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Part Manufacturer Description Datasheet BUY
SM34020APCM40 Texas Instruments SM34020APCM40 144-QFP visit Texas Instruments
TMS320C32PCM60 Texas Instruments Digital Signal Processor 144-QFP visit Texas Instruments
TMS320C32PCM50 Texas Instruments Digital Signal Processor 144-QFP visit Texas Instruments
TMS320C32PCMA40 Texas Instruments Digital Signal Processor 144-QFP visit Texas Instruments
TMS34020APCM40 Texas Instruments Graphics Processors 144-QFP visit Texas Instruments
TMS320C32PCM40 Texas Instruments Digital Signal Processor 144-QFP visit Texas Instruments

144 QFP body size

Catalog Datasheet MFG & Type PDF Document Tags

HG62G

Abstract: HG51BS -208 QFP-256 QFP-296 L-BGA-352 () : Available signal pins O Underdevelopment A In planning Body size 28 mmn , = 2mm 969 A S IC s HG62G Series Package Lineup Body size> (mm) - 10x10 14x 14 80 100 136 144 , -80/100/120, PLCC-44/68/84, LQFP-144/176, · 8 bit DAC'3 -10 bit ADC*3 , , Standard load) QFP-100/136/168/208/256*2/296' 2, TQFP-100/120, LQFP-144/176 Shift scan method for user , planning Body size 28 mmG 28 mmG 28 mmD 32m m ° - 052 52 39 3 192 Lead pitch 0.65 mm 0.5 mm 0.4 mm 0.4
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OCR Scan
HG51BS HG71C HG62S HG71G HG51B QFP-296 HQ51CS HG51D CRAM03A TQFP-80/100/120 QFP-64/80/100/136/168/208/256/296

S1L50552

Abstract: tcon mini-lvds department for the latest information Body Size (mm) VFBGA10H-144 0.8 12 X 12Row Full 10 X 10 1.0 Ball Array Full WCSP Pin Count Body Size (mm) Thickness Max. WCSP , Mold Shape Lead Pitch (mm) Lead Type Body Size (mm) Thickness Max. Pin Count , (mm) Lead Type Body Size (mm) Thickness Max. 24 QFN4-24 0.5 STD 4 X4 1.0 , Mold Shape Ball Pitch (mm) Body Size (mm) Thickness Max. 256 PBGA1UE-256 1.0
Seiko Epson
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S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson S1L50062 S1L60173F00A000

IC51-0484-806

Abstract: IC51-1284-1788 44 44 44 44 48 48 Body Size Pitch 5x5 0.5 7x7 0.8 7x7 0.8 10 x 10 0.8 10 x 10 0.8 , 0.8 0.5 0.5 0.7 0.65 0.65 Quad Flat Packages Body Size 12 x 12 14 x 14 14 x 14 10 X , 256 256 272 304 304 Body Size 14 x 20 14 x 20 22 x 22 20 x 20 14 x 14 28 x 28 28 x 28 , QFP, PQFP, TQFP (Clamshell) IC51 Series IC51- 064 4- 038 Insulation Resistance , 15.8 16.5 8.2 14.0 Size (Max) Notes 6.2 Floating Base 8.4 8.4 11.3 11.5 11.7 12.0
Yamaichi Electronics
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IC51-0324-1498 IC51-0484-806 IC51-1284-1788 IC51-1764-1505-5 IC51-1284-1433 IC51-1844-1148 IC51-0324-805 IC51-0324-354 QFP11T044-001 IC51-0444-1195-3 IC51-0444-825

M60073

Abstract: M60084l current per Output Terminal Package Type QFP Lead Pitch Ö.8 0.85 0.5 0 .5 QFP(FP) 0 .5 0.5 0.5 Body Size , 0 .4 V ) Input Voltage Package Type Le a d Pitch imm) 0.5 0.5 Body Size (m m , Type Lead Pitch (mm) 0.8 0.65 QFP 0.8 0.65 0,65 0 .5 QFP(FP) 0.5 0.5 0.8 HQFP 0.5 Body Height (mm) 2.8 , Size fm m ?) ; Body I Height 1 (m m ) 14X 20 28X 28 28X 28 36X 36 14X 20 2.15 3.0 3.0 3.2 , Supply Voltage TTL level ' Body Size (m irr) 2 4 X 6 .3 56.4X17 10X 10 14X 14 14X 20 12X 12 Body H e iä t
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OCR Scan
M60073 M60084l M6008 4000 series CMOS Logic ICs "gate count" m60074 CMOS GATE ARRAYs mitsubishi 100P6S-C 80P6D-A I00P6O-A 12BP60-A 180P6E-A 209S8

fcBGA PACKAGE thermal resistance

Abstract: 409-ball Body Size (mm) 8×8×1.13 10×10×1.33 12×12×1.3 14×14×1.33 Ball Count 112 144 224 , -PIN 1.27mm : 8-PIN 16 8 6 7 CSOP (C-lead Small Outline Package) Body Size (mm) Pin Count , ) Body Size (mm) 8×18.4 10×18.4 12×18.4 12×12.4 14×18.4 12×12.4 Pin Count 40 , Quad Flat L-leaded Package) Body Size (mm) 14×14 16×16 20×20 24×24 28×28 7×7 , (Quad Flat-leaded Package) Body Size (mm) 28×28 32×32 Pin Count 256 296 Lead Pitch
Fujitsu
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fcBGA PACKAGE thermal resistance 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array FBGA PACKAGE thermal resistance csop

9S12XEQ384

Abstract: 9s12xeq384 144 QFP -bit, 8-ch. 24 50 112 LQFP 144 LQFP 80 QFP 9S12XEQ384 384 KB 24 KB 4 KB 1 1 Y 4 6 3 2 16-bit, 8-ch. 4-ch. 8-bit, 8-ch. 24 50 80 QFP 112 LQFP 144 , -ch. 8-bit, 8-ch. 24 50 80 QFP 112 LQFP 144 LQFP 9S12XEG128 128 KB 12 KB 2 KB 1 , existing advantages of 16-bit architecture, such as cost effectiveness, code size efficiency and , costs for automotive body and multiplexing applications. Debugger Interface Peripherals Memory
Freescale Semiconductor
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S12XE 9s12xeq384 144 QFP 9S12XEP100 9S12XET256 9S12XEQ512 9S12XEP768 mc9s12 S12XD S12XCPU S12XEFSSTAND

IC51-1844-1148

Abstract: IC51-128 44 44 44 44 44 44 44 48 48 Body Size Pitch 5x5 0.5 7x7 0.8 7x7 0.8 10 x 10 0.8 10 x 10 0.8 10 x 10 , 100 100 100 Body Size 12 x 12 14 x 14 14 x 14 10 X 10 10 X 10 10 X 14 16 X 20 10 X 10 14 X 14 14 X 14 , 208 240 240 240 256 256 256 256 256 272 304 304 Body Size 14 x 20 14 x 20 22 x 22 20 x 20 14 x 14 28 x , QFP, PQFP, TQFP (Clamshell) IC51 Series IC51- 064 4- 038 Socket Series No. of Leads No. of , Size (Max) Notes 6.2 Floating Base 8.4 8.4 11.3 11.5 11.7 12.0 IC248-0444-001 12.9 15.8 16.5 8.2
Yamaichi Electronics
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IC51-128 ic51-0804-795 IC201 IC51-1964-1952 IC51-1014 IC51-0804-711 IC51-467-KS11247 IC51-0444-798 IC51-0444-615 IC51-621-KS8966 IC51-0484-081 IC51-0484-630

QFP 128 lead .5mm

Abstract: csp192 ASIC Package ASIC Packages UQFP 0.4mm lead pitch series Body Size (mm) 7 7 10 10 , DEVELOPMENT SQFP 0.65mm lead pitch series Body Size (mm) 10 10 12 12 14 14 14 20 20 20 , pitch series Body Size (mm) 7 7 10 10 14 14 14 20 28 28 Lead Counts 32 44 64 80 120 Body Thickness (mm) 1.45 2.15 2.7 2.15 / 2.7 3.3 QFP 11 CSP (FBGA) 0.5mm lead pitch series Body Size (mm) 5 5 6 6 7 7 8 8 9 9 Ball
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12P4M QFP 128 lead .5mm csp192 144 QFP body size 8P-10P qfp 0.4mm 15 ball CSP 14P6M 16P8M 11P3M 11P1M 12P2M

68HC908QT4A

Abstract: HCS08 i2C code example assembly 64-pin QFP (FU) FSICEKITAB32 50 64-pin QFP (FU) 40 C, V, M 64-pin QFP (FU), 52 , 15-CH, 8-bit 5.0 8.4 52 www.freescale.com FSICEKITASAZ 64-pin QFP (FU) Up to 52 , open-drain pins with 25 mA sink 44-pin QFP (FB), 42-pin SDIP (B) M68EM08BD48 www.freescale.com 32-pin LQFP (FA) FSICEKITEY 44-pin QFP (FB), 42-pin DIP (B) FSICEKITGPGT Dual 2-CH, IC , -pin LQFP (FA), 44-pin QFP (FB), 42-pin SDIP (B) 1K 2-CH, IC/OC or PWM 32 I2C, DDC12AB 6
Freescale Semiconductor
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68HC908QT2A 68HC908QT4A 68HC908QY2A 68HC908QY4A HCS08 i2C code example assembly M68HC908LB8 MCS12X interface temperature sensor hcs12 SG1006Q42005 Q4/2005 68HC908QT1A SG1006-6

QFP-112

Abstract: LQFP144 Name Package Code Body Size Pin Pitch HD64F7144/HD6437144 QFP-112 FP-112B 20.0 ×20.0 mm 0.65 mm HD64F7145/HD6437145 LQFP-144 FP-144F 20.0 ×20.0 mm 0.5 mm Body Size Pin Pitch (Correct) Model Name Package HD64F7144F50*/HD6437144F50* * HD64F7145F50 /HD6437145F50 * Code QFP-112 FP-112B 20.0 ×20.0 mm 0.65 mm LQFP-144 FP-144F 20.0 , (Package Code) * QFP-112 (FP-112B) * QFP-112 (FP-112B) * LQFP-144 (FP-144F) Flash memory
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SH7144 HD64F7145 HD6437144F50 HD6437145F50 QFP-112 LQFP144 qfp112 TN-SH7-397A/E HD64F7144 HD6437144 HD6437145

s1l50552

Abstract: encounter conformal equivalence check user guide Shape Lead Pitch (mm) Lead Type Material Body Size (mm) Thickness Max. Pin Count , 256 304 QFP10 0.5 S1 Cu 40 X 40 4.5 324 (Under development) Body Size , Material Body Size (mm) QFN4 0.5 STD Cu 4 X4 1.0 32 QFN5 0.5 STD Cu , 23 2.7 VFBGA Thickness Max. 24 Body Size (mm) 484 Pin Count Ball Pitch (mm) 388 QFN Mold Shape (Under development) Body Size Thickness (mm) Max. Pin
Seiko Epson
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encounter conformal equivalence check user guide circuit diagram of mini ips system RTC SL 5500 S1K-7 512M x 8 Bit NAND Flash Memory 1FW transistor S1L60843F00A000 ARM720T

SOP48

Abstract: SOP38 * : Under development Body size (mm) 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7 7X 7X1.4 14X20X2.7 , Count code 100 TQFP15 128 TQFP15 Body size (mm) 14X14X1 14X14X1 Lead type STD STD Plastic HQFP Pin , HQFP8 240 HQFP23* HQFP16* 304 HQFP10* Lead > Body size (tm ) type 10X10X1.4 STD 14X14X1.4 STD 14X20X2.7 , 32X32X3.4 S1 32X32X3.8 S1 40X40X3.8 S1 * : Underdevelopment Body size (mm) 300 300 300 300 300 400 600 600 , Shrink DIP Body size (mm) 400 750 Lead type - - 160 176 184 Plast c Skinn y DIP Pin Package
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OCR Scan
QFP13 SOP48 SOP38 CF RM sot89 epson QFP 216 14x14x2.7 45x45 mm bga QFP12 QFP15 QFP14 12X12X1 28X28X3

land pattern for TSOP 2 86 PIN

Abstract: land pattern for TSOP 2 54 pin , consisting of 208 leads with a package body size of 40 mm x 40 mm and a normal bending lead pitch of 0.65 mm , package body height of 1.2 mm or less, package body size of 7 mm x 7 mm and a lead pitch of 0.80 mm , Dimensions (Typical Example) Package Name Reference Dimensions Code Example QFP Package body size (mm) 1010, 1420 QFJ Package body size (square or rectangle) S115, R400 ZIP , TSOP(1) Outermost size (mm) 1014, 0820 TSOP(2) Package body width 0300, 0400 SOJ
OKI Electric Industry
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land pattern for TSOP 2 86 PIN land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin oki naming qfp 64 0.4 mm pitch land pattern TSOP 54 land pattern

xc912bc32

Abstract: XC68HC705B32 Body 160-Lead QFP FT 50 mil/1.27 mm Pitch 0.950 in x 0.950 in Body 144-Lead LQFP 132-Lead PQFP 112-Lead LQFP TH PV 120-Lead QFP/LQFP PV FC .5 mm Pitch 16 mm x 16 mm Body .5 mm Pitch 20 mm x 20 mm Body 100-Lead LQFP 80-Lead QFP/LQFP PU FU/PU .5 mm Pitch , 64-Lead QFP 52-Lead QFP 44-Lead QFP FU PB FB .65 mm Pitch 10 mm x 10 mm Body .8 mm Pitch 10 mm x 10 mm Body .8 mm Pitch 14 mm x 14 mm Body 32-/48-Lead QFP FA .8 mm/.5 mm
Motorola
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68HC05 68HC11 68HC12 68HC16 683XX xc912bc32 XC68HC705B32 motorola ZP fu 908gp32 MC68HC908jk3 SG186/D 68HC08

xc68hc912b32

Abstract: XC68HC908AZ60 mil/1.27 mm Pitch 0.950 in x 0.950 in Body 160-Lead QFP 144-Lead LQFP 132-Lead PQFP 120 , Options 132 PQFP(FC) 144 LQFP(PV) 132 PQFP(FC) 144 LQFP(PV) 120 QFP(TH) 160 QFP(FT) 160 QFP(FT) 160 QFP(FT , Frequency (MHz) 16, 20, 25 Temp. C,V,M Package Options 132 PQFP 144 LQFP 132 PQFP 144 LQFP 160 QFP Avail , Body .65 mm Pitch 28 mm x 28 mm Body .65 mm Pitch 20 mm x 20 mm Body 64-Lead QFP 52-Lead QFP 44-Lead QFP 32-Lead QFP FA .8 mm Pitch 7 mm x 7 mm Body FU .8 mm Pitch 14 mm x 14 mm Body
Motorola
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xc68hc912b32 XC68HC908AZ60 xcm916 xc68hc08az0 XC68HC705 XC68HC912B MMC2001 MMCEVB1200PV XMC2001 10-BIT

xc68hc912b32

Abstract: XC68HC908AZ60 /1.27 mm Pitch 0.750 in x 0.750 in Body 50 mil/1.27 mm Pitch 1.15 in x 1.15 in Body 160-Lead QFP FT 50 mil/1.27 mm Pitch 0.950 in x 0.950 in Body 144-Lead LQFP 132-Lead PQFP PV FC , 0.950 in Body (Nominal, w.o. Bumpers) .65 mm Pitch 28 mm x 28 mm Body 64-Lead QFP 52-Lead QFP 44-Lead QFP FU PB FB .65 mm Pitch 10 mm x 10 mm Body .8 mm Pitch 10 mm x 10 mm Body .8 mm Pitch 14 mm x 14 mm Body 112-Lead LQFP TH PV 120-Lead QFP/LQFP 32-Lead QFP FA
Motorola
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XC68HC908GP20 XCM916X1 motorola 68hc05 lead selector guide Motorola MC68HC05B16, 52 pin 68HRC908JL3 mc68ck16z4 68HC908GP20 68HC908GP M68ICS08GP20 KITMMEVS08GP20 KITMMDS08GP20

oki naming format

Abstract: PLCC DIMENTIONS of 208 leads with a package body size of 40mm x 40mm and a normal bending lead pitch of 0.65mm . 2 , DIP PGA SOP TSOPI TSOPII SOJ SSOP BGA SHP Note: Code example Package body size(mm) Package body size(square or rectangle) Maximum package mounting height Spacing between terminal rows Matrix size (cavity up or down) Inter-mount pad center distance Outermost size(mm) Package body width Package body width Package body width Package body/size (mm) Package body/size (mm) 1010, 1420 S115
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HQFP208-P-4040-0 DIP42-P-600-2 oki naming format PLCC DIMENTIONS oki marking 20 soj 0.65mm pitch BGA ED-7401-2 SOJ26/20-P-300-1

35 x 35 PBGA, 580 100 balls

Abstract: of BGA Staggered Pins package 100 0 7 x 7 10 x10 14 x 22 23 x 23 27 x 27 35 x 35 45 x 45 (mm) 40 x 40 Body size , classified into four types as shown in Table 1. Table 2 lists the available packages. Type Body Size , flexibility for designing Excellent electrical characteristics Body Size (mm) Pin Count Size of , system (system-ona-chip) emerge · Demand for combining multiple devices Pin Count Body Size (mm , record-breaking size reduction each time a new product is released. To kindle consumers' interest
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35 x 35 PBGA, 580 100 balls of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um

MC68SEC811E2FN

Abstract: xc68hc912b32 Body 160-Lead QFP FT 50 mil/1.27 mm Pitch 0.950 in x 0.950 in Body 144-Lead LQFP 132 , -Lead QFP 52-Lead QFP 44-Lead QFP FU PB FB .65 mm Pitch 10 mm x 10 mm Body .8 mm Pitch 10 mm x 10 mm Body .8 mm Pitch 14 mm x 14 mm Body 112-Lead LQFP TH PV 120-Lead QFP/LQFP 32-Lead QFP FA .8 mm Pitch 7 mm x 7 mm Body 28-Lead SOIC 20-Lead SOIC 16-Lead SOIC , mm Body 50 mil/1.27 mm Pitch 10.35 mm x 7.5 mm Body 80-Lead QFP/LQFP PU FU/PU .5 mm
Motorola
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MC68SEC811E2FN HC705B XC68HC908 XC68HC705JB3 68hc05 8 bit Dip 28 4 mhz motorola 68HC908JK1 68HC908JL/JK M68ICS08JL KITMMEVS08JL KITMMDS08JL MC68HC908JK1

d431000agw

Abstract: D75304GF c8 nS Minimum Data Set-Up and Data Hold Body Typical -Time EACH No. Fig. Leads Size* Pitch* c100 , . Stock Mfr.'s No. of Body Lead Nom. Critical Typical Fig. EACH No. Type Leads Size* Pitch* Height* Dim , 0.800 3.4 30.3 275.00 body chips and smaller size PLCC. Upper: 0.025" square pins, gold plated phosphor , AM29040, IDT 49C465 285.00 Stock Mfr.'s No. of Lower Body Top Typical 885-6551 6151 3 144 20 ¥20 0.500 , P o m o n a Electronics IC Test Clips Logic Scope Probe JEDEC PQFP Test Clips Pomona's JEDEC QFP
RS Components
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L1A9349 D75304GF d431000agw AIC6360Q Actel a1280 intel 80386dx HG62G027 486SXLC 80C186EC 80386SX XC4025-MQ240 5998AL-1 EPF81500
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