3V n 272 BALL, 27mm x 27mm, CAVITY-UP BGA Figure 1. Package 272 PBGA 27mm x 27mm 1.27mm ball pitch M7010 M7010 M7010 M7010 2 the symbol for BGA packages and "A" denotes 1.27mm ball pitch For a list of available options (e Million Searches per Second -066 = 66 Million Searches per Second Package PBGA = 272-count, 27mm x 27mm (1) , 1.27mm ball pitch Temperature Range 1 = 0 to 70 5C Shipping Optio n Tape www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7561.htm |
STMicroelectronics | 31/01/2001 | 9.36 Kb | HTM | 7561.htm |
| Voltage) = 1.8V V DDQ (Operating Supply Voltage for I/O) = 2.5 or 3.3V n 272 BALL, 27mm x 27mm, CAVITY-UP BGA Figure 1. Package 272 PBGA 27mm x 27mm 1.27mm ball pitch M7020 M7020 M7020 M7020 2 the symbol for BGA packages and "A" denotes 1.27mm ball pitch For a list of available options (e Searches per Second -050 = 50 Million Searches per Second Package PBGA = 272-count, 27mm x 27mm (1) , 1.27mm ball pitch Temperature Range 1 = 0 to 70 5C Shipping Optio n Tape & Reel Packing = T www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7562.htm |
STMicroelectronics | 31/01/2001 | 9.35 Kb | HTM | 7562.htm |
| Details 1.27mm High Density Flex (300V, 105°) 2 to 64 Technical Details 50MIL 50MIL 50MIL 50MIL (1.27mm) OKIFLEX-TP Type (150V, 80° C) 10 to 64 Technical Details 50MIL 50MIL 50MIL 50MIL (1.27mm 50MIL 50MIL 50MIL 50MIL (1.27mm) OKIFLEX-S Type (300V, 105° C) 10 to 64 Technical 50MIL 50MIL 50MIL 50MIL (1.27mm) OKIFLEX-SFX Type (150V, 80° C) 8 to 64 Technical www.datasheetarchive.com/files/yamaichi/cables/cables_serie.htm |
Yamaichi | 28/10/2003 | 15.01 Kb | HTM | cables_serie.htm |