NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| TMS320TCI11027X27 | Texas Instruments | HARDWARE ACCELERATOR | 
|
|
|
| TMS320TCI110-27X27MM | Texas Instruments | HARDWARE ACCELERATOR |
|
|
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: Plastic Packages for Integrated Circuits Package Outline Drawing V676.27x27 676 Plastic ball Grid Array Rev 0, 1/11 1 ... | Original |
1 pages, |
v676 27x27 datasheet abstract |
|
|||
| Abstract: for signal processing of varying precisions- for example, 9x9, 18x18, 27x27, and 18x36-in a sum or , power consumption. High-Precision Mode + + - Output Register X 27x27 Accumulator , to support FFT bit growth. · Cascade four variable-precision DSP blocks, to create 27x27 complex , 27x27 multiply mode Variable-precision multiplier size: 27x27, 18x36, or (dual) 18x18 ... | Original |
2 pages, |
precision datasheet abstract |
|
|||
| Abstract: 416 PIN TEPBGA Daisy Chain 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 A B C Looking through Package D E * 1.0 mm Pitch * 26x26 Array (4 Row Perim) * 64 Thermal Balls * 27x27 mm Body Size * 0.5 mm Package Pad * 0.6 mm Solder Ball Diam. F G H J K L M N = BGA Package Trace P R T U V W Y AA AB AC AD AE AF Note , * 27x27 mm Body Size * 0.5 mm Package Pad * 0.6 mm Solder Ball Diam. F G Common H Center ... | Original |
2 pages, |
Balls 27x27 datasheet abstract |
|
|||
| Abstract: PN2024 Tel: +81-3-6744-7777 Min Footprint (mm) 19x19 19x19 27x27 27x27 27x27 27x27 27x27 27x27 Web: japan.xilinx.com Distributed RAM (Kb) 260 373 160 240 384 ... | Original |
4 pages, |
lvds vhdl DSP48A DSP48 spartan 6 27x27 DSP48 datasheet abstract |
|
|||
| Abstract: PEX8609 PEX8608 PEX8548 PEX8604 r2.0 PEX 8664 r2.0 PEX 8649 4 1 - 7.9 35x35 3 1 - 6.7 27x27 r2.0 - 3 1 - 3.7 27x27 - - 0 1 - 2.8 27x27 Yes - 4 1 - 8.8 35x35 Yes - 3 1 - 2.6 27x27 Yes - 4 1 , 2.6 27x27 r1.1 / 1.0a PEX 8516 16 4 275 - - - - Yes - 4 2 - 2.6 27x27 r1.1 / 1.0a PEX 8512 12 5 150 - - - - Yes ... | Original |
2 pages, |
PLX 8604 plx 8112 PEX 8613 package PEX 8649 OXPCIE958 pex 8112 PEX 8696 plx 8509 OxPCIe200 27X27 19X19 datasheet abstract |
|
|||
| Abstract: 23x23 mm 484 18 15 6 27x27 mm 416 17 14 5 27x27 mm 672 16 13 5 , 27x27 mm 272 20 17 6 388 16 13 3 35x35 mm fpSBGA 14 1156 35x35 mm , mm 1036 10 9 0.65 27x27 mm 256 15 12 0.65 31x31 mm 3203 13 10 , FPBGA 27x27 mm 672 15.2 12.8 11.0 7.0 3.2 LFECP/EC33 LFECP/EC33 FPBGA 23x23 mm 484 15.8 13.1 11.3 7.1 3.1 LFECP/EC33 LFECP/EC33 FPBGA 27x27 mm 672 14.0 11.8 10.1 ... | Original |
8 pages, |
FPBGA 36 pin, FCBGA 7x7mm 28X28 LFXP2-5E QFN PACKAGE thermal resistance Theta JB ssop 36 LFXP2-8E 132 PBGA 23X23 PBGA 324 19x19 SCM25 SCM15 Theta JB BGA 23X23 datasheet abstract |
|
|||
| Abstract: 6X10 8X8 27X27 15X15 15X15 8X15 11X17 11X17 CALL IRONWOOD FOR PACKAGE CODE PATTERN Lead Pitch 1.5mm , 6x6 5x5 10X10 10X10 6X6 35X35 35X35 15X15 15X15 16.26X17 26X17.78 15X16 15X16.5 16.26X17 26X17.78 27X27 18x10.8 18X10 18X10.5 19X19 19X19 , 19X19 19X19 14X22 14X22 14X22 14X22 14X22 14X22 14X22 14X22 14X19 14X19.5 27X27 23X23 23X23 20.95X24 95X24.70 15X15 15X15 15X15 15X15 15X15 15X15 19X19 19X19 12X12 12X12 , 2.26 2.13 0.9 8x8 25X25 25X25 21X21 21X21 19X19 19X19 20.95X24 95X24.07 21X21 21X21 27X27 27X27 13X13 13X13 27X27 19X19 19X19 12X12 12X12 12X12 12X12 13X13 13X13 10X10 10X10 11X11 11X11 32.33X32 33X32.33 10X10 10X10 35X35 35X35 29X29 29X29 14X22 14X22 15X15 15X15 21X21 21X21 27X27 ... | Original |
31 pages, |
BGA-1156 BGA bga 10x13 BGA328 BGA421 bga 484 0.8mm pitch BGA548 BGA553 55x165 lga 1156 BGA108A BGA160D1 BGA165 BGA441 0.65mm pitch BGA datasheet abstract |
|
|||
| Abstract: 256-PIN 256-PIN PLASTIC BGA (27x27) D B D1 ZE A E1 ZD 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 E YWV U T R P N M L K J H G F E D C B A INDEX MARK 4xC4.0 (UNIT:mm) ITEM D D1 A 30° A2 y1 S y A1 e S b x1 M S A B x2 M S DIMENSIONS 27.00±0.20 S 24.00 E E1 e 27.00±0.20 24.00 1.27 A A1 2.33±0.13 0.60±0.10 A2 b 1.73 0.75±0.15 x1 x2 0.30 0.15 y y1 0.15 0.35 ZD ... | Original |
1 pages, |
256-PIN 256-PIN abstract |
|
|||
| Abstract: 256-PIN 256-PIN PLASTIC BGA (27x27) D B D1 ZE A E1 ZD 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 E YWV U T R P N M L K J H G F E D C B A INDEX MARK 4xC4.0 (UNIT:mm) ITEM D DIMENSIONS 27.00±0.20 D1 A 30° A2 y1 S S y A1 e S b x1 M S A B x2 M S 24.00 E E1 e 27.00±0.20 24.00 1.27 A A1 2.33±0.13 0.60±0.10 A2 b 1.73 0.75±0.15 x1 0.30 x2 0.15 y y1 0.15 0.35 ZD ... | Original |
1 pages, |
256-PIN 256-PIN abstract |
|
|||
| Abstract: R Ceramic Column Grid Array (CG717 CG717) Package PK086 PK086 (v1.0) January 18, 2006 27X27-COLUMN CERAMIC CGA, 1.27MM PITCH (CG717 CG717) © 2006 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice. PK086 PK086 (v1.0) January 18, 2006 www.xilinx.com 1 Ceramic ... | Original |
2 pages, |
CG717 PK086 27X27-COLUMN CG717 abstract |
|
|||
| Abstract: Package Diagram Ball Grid Array Packages 256-Lead Ball Grid Array (27 x 27 x 2.33 mm) BG256 BG256 51-85097 1 ... | Original |
1 pages, |
BG256 BG256 abstract |
|
|||
| Abstract: Package Diagrams Ball Grid Array Packages 119-Lead FBGA (14 x 22 x 2.4 mm) BG119 BG119 51-85115 1 Package Diagrams 256-Lead Ball Grid Array (27 x 27 x 2.33 mm) BG256 BG256 51-85097 2 Package Diagrams 352-Lead Ball Grid Array (35 x 35 x 2.33 mm) BG352 BG352 51-85103 3 ... | Original |
3 pages, |
BG352 BG256 BG119 BG119 abstract |
|
|||
| Abstract: Hola1 H A H Heatsinks for PGAs and BGAs art. no. B ICK BGA 23 x 23 WLF . 23 x 23 art. no. C D ICK BGA 23 x 23 x 10 WLF . 23 x 23 art. no. E F ICK BGA 27 x 27 WLF . 27 x 27 art. no. G ICK BGA 27 x 27 x 10 WLF . 27 x 27 art. no. H I ICK BGA 31 x 31 WLF . 31 x 31 art. no. K ICK BGA 31 x 31 x 10 WLF . 31 x 31 L M H H H Thermal conduct. foil WLFT 404/405 Thermal conductive glue Thermal conductive paste Process ... | Original |
1 pages, |
Heatsinks datasheet abstract |
|
|||
| Abstract: Package Diagrams Ball Grid Array Packages 119-Lead PBGA (14 x 22 x 2.4 mm) BG119 BG119 51-85115-*A 1 Package Diagrams 209-Lead PBGA (14 x 22 x 2.20 mm) BG209 BG209 51-85143-*A 2 Package Diagrams 256-Lead PBGA (27 x 27 x 2.33 mm) BG256 BG256 51-85097-*A 3 Package Diagrams 272-Lead Ball Grid Array (27 x 27 x 2.33 mm) BG272 BG272 51-85130 4 Package Diagrams 388-Lead Ball Grid Array (35 x 35 x 2.33 mm) BG352 BG352 51-85103-*B 5 Package Diagrams 456-Lead Ball Grid A ... | Original |
7 pages, |
Package Diagrams BG352 BG256 BG-209 Diagrams BG119 BG119 abstract |
|
|||
| Abstract: Hola1 H A H Heatsinks for BGAs B C particularly suited for Ball Grid Arrays heatsink dimensions match the respective BGA-type can be glued directly on the BGA component D art. no. E ICK BGA 10 x 10 WLF . 10 x 10 art. no. F ICK BGA 10 x 10 x 10 WLF . 10 x 10 art. no. G H ICK BGA 14 x 14 WLF . 14 x 14 art. no. I K ICK BGA 14 x 14 x 10 WLF . 14 x 14 art. no. L ICK BGA 21 x 21 WLF . 21 x 21 M H H H Thermal ... | Original |
4 pages, |
WLFT 404 datasheet abstract |
|
|||
| Abstract: Dissipateurs pour BGA RW [K/W] 21 21 1,8 ICK BGA 21 x 21 WLF . 21 x 21 Heatsinks for BGA's 6 Kühlkörper für BGA's 25 20 15 10 5 0 0 1 2 3 4 5 6 RW [K/W] 23 23 1,8 ICK BGA 23 x 23 WLF . 23 x 23 6 V [m/s] 25 20 15 10 5 0 0 1 2 3 4 5 6 V [m/s] 10 RW 24 [K/W] 18 23 23 1,8 ICK BGA 23 x 23 x 10 WLF . 23 x 23 12 6 0 0 1 2 3 4 5 6 RW [K/W] 2 ... | Original |
1 pages, |
processeur Heatsinks datasheet abstract |
|
|||
| Abstract: Package Diagram L2 Ball Grid Arrays 256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256 BL256 51-85123-*E 1 Package Diagram 304-Lead L2 Ball Grid Array (31 x 31 x 1.57 mm) BL304 BL304 51-85154-*B 2 Package Diagram 504-Lead L2 Ball Grid Array (37.50 x 37.50 x 1.57 mm) BL504 BL504 51-85147-*B 3 ... | Original |
3 pages, |
BL304 BL256 BL256 abstract |
|
|||
| Abstract: rh 00.3 Z X Y 00.15 z © FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. MECHANICAL OUTLINE PRINT VERSIDN NDT TD SCALE TITLEl 356 TEPBGA, 27 X 27 PKG, 1.27 PITCH DDCUMENT Nth 98ARH98233A 98ARH98233A REVi A 22 AUG 2005 CASE NUMBER: 1279-01 STANDARD: NDN-JEDEC A DETAIL K ROTATED 90' CLOCKWISE © FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. MECHANICAL OUTLINE PRINT VERSIDN NDT TD SCALE TITLEl 356 TEPBGA, 27 X 27 PKG, 1.27 PITCH DDCUMENT Nth 98ARH98233A 98ARH98233A REVi A 22 AUG 2005 CASE NUMBER ... | OCR Scan |
3 pages, |
98ARH98233A 98ARH98233A abstract |
|
|||
| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
|||||
| 27x27 mm 256 balls www.datasheetarchive.com/files/stmicroelectronics/stonline/prodpres/dedicate/wireless/technolo/pbga.htm |
STMicroelectronics | 20/07/2000 | 7.9 Kb | HTM | pbga.htm |
| Packages SOT531-1 ; plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm SOT531-1 BGA316 BGA316 BGA316 BGA316 plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm 00-03-04 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot531-1-v2.html |
Philips | 05/02/2002 | 4.96 Kb | HTML | sot531-1-v2.html |
| Packages SOT471-1 ; plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 BGA256 BGA256 BGA256 BGA256 plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm 00-03-04 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot471-1-v2.html |
Philips | 05/02/2002 | 4.96 Kb | HTML | sot471-1-v2.html |
| Packages SOT602-1 ; plastic, heatsink ball grid array package; 256 balls; body 27 x 27 x 0.9 mm SOT602-1 HBGA256 HBGA256 HBGA256 HBGA256 plastic, heatsink ball grid array package; 256 balls; body 27 x 27 x 0.9 mm 00-03-04 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot602-1-v1.html |
Philips | 05/02/2002 | 4.98 Kb | HTML | sot602-1-v1.html |
| Packages SOT466-1 ; plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm SOT466-1 BGA256 BGA256 BGA256 BGA256 plastic ball grid array package; 256 balls; body 27 x 27 x 1.75 mm 00-03-04 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot466-1-v2.html |
Philips | 05/02/2002 | 4.96 Kb | HTML | sot466-1-v2.html |
| Packages SOT698-1 ; plastic ball grid array package; 272 balls; body 27 x 27 x 1.75 mm SOT698-1 BGA272 BGA272 BGA272 BGA272 plastic ball grid array package; 272 balls; body 27 x 27 x 1.75 mm 01-11-14 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot698-1-v1.html |
Philips | 05/02/2002 | 4.96 Kb | HTML | sot698-1-v1.html |
| Packages SOT579-1 ; plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 BGA272 BGA272 BGA272 BGA272 plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm 00-03-04 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot579-1-v1.html |
Philips | 05/02/2002 | 4.96 Kb | HTML | sot579-1-v1.html |
| Packages SOT648-1 ; plastic ball grid array package; 225 balls; body 27 x 27 x 1.55 mm SOT648-1 BGA225 BGA225 BGA225 BGA225 plastic ball grid array package; 225 balls; body 27 x 27 x 1.55 mm 00-09-21 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot648-1-v1.html |
Philips | 05/02/2002 | 4.96 Kb | HTML | sot648-1-v1.html |
| Packages SOT553-1 ; plastic, heatsink ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT553-1 HBGA292 HBGA292 HBGA292 HBGA292 plastic, heatsink ball grid array package; 292 balls; body 27 x 27 x 1.75 mm 00-03-04 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot553-1-v2.html |
Philips | 05/02/2002 | 4.98 Kb | HTML | sot553-1-v2.html |
| Packages SOT489-1 ; plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 BGA292 BGA292 BGA292 BGA292 plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm 00-03-04 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot489-1-v2.html |
Philips | 05/02/2002 | 4.96 Kb | HTML | sot489-1-v2.html |