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R7F7017114AFP-C#AA1
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Renesas Electronics Corporation
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High-end Automotive Microcontrollers Ideal for Body Applications |
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R7F7017114ABG-C
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Renesas Electronics Corporation
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High-end Automotive Microcontrollers Ideal for Body Applications |
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131-7114-21D
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate. |
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77317-114-08LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 8 Positions ,2.54mm (0.100in) Pitch, |
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131-7114-21H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 7-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, APP. |
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77317-114-06LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 6 Positions ,2.54mm (0.100in) Pitch, |
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