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Part Manufacturer Description Datasheet BUY
77052012A Intersil Corporation 8-CHANNEL, SGL ENDED MULTIPLEXER, CQCC20, CERAMIC, LCC-20 visit Intersil
TPS2012APWPRG4 Texas Instruments 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO14, PLASTIC, HTSSOP-14 visit Texas Instruments
TPS2012PWRG4 Texas Instruments IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO14, TSSOP-14, Power Management Circuit visit Texas Instruments
MSP430F2012TRSA Texas Instruments 16-BIT, FLASH, 16MHz, RISC MICROCONTROLLER, PQCC16, PLASTIC, QFN-16 visit Texas Instruments
LMP2012MM Texas Instruments DUAL OP-AMP, 60uV OFFSET-MAX, 3MHz BAND WIDTH, PDSO8, MSOP-8 visit Texas Instruments
LM20123MH/NOPB Texas Instruments 2.95-5.5V, 3A, Current Mode Synchronous Buck Regulator with Optional Automotive Grade 16-HTSSOP -40 to 125 visit Texas Instruments Buy

2012 footprint dimension

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: YNH00121 Fig. 4 Dimension of footprint www.yageo.com Dec. 3, 2012 V0 Product specification , FOOTPRINT DIMENSIONS 40 10 20 Unit : mm Fig. 3 Outlook and dimension of evaluation board , Specification â'" December 3, 2012 V.0 7020 Series Product specification High Frequency SMD Type , www.yageo.com Dec. 3, 2012 V0 Product specification High Frequency SMD Type Antenna 3 3 7020 , board DIMENSIONS Table 2 Machinical Dimension TYPE DIMENSION L (mm) 7.02 ±0.20 W (mm Yageo
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BT/802 CAN43 YNH00122 YNH00123

2220 footprint

Abstract: 1808 FOOTPRINT November 12, 2012 V.17 Product specification 2 2 Surface-Mount Ceramic Multilayer Capacitors , OUTLINES Table 3 Packing quantities for component size; see note 1 and Fig.1 For dimension see Table 3 , L1 L3 MBB211 0805 0805 Fig. 2 Surface mounted multilayer ceramic capacitor dimension NOTE 1. Refer to the selection charts in product data for specific values www.yageo.com Nov. 12, 2012 , 0612 array www.yageo.com Nov. 12, 2012 V.17 Product specification 4 4 Surface-Mount
Yageo
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2220 footprint 1808 FOOTPRINT YNM0015 C0603JR C0806

AN10896

Abstract: AN10896 Mounting and Soldering of RF transistors Rev. 2 - 13 Nov 2012 Application note , . 2012. All rights reserved. Application note Rev. 2 - 13 Nov 2012 2 of 49 NXP , subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Application note Rev. 2 - 13 Nov 2012 3 of 49 NXP Semiconductors AN10896 Mounting and Soldering of RF transistors 2 , , the copper dimension is 0.15 mm larger than the solder mask dimension. These values may vary depending
NXP Semiconductors
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mpxv7025dp

Abstract: GA18 Pressure Freescale Semiconductor Data Sheet: Technical Data MPXV7025 Rev 6, 10/2012 Integrated , MPXV7025DP MPVZ7025DP CASE 1351-01 © 2007-2009, 2012 Freescale Semiconductor, Inc. All rights reserved , FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self
Freescale Semiconductor
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GA18 MPVZ7025G6U MPXV7025GC6U MPXV7025GC6T1 MPXV7025GP MPXV7025G
Abstract: /11/2 mend Dimension By 0.5 to 1.0 Jaosn 2012/3/1 ALL A 4. Mechanical Specifications Initial Design Eddie 2012/3/9 4.1 Dimensions and Drawing Bottom Side B Top Bottom Side PCB Footprint NOTE: NOTE: 1. Solder mask. 1.Solder mask 2. Area to to be soldered 2.Area be soldered. 3.Clearance area 3. Clearance area. 4.Diemension of Ohm CPW dependent 4. Dimension , .15 Ceramic Clear 1 Top B Side 4.2 Antenna footprint PCB Footprint NOTE: 1 Taoglas
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1575MH SPE-11-8-137/C/SS 023MH 37/C/SS SP03AB15756-0030 SMA1575C
Abstract: November 2012 Application note Document information Info Content Keywords Over-Molded Plastic (OMP) packages, heat sink, footprint, surface mount, reflow soldering, component handling , . Rev. 1 â'" 6 November 2012 © NXP B.V. 2012. All rights reserved. 2 of 40 AN11183 NXP , exposed metal underneath the plastic over molded devices (or Cu base). "Footprint or solder land" is , to legal disclaimers. Rev. 1 â'" 6 November 2012 © NXP B.V. 2012. All rights reserved. 3 of NXP Semiconductors
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Abstract: Outlook and dimension of evaluation board Tol : ±0.1 Unit : mm Soldering Pads of Chip Antenna Footprint for Feeding Fig. 3 Details of soldering pad www.yageo.com Oct. 29, 2012 V0 Product , GHz PHYCOMP CTC CAN4311756152521K 12NC 431175615252 www.yageo.com Oct. 29, 2012 V0 , Table 2 Machinical Dimension DIMENSION L (mm) 10.00 ± 0.20 W (mm) 3.20 ± 0.20 T (mm , Point S2 (L) Soldering Point www.yageo.com Oct. 29, 2012 V0 Product specification Yageo
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ANT1003LL15R2455A

S71VS256RD0AHK3M

Abstract: D1 BALL COUNT Ib 0.25 0.30 MATRIX FOOTPRINT 0.35 6 DIMENSION "b" IS MEASURED , FOOTPRINT 14 MATRIX FOOTPRINT 6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A , S71VS_XS-R_00 Revision 17 Issue Date October 2, 2012 D at a S hee t Notice On Data Sheet , /XS-R Memory Subsystem Solutions S71VS_XS-R_00_17 October 2, 2012 S71VS/XS-R Memory Subsystem , _00 Revision 17 Issue Date October 2, 2012 D at a S hee t For detailed specifications, please refer
Spansion
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S71VS256RD0AHK3M
Abstract: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXA6115A Rev 7.2, 10/2012 , MPXA6115A Sensors Freescale Semiconductor, Inc. 5 MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for , mm Figure 5. SOP Footprint (Case 482) 0.050 1.27 TYP 0.150 3.81 0.387 9.83 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 6. SSOP Footprint (Case 1317 and 1317A) MPXA6115A 6 Sensors Freescale Semiconductor
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6115A MPXAZ6115A MPXH6115A MPXHZ6115A

TA0980A

Abstract: DCC 280 FOOTPRINT: G. PACKING: 1. REEL DIMENSION TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document , 3 E. OUTLINE DRAWING: 9 8 0 2011 2013 2015 2017 2012 2014 2016 2018 Date Code Table: TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 4 F. PCB FOOTPRINT: G. PACKING: 1. REEL DIMENSION TAI-SAW TECHNOLOGY CO., LTD. TST DCC Release document 5 2. TAPE DIMENSION 980 360 340 320 300 280 260 240 220 200 180 160 140 120
TAI-SAW Technology
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TA0980A DCC 280

MPXV7007

Abstract: Pressure Freescale Semiconductor Data Sheet: Technical Data MPXV7007 Rev 3, 10/2012 Integrated , circuitry or ground. Pin 1 is noted by the notch in the lead. © 2005, 2009, 2011, 2012 Freescale , Port Attached Side with Port Attached Side with Part Marking MINIMUM RECOMMENDED FOOTPRINT FOR , footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when
Freescale Semiconductor
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MPXV7007DP MPXV7007DPT1 MPXV7007GC6U MPXV7007GC6T1 MPXV7007GP MPXV7007G
Abstract: dimension of evaluation board Fig. 3 Dimension of footprint Unit: mm Tol: ±0.05 Fig. 4 Details of , Product Specification â'" March 5, 2013 V.0 2012 Series Product specification Wireless Components , , antenna type, working frequency and packing quantity. PART NUMBER ANT 2012 L L13 R 2400A (1) (2) (3) (4) (5) (6) ANT = Antenna (2) SIZE 2012= 2.0 ×1.2 mm (3) ANTENNA TYPE L,F,A = Chip , defined on Yageo evaluation board DIMENSIONS OUTLINES Table 2 Machinical Dimension DIMENSION L Yageo
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ANT2012LL13R2400A CAN4311714132454K
Abstract: Footprint Case and PCB Footprint Dimensions Dimension A B C D E F G H I J K L M N O K L , — SM3030-6 3.0 x 3.0 mm Nominal Footprint Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 , © 2012 by RF Monolithics, Inc. Page 1 of 5 SF2316E - 1/24/13 Frequency Characteristics: S21 , 600 16 10 162 0 1630 1640 MHz www.RFM.com E-mail: info@rfm.com © 2012 by RF , 0 260 0 MHz www.RFM.com E-mail: info@rfm.com © 2012 by RF Monolithics, Inc. Page 3 of RF Monolithics
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2002/95/EC
Abstract: Footprint Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 indicator A66, YWWS Standard Reel , registered trademarks of RF Monolithics, Inc. www.RFM.com E-mail: info@rfm.com © 2012 by RF Monolithics , © 2012 by RF Monolithics, Inc. Page 2 of 5 SF2098E - 12/20/12 Filter SWR Plots www.RFM.com E-mail: info@rfm.com © 2012 by RF Monolithics, Inc. Page 3 of 5 SF2098E - 12/20/12 SM3030-6 Case 6-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint Case and PCB Footprint RF Monolithics
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Abstract: Footprint Case Dimensions Dimension A B C D E H J K P Min 6.80 4.80 0.47 2.41 0.87 4.87 2.87 1.14 mm Nom , = 50 ohms SMP-03 7 x 5 mm Nominal Footprint RFM/SF2304B/YYWW Terminals 10 10, 1 5 All others , : info@rfm.com © 2012 by RF Monolithics, Inc. Filter Response Plots 20 Nov 2012 14:13:01 CH1 S21 LOG 10 , CENTER 175 . 000 000 MHz SPAN 50 . 000 000 MHz 20 Nov 2012 14:17:11 CH1 S21 LOG , © 2012 by RF Monolithics, Inc. Page 2 of 5 SF2304B - 12/19/12 20 Nov 2012 14:16:09 CH1 S21 LOG RF Monolithics
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IDT8N3PF10VA-159

Abstract: IDT8N3PF10VA-159I IDT8N3PF10VA-159I is a programmable LVPECL synthesizer that is "forward" footprint compatible with standard 5mm , of high clock frequency and low phase noise performance. Forward footprint compatibility means that a , fully compatible with a canned oscillator footprint - the canned oscillator will drop onto the 10-VFQFN footprint for second sourcing purposes. This capability provides designers with programability and lead time , . Features · · · · · · · · · Fourth Generation FemtoClock® NG technology Footprint compatible with 5mm x
Integrated Device Technology
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IDT8N3PF10VA-159 100MH 5625MH
Abstract: Surface-mount Case 5 x 7 mm Nominal Footprint Case Dimensions Dimension A B C D E H J K P Min 6.80 4.80 0.47 , -03 7 x 5 mm Nominal Footprint RFM/SF2304B/YYWW Terminals 10 5 All others Electrical Connection , : info@rfm.com © 2012 by RF Monolithics, Inc. Page 1 of 5 SF2304B - 11/28/12 Filter Response Plots 20 Nov 2012 14:13:01 CH1 S21 LOG 10 dB/ REF -.621 dB 1 : 0 . 0000 dB 0 . 000 000 MHz SF2304B_new -1 , 20 Nov 2012 14:17:11 CH1 S21 LOG 10 dB/ REF 20 dB 1 : 0 . 0000 dB 0 . 000 000 MHz SF2304B_new 3 RF Monolithics
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Abstract: Freescale Semiconductor Document Number: MPXA6115A Rev 7.1, 05/2012 Data Sheet: Technical , . 5 MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the , 16.76 0.060 TYP 8X 1.52 0.300 7.62 inch mm 0.100 TYP 8X 2.54 Figure 5. SOP Footprint , inch mm Figure 6. SSOP Footprint (Case 1317 and 1317A) MPXA6115A 6 Sensors Freescale Freescale Semiconductor
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Abstract: footprint, these LEDs are ideal for smaller equipment and miniature application. Dimension: Units: mm , . 8 Solder Profile & Footprint , - Solder Profile & Footprint -Recommended tin solder specifications: melting temperature in the , - Packing Reel Dimension: Unit: mm Tape Dimension: Unit: mm Arrangement of Tape , intensity Revision # V1.0 V1.1 V1.2 V1.3 V1.4 Revision Date 01/11/2012 01/12/2012 06/18/2012 QT-Brightek
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QBLP617 QBL617

MPXAZ6115A6U

Abstract: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXA6115A Rev 7.1, 05/2012 , , Inc. 5 MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the , 0.300 7.62 0.100 TYP 8X 2.54 inch mm Figure 5. SOP Footprint (Case 482) 0.050 1.27 TYP 0.150 3.81 0.387 9.83 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 6. SSOP Footprint (Case
Freescale Semiconductor
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MPXAZ6115A6U
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