NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| PSSI2021SAY T/R | NXP Semiconductors | Constant current source in SOT353 package; Description: Constant Current Source | 
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| DS1621SA7/T&R-W | Maxim Integrated Products | Digital Thermometer and Thermostat |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: INCORPORATED 5-39 Logic Products LD3.16/21S-A ... | OCR Scan |
7 pages, |
MPY016H MPY-16HJ LMU16PC LMU16GMB LMU16DC LD316 MPY16HJ 0GG1237 T-9S-07 LMU16/216 MPY016HJ Am29516 0GG1237 abstract |
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| Abstract: Hitachi Semiconductor Package DATA BOOK ADE 410-001A Introduction Thank you for using Hitachi's semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages for housing them. As we deal with the contradictory aims of enlarging chip sizes and making packages smaller, the concerted efforts of the entire company are focused on advances being made in development of ... | Original |
333 pages, |
DPAK-2 PACKAGE not gate ic 7404 tl 7400 PLCC18 14 pin ic 7404 datasheet IC AND GATE 7408 dpak DIODE ANODE COMMON MH 7404 12pin QFN LCC ic 7408 TO-3P Jedec package outline MSP 044 THERMISTOR ic 7404 datasheet datasheet abstract |
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| Abstract: Hitachi Semiconductor Package Data Book ADE�0�1C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi's semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages for housing them. As we deal with the contradictory aims of enlarging chip sizes and making packages smaller, the concerted efforts ... | Original |
545 pages, |
Enplas OTS-48 Enplas drawings Enplas ots-24 DATASHEET 33 1004 2204 3 fBGA package tray IC235-0442 IC free 74002 IC51-1604-845-2 IC51-0162-911 HLQFP 176 Package drawing 648-0482211-A01 fpq-144-0.5-03 YAMAICHI ic234 datasheet abstract |
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| Abstract: Hitachi Semiconductor Package Data Book ADE�0�1B 3rd Edition March/97 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi's semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher functional capacity and higher density and developing packages for housing them. As we deal with the contradictory aims of enlarging chip sizes and making packages smaller, the concerted efforts ... | Original |
461 pages, |
PT740 AB tesco rg 142 cable IC 7403 IC51-1004-809 IC51-0684-390-1 Enplas OTS-48 IC235-0442 fpq-144-0.5-03 7313 28 pin transistor fpq 630 IC 7418 KS 0302 IC51-2084-1052-11 datasheet abstract |
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| Abstract: Applications TO-21SAA PACKAGE T-33-/3 T-33-/3 EMITTER COLLECTOR BASE THE COLLECTOR IS IN ELECTRICAL CONTACT WITH ... | OCR Scan |
7 pages, |
TIPL762A TIPL762 100-C TIPL762 abstract |
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| Abstract: 20 30 lc, COLLECTOR CURRENT (Amps) Figure 21-Saturation Region J.I 0.15 02 03 05 07 10 1 6 20 30 50 ... | OCR Scan |
6 pages, |
1RF9533 2N6922A 2N6923 2N6923A 2N6926 2N6926A 2N6927A ALI 3101 C 2N6927 2N6922 Sprague extralytic 2N6922 abstract |
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| Abstract: High Performance 512K�256K� 5V CMOS Flash EEPROM AS29F400 AS29F400 � 512K�256K� CMOS Flash EEPROM Preliminary information Features � Organization: 512K�or 256K� � Sector architecture � Low power consumption - 35 mA maximum read current - 60 mA maximum program current - 1 礎 typical standby current (RESET = 0) - One 16K; two 8K; one 32K; and seven 64K byte sectors - Boot code sector architecture-T (top) or B (bottom) - Erase any combination of sectors or full chip � JEDEC standa ... | Original |
20 pages, |
HV Component Associates AN 5011 P 1702 eprom programmer MD 202 1702 eprom 29f400 8/256K AS29F400 8/256K abstract |
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| Abstract: 6259S 621-cp Script Windows are supported. Each feature is detailed in the sections below. 2.1.Same user ... | Original |
110 pages, |
1000H str w 6252 str 6252 STR 6253 str f 6238 STR 6256 STR 6264 str f 6264 str 6267 f str 6268 str F 6256 str 6229 STR 6262 STR W 6262 CB30SIM M3T-PD30SIM CB30SIM abstract |
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| Abstract: , Dump, and Script Windows are supported. Each feature is detailed in the sections below. 2.1.Same ... | Original |
110 pages, |
str f 6264 1000H str w 6252 str F 6256 str 6268 CIRCUIT DIAGRAM str 6267 f str f 6267 CB308SIM M3T-PD308SIM REJ10J0048-0100Z CB308SIM abstract |
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| Abstract: QUICK INDEX NEW IN THIS ISSUE! (Detailed Index - See Pages 3-24) AD9272 AD9272 Analog Front End, iMEMS® Accelerometers & Gyroscopes . . . . . . 782, 2583 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-528 Acceleration and Pressure Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . Page 2585 Active RF Product and Antennas . . . . . . . . . . . . 529-592 Rotary Position Sensor and SinglFuseTM Thin Film Chip Fuses . . . Pgs. 2000, 2071 Semiconductors ... | Original |
2704 pages, |
600va ups circuit diagrams ANA 618 20010 TV SHARP IC TDA 9381 PS 600va numeric ups circuit diagrams led clock circuit diagram at89s52 24pu circuit diagram wireless spy camera LG color tv Circuit Diagram tda 9370 schematic diagram atx Power supply 500w AD9272 AD9272 abstract |
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| Abstract: RB551V-30 RB551V-30 SILICON EPITAXIAL PLANAR SCHOTTKY BARRIER DIODE High-Frequency Rectification Switching Regulation Application Features · Small surface mounting type. · Ultra low VF. (VF=0.41V Typ. at 0.5A) · High reliability. PINNING DESCRIPTION PIN 1 Cathode 2 Anode 2 1 SA Top View Marking Code: "SA" Simplified outline SOD-323 and symbol Absolute Maximum Ratings (Tj = 25) Parameter Symbol Value Unit Peak Reverse Voltage VRM 30 V ... | Original |
3 pages, |
RB551V-30 SA marking on a SOD-323 diode marking code SA RB551V-30 abstract |
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| Abstract: RB551V-30 RB551V-30 SILICON EPITAXIAL PLANAR SCHOTTKY BARRIER DIODE Features · Small surface mounting type · Ultra low VF · High reliability PINNING DESCRIPTION PIN 1 Cathode 2 Anode 2 1 SA Applications · High frequency rectification switching regulation Absolute Maximum Ratings (Ta = 25 OC) Parameter Top View Marking Code: "SA" Simplified outline SOD-323 and symbol Symbol Value Unit Peak Reverse Voltage VRM 30 V DC Reverse Voltage VR ... | Original |
3 pages, |
SA marking on a SOD-323 diode RB551V-30 marking code SA MARKING SA transistor RB551V-30 abstract |
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| Abstract: RB551V-30 RB551V-30 SILICON EPITAXIAL PLANAR SCHOTTKY BARRIER DIODE High-Frequency Rectification Switching Regulation Application Features · Small surface mounting type. · Ultra low VF. (VF=0.41V Typ. at 0.5A) · High reliability. PINNING DESCRIPTION PIN 1 Cathode 2 Anode 2 1 SA Top View Marking Code: "SA" Simplified outline SOD-323 and symbol Absolute Maximum Ratings (Tj = 25) Parameter Symbol Value Unit Peak Reverse Voltage VRM 30 V ... | Original |
3 pages, |
Semtech SA RB551V-30 RB551V-30 abstract |
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| Abstract: RB551V-30 RB551V-30 SILICON EPITAXIAL PLANAR SCHOTTKY BARRIER DIODE Features · Small surface mounting type · Ultra low VF · High reliability PINNING DESCRIPTION PIN 1 Cathode 2 Anode 2 1 SA Applications · High frequency rectification switching regulation Absolute Maximum Ratings (Ta = 25 OC) Parameter Top View Marking Code: "SA" Simplified outline SOD-323 and symbol Symbol Value Unit Peak Reverse Voltage VRM 30 V DC Reverse Voltage VR ... | Original |
3 pages, |
Semtech SA RB551V-30 marking 724 diode MARKING SA transistor marking code SA marking sa RB551V-30 abstract |
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| Abstract: 4M x 64 SDRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPN4M64V-XBX WEDPN4M64V-XBX* Ideal for high performance processors and memory controllers (see other side for typical application block diagrams) s 58% space savings Compared to equivalvent TSOP solution Package 21 x 21mm, 219 Plastic Ball Grid Array (PBGA), 441mm2 Performance Features · SDRAM CAS Latency = 3 (125MHz), 2 (100MHz) or 3 (100MHz), 2 (75MHz) · Unbuffered · Fully synchronous; all signals regist ... | Original |
2 pages, |
WEDPN4M64V-XBX 9601 441M 3121 WEDPN4M64V-XBX abstract |
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| Abstract: PowerPCTM 755E/8Mbit SSRAM Multi-Chip Package Optimum Density and Performance in One Package WED3C755E8M-XBX WED3C755E8M-XBX Features · 300 or 350 MHz 755E Rev RISC uProcessor · 8 Mbit of Synchronous pipeline burst SRAM configured as 128Kx72 (L2 Cache) · Extended temperature modules 2.0V (Core)/3.3V (I/0) for industrial and military applications Performance Features · Core Frequency: 300 MHz, 350 MHz · L2 Cache Frequency: 150 MHz, 175 MHz · 60x Bus Frequency: 66 MHz Package · Mounted on a 25x ... | Original |
2 pages, |
with or without underfill WED3C755E8M-XBX WED3C7558M-XBX WED3C750A8M-200BX WED3C7410E16M-400BX WED3C755E8M-XBX abstract |
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| Abstract: sProduct Qfö Page 1 of 1 Piezo Audio Indicator-Range Mounting-Lead Wires KPE-350 KPE-350 Uftitaniit Tofecance:i&Smrn Features: Very dear sound Low cutrefrt consumption Flange mounting type lead wires type IfrnA) 16r 14 12 1D 8 6 4 Z 0 |»»«cSE^n^"'" -JlJ&Ã- LMJ Application : Medical equipment Instruments Automatic control system Gas alarm / Fire alarm Horns appliance Communication equipment Security system Etc. &PJ.{dB) 2 w at 30 cam iz: 3 G 8 12 16 18 21 SA 28 12 1S IB 21 24 28 (VDG ... | OCR Scan |
2 pages, |
U1007 KPE350H Kingstate 30028 KPE- KPE350 "Piezo Audio Indicator" KPE-350 KPE-350 abstract |
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| Abstract: BSS123LT1 BSS123LT1 Preferred Device Power MOSFET 170 mAmps, 100 Volts N-Channel SOT-23 Features · Pb-Free Packages are Available 170 mAMPS 100 VOLTS RDS(on) = 6 W N-Channel 3 MAXIMUM RATINGS Symbol Value Unit Drain-Source Voltage VDSS 100 Vdc Gate-Source Voltage - Continuous - Non-repetitive (tp 50 ms) VGS VGSM ± 20 ± 40 Vdc Vpk ID 0.17 0.68 Drain Current - Continuous (Note 1) - Pulsed (Note 2) 1 Adc IDM 2 MARKING DIAGRAM ... | Original |
3 pages, |
BSS123LT3G BSS123LT3 BSS123LT1 marking SA sot-23 BSS123LT1G sot-23 mosfet Marking SA s BSS123LT1 abstract |
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| Abstract: MOTOROLA EKBAS003 EKBAS003 SEMICONDUCTOR revsion 1.0 APPLICATION SNAPSHOT Interfacing MCM63F733A MCM63F733A Burst SRAM to the MPC555 MPC555 by Jeff Loeliger OVERVIEW This application snapshot describes how to interface burst SRAM to the MPC555 MPC555. The MCM63F733A MCM63F733A has been used as an example. DETAILED DESCRIPTION To obtain the highest possible performance from external SRAM, the MPC555 MPC555 can be configured to perform burst accesses. By configuring a chip select on the MPC555 MPC555, to indicate that the extern ... | Original |
4 pages, |
MPC555 MPC55 MCM63F733A EKBAS003 EKBAS003 abstract |
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| Abstract: BSS123LT1 BSS123LT1 Preferred Device Power MOSFET 170 mAmps, 100 Volts N-Channel SOT-23 http://onsemi.com Features · Pb-Free Packages are Available 170 mAMPS 100 VOLTS RDS(on) = 6 W N-Channel 3 MAXIMUM RATINGS Symbol Value Unit Drain-Source Voltage VDSS 100 Vdc Gate-Source Voltage - Continuous - Non-repetitive (tp 50 ms) VGS VGSM ± 20 ± 40 Vdc Vpk ID 0.17 0.68 Drain Current - Continuous (Note 1) - Pulsed (Note 2) 1 Adc IDM 2 ... | Original |
4 pages, |
BSS123LT3G BSS123LT3 BSS123LT1 BSS123LT1G BSS123LT1 abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| .3 10.2 SMCG7.5CA SMCG SM 1500 7.5 5 12.9 9.21 SA24C 7.5CA DO-215AA DO-215AA DO-215AA DO-215AA SM 600 7.5 5 12.9 9.21 SA8.0C DO www.datasheetarchive.com/files/microsemi/products/tvs/8_7.5-v1.htm |
Microsemi | 07/12/1999 | 69.13 Kb | HTM | 8_7.5-v1.htm |
| | Wirelist created using version 4.09. V 4.09 K 340474967200 LOCAL_IO DW LOCAL_IO SA DESIGN_NAME=ERASE SA USER_NAME=VIEWGEN SA SCH_PGM_NAME=L:\VIEWGEN.EXE SA SCH_PGM_VER=2.1 SA WIR_FILE_NAME=ERASE SA WIR_FILE_PATH=H:\PCI\FRESH\WIR\ERASE.1 SA WIR_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA WIR_FILE_TIME=23:03 SA SCH_FILE_NAME=ERASE SA SCH_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA SCH_FILE_TIME=23:51 SA SHEET=1 SA SCH_FILE_PATH=H:\PCI\FRESH\SCH\ERASE.1 AS xblox:BIDIR_IO FLOAT_VAL= AS xblox:BIDIR_IO BOUNDS= AS www.datasheetarchive.com/download/34359902-960688ZC/rev1e.zip (LOCAL_IO.2) |
Xilinx | 05/09/1996 | 307.31 Kb | ZIP | rev1e.zip |
| | Wirelist created using version 4.09. V 4.09 K 320406473700 PCI_IO DW PCI_IO SA DESIGN_NAME=ERASE SA USER_NAME=VIEWGEN SA SCH_PGM_NAME=L:\VIEWGEN.EXE SA SCH_PGM_VER=2.1 SA WIR_FILE_NAME=ERASE SA WIR_FILE_PATH=H:\PCI\FRESH\WIR\ERASE.1 SA WIR_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA WIR_FILE_TIME=23:03 SA SCH_FILE_NAME=ERASE SA SCH_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA SCH_FILE_TIME=23:51 SA SHEET=1 SA SCH_FILE_PATH=H:\PCI\FRESH\SCH\ERASE.1 AS xblox:BUS_IF32 LIBVER=2.0.0 AS xblox:BUS_IF32 LEVEL=MXILINX www.datasheetarchive.com/download/34359902-960688ZC/rev1e.zip (PCI_IO.2) |
Xilinx | 05/09/1996 | 307.31 Kb | ZIP | rev1e.zip |
| | Wirelist created using version 4.09. V 4.09 K 165364648400 TRANSLAT DW TRANSLAT SA SCH_FILE_PATH=H:\PCI\FRESH\SCH\ERASE.1 SA SHEET=1 SA SCH_FILE_TIME=23:51 SA SCH_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA SCH_FILE_NAME=ERASE SA WIR_FILE_TIME=23:03 SA WIR_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA WIR_FILE_PATH=H:\PCI\FRESH\WIR\ERASE.1 SA WIR_FILE_NAME=ERASE SA SCH_PGM_VER=2.1 SA SCH_PGM_NAME=L:\VIEWGEN.EXE SA USER_NAME=VIEWGEN SA DESIGN_NAME=ERASE AS xc3000:FDCE LIBVER=2.0.0 AS xc3000:FDCE @GRPULSE0=0 AS www.datasheetarchive.com/download/34359902-960688ZC/rev1e.zip (TRANSLAT.1) |
Xilinx | 05/09/1996 | 307.31 Kb | ZIP | rev1e.zip |
| | Wirelist created using version 4.09. V 4.09 K 409892393200 WE_REG DW WE_REG SA DESIGN_NAME=ERASE SA USER_NAME=VIEWGEN SA SCH_PGM_NAME=L:\VIEWGEN.EXE SA SCH_PGM_VER=2.1 SA WIR_FILE_NAME=ERASE SA WIR_FILE_PATH=H:\PCI\FRESH\WIR\ERASE.1 SA WIR_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA WIR_FILE_TIME=23:03 SA SCH_FILE_NAME=ERASE SA SCH_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA SCH_FILE_TIME=23:51 SA SHEET=1 SA SCH_FILE_PATH=H:\PCI\FRESH\SCH\ERASE.1 AS xc3000:OR3B1 DEVICE=OR AS xc3000:OR3B1 LEVEL=XILINX AS xc3 www.datasheetarchive.com/download/34359902-960688ZC/rev1e.zip (WE_REG.1) |
Xilinx | 05/09/1996 | 307.31 Kb | ZIP | rev1e.zip |
| | Wirelist created using version 4.09. V 4.09 K 340474967200 LOCAL_IO DW LOCAL_IO SA DESIGN_NAME=ERASE SA USER_NAME=VIEWGEN SA SCH_PGM_NAME=L:\VIEWGEN.EXE SA SCH_PGM_VER=2.1 SA WIR_FILE_NAME=ERASE SA WIR_FILE_PATH=H:\PCI\FRESH\WIR\ERASE.1 SA WIR_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA WIR_FILE_TIME=23:03 SA SCH_FILE_NAME=ERASE SA SCH_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA SCH_FILE_TIME=23:51 SA SHEET=1 SA SCH_FILE_PATH=H:\PCI\FRESH\SCH\ERASE.1 AS xblox:BIDIR_IO FLOAT_VAL= AS xblox:BIDIR_IO BOUNDS= AS www.datasheetarchive.com/download/91711962-987801ZC/wcd03266.zip (LOCAL_IO.2) |
Xilinx | 13/07/1998 | 307.31 Kb | ZIP | wcd03266.zip |
| | Wirelist created using version 4.09. V 4.09 K 320406473700 PCI_IO DW PCI_IO SA DESIGN_NAME=ERASE SA USER_NAME=VIEWGEN SA SCH_PGM_NAME=L:\VIEWGEN.EXE SA SCH_PGM_VER=2.1 SA WIR_FILE_NAME=ERASE SA WIR_FILE_PATH=H:\PCI\FRESH\WIR\ERASE.1 SA WIR_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA WIR_FILE_TIME=23:03 SA SCH_FILE_NAME=ERASE SA SCH_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA SCH_FILE_TIME=23:51 SA SHEET=1 SA SCH_FILE_PATH=H:\PCI\FRESH\SCH\ERASE.1 AS xblox:BUS_IF32 LIBVER=2.0.0 AS xblox:BUS_IF32 LEVEL=MXILINX www.datasheetarchive.com/download/91711962-987801ZC/wcd03266.zip (PCI_IO.2) |
Xilinx | 13/07/1998 | 307.31 Kb | ZIP | wcd03266.zip |
| | Wirelist created using version 4.09. V 4.09 K 165364648400 TRANSLAT DW TRANSLAT SA SCH_FILE_PATH=H:\PCI\FRESH\SCH\ERASE.1 SA SHEET=1 SA SCH_FILE_TIME=23:51 SA SCH_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA SCH_FILE_NAME=ERASE SA WIR_FILE_TIME=23:03 SA WIR_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA WIR_FILE_PATH=H:\PCI\FRESH\WIR\ERASE.1 SA WIR_FILE_NAME=ERASE SA SCH_PGM_VER=2.1 SA SCH_PGM_NAME=L:\VIEWGEN.EXE SA USER_NAME=VIEWGEN SA DESIGN_NAME=ERASE AS xc3000:FDCE LIBVER=2.0.0 AS xc3000:FDCE @GRPULSE0=0 AS www.datasheetarchive.com/download/91711962-987801ZC/wcd03266.zip (TRANSLAT.1) |
Xilinx | 13/07/1998 | 307.31 Kb | ZIP | wcd03266.zip |
| | Wirelist created using version 4.09. V 4.09 K 409892393200 WE_REG DW WE_REG SA DESIGN_NAME=ERASE SA USER_NAME=VIEWGEN SA SCH_PGM_NAME=L:\VIEWGEN.EXE SA SCH_PGM_VER=2.1 SA WIR_FILE_NAME=ERASE SA WIR_FILE_PATH=H:\PCI\FRESH\WIR\ERASE.1 SA WIR_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA WIR_FILE_TIME=23:03 SA SCH_FILE_NAME=ERASE SA SCH_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA SCH_FILE_TIME=23:51 SA SHEET=1 SA SCH_FILE_PATH=H:\PCI\FRESH\SCH\ERASE.1 AS xc3000:OR3B1 DEVICE=OR AS xc3000:OR3B1 LEVEL=XILINX AS xc3 www.datasheetarchive.com/download/91711962-987801ZC/wcd03266.zip (WE_REG.1) |
Xilinx | 13/07/1998 | 307.31 Kb | ZIP | wcd03266.zip |
| | Wirelist created using version 4.09. V 4.09 K 340474967200 LOCAL_IO DW LOCAL_IO SA DESIGN_NAME=ERASE SA USER_NAME=VIEWGEN SA SCH_PGM_NAME=L:\VIEWGEN.EXE SA SCH_PGM_VER=2.1 SA WIR_FILE_NAME=ERASE SA WIR_FILE_PATH=H:\PCI\FRESH\WIR\ERASE.1 SA WIR_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA WIR_FILE_TIME=23:03 SA SCH_FILE_NAME=ERASE SA SCH_FILE_DATE=16JAN95 16JAN95 16JAN95 16JAN95 SA SCH_FILE_TIME=23:51 SA SHEET=1 SA SCH_FILE_PATH=H:\PCI\FRESH\SCH\ERASE.1 AS xblox:BIDIR_IO FLOAT_VAL= AS xblox:BIDIR_IO BOUNDS= AS www.datasheetarchive.com/download/158555-989438ZC/wcd03cd3.zip (LOCAL_IO.2) |
Xilinx | 12/02/1999 | 307.31 Kb | ZIP | wcd03cd3.zip |