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54121-109031550LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch. |
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54121-109101550LF
|
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch. |
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54121-109041550LF
|
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Single Row, 4 Positions |
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5962-8515501RA
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Texas Instruments
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High-Performance Impact PAL Circuits 20-CDIP -55 to 125 |
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5962-8515505RA
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Texas Instruments
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Low-Power High-Performance Impact PAL Circuits 20-CDIP -55 to 125 |
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8415501RA
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Texas Instruments
|
Octal Buffers And Line Drivers With 3-State Outputs 20-CDIP -55 to 125 |
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