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Part Manufacturer Description Datasheet BUY
HD1-15530-8 Intersil Corporation DATACOM, MANCHESTER ENCODER/DECODER, CDIP24, CERDIP-24 visit Intersil
HFA1155IB96 Intersil Corporation OP-AMP, 10000uV OFFSET-MAX, PDSO8, PLASTIC, MS-012AA, SOIC-8 visit Intersil
HFA1155IB Intersil Corporation OP-AMP, 10000uV OFFSET-MAX, PDSO8, PLASTIC, MS-012AA, SOIC-8 visit Intersil
HFA1155IH96 Intersil Corporation 1 CHANNEL, VIDEO AMPLIFIER, PDSO5, PLASTIC, MO-178AA, SC-74A, SOT-23, 5 PIN visit Intersil
THS6022IGQE Texas Instruments DUAL LINE DRIVER, PBGA80, PLASTIC, LGA-80 visit Texas Instruments
THS6022CGQE Texas Instruments DUAL LINE DRIVER, PBGA80, PLASTIC, LGA-80 visit Texas Instruments

1155 lga socket

Catalog Datasheet MFG & Type PDF Document Tags

IT8728F

Abstract: LGA+1155+Socket+PIN+diagram in the LGA-1155 socket, Portwellâ'™s WADE-8012 Mini-ITX offers superior performance in a small , sec. to 255 min. Hardware Monitoring Intel® Coreâ"¢ i5/i7 Processor in LGA-1155 socket Chipset Storage Devices  - Intel® CoreTM i5/ i7 processor in LGA 1155 package - Support Intel , COM Ports and Eight USB Ports ITE IT8728F GPIO x16bit Four USB PCIE x16 slot LGA1155 socket , Signage. 1.60 0 3.43 71 Two SATA 600 ports Dual DDR3 non-ECC DIMM socket GENERAL ï
American Portwell Technology
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LGA+1155+Socket+PIN+diagram 1155 socket BD82Q67 RS232/422/485 RS232 AB1-3644 PGA1155 DB-15

LGA+1155+Socket+PIN+diagram

Abstract: 1155 lga socket 1 155 H2 1 © LGA TY Foxconn USE) S O C K E T OF 1155 SOCKET PART N O . , , R.O.C. T IT LE : FOR C U S TO M E R DRAWING LGA SOCKET DWG N°- : Mac Peng Ter ry , ASME Y 1 4 . 5 M - 1 9 9 4 . A MA TE RI AL :SOCKET BODY LCP , U L 9 4 V - 0 , BLACK ; CONTACT Cu N , L A C K ; SOLDERBALL LEAD FREE S n / A g / C u BALL ; A THIC KNESS OF SOCKET (FROM SE AT IN G , SOCKET NAME IS LOCATED APP ROXIMATELY. FOXCONN LOGO IS LOCATED APP RO XIMATELY. APPD . E C N . NO
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OCR Scan
1155 lga socket BC-11-0035559 BC-11-0054449

core i5 mtbf

Abstract: LGA 1155 PIN Package: Intel® Xeon and CoreTM i7/i5/i3 processor in LGA-1155 socket Chipset/Core Logic Intel® C206 System Memory Support Intel® Xeon® and CoreTM i7/i5/i3 processors in LGA 1155 package , ROBO-8110VG2AR Intel® Coreâ"¢ 2 Quad processor based PICMG 1.3 SHB with DDR3 SDRAM, VGA, Dual Gigabit Ethernet, Audio and USB PS/2 KB and Mouse HDMI port Dual 240-pin DDR3 DIMM socket COM1 , ports Dual USB ports Dual GbE ports DVI-I port (DVI-D+VGA) Two SATA 600 ports LGA1155 socket
American Portwell Technology
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core i5 mtbf LGA 1155 PIN intel core i7 processor mtbf RS-232 RS-232/422/485 10BASE-T/100BASE-TX/1000BASE-T RJ-45 SBC-ROBO-8110VG2AR

processor core i5 mtbf

Abstract: B6902890 digital signage applications. FEATURES  ® Support Intel Core i7/i5 processors in LGA 1155 , GPIO GENERAL - Intel® Core i7/i5 processor in LGA-1155 package Processor - DMI x4 Link , ROBO-8111VG2AR-Q77 Dual 240-pin DDR3 DIMM socket Intel® Core i7/i5 processor based on PICMG 1.3 SHB with DDR3 SDRAM, VGA, Dual Gigabit Ethernet, Audio and USB3.0 PS/2 KB and Mouse COM1 , (DVI-D+VGA) 71 3.43 0 1.60 +12V power connector LGA1155 socket ROBO-8111VG2AR-Q77 is based on
American Portwell Technology
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B6902890 processor core i5 mtbf intel i7 processor mtbf B6900270 B8981980 B3751500 B6902980 B6902230

WPCM450RA0BX

Abstract: WPCM450 Contact Us Advanced Search Reseller Resource Center Search SuperServer 5037MC-H8TRF Products Systems MicroCloud [ 5037MC-H8TRF] Key Features (per node) 1. Intel® Xeon® processor E3-1200 family; socket H2 (LGA 1155) 2. 2x 3.5" Hot-swap SATA3 (6 Gbps) 3. 1x (x8) PCI - E 2.0 low-profile slot 4. Up to 32GB DDR3 ECC UDIMM 1333/1066MHz Memory support; 2 channels 5. 2x Intel 82580DB GbE LAN ports , processors Socket H2 (LGA 1155) MBD -X9SCD -F * SYS-5037MC -H8TRF ( Black) Chassis Form Factor Model
Super Micro Computer
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CBL-0218L PWS-1K62P-1R SC938 WPCM450RA0BX WPCM450 lga 1155 socket intel i5 nuvoton TPM 1333/1066MH CSE-938H-R1620B SNK-P0047PS

LGA 1155 Socket PIN diagram

Abstract: LGA 1155 PIN diagram III Features LGA 1155 Intel® CoreTM i7/i5/i3/Xeon® processors Dual Channel (ECC) DDR3 1333 MHz up , Intel LGA 1155 Sandy Bridge Processors Channel B (ECC) DDR3 1066/1333 DVI TI SN75DP139R GZR , WG2 version Socket Two 240-pin DDR3 memory sockets Onboard Intel HD Graphics Graphics VRAM 1 GB , thermal reliability CPU Speed L3 Cache Support Model Socket Chipset BIOS Slot SBC & Passive Backplanes
Advantech
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PCE-5126 NCT6776F PCE-5126QG2-00A1E 1960047831N001 LGA 1155 Socket PIN diagram LGA 1155 PIN diagram core i7 2600 INTEL CORE I3 2120 Nuvoton nct6776f intel LGA 1155 PIN diagram Q67/B65/C206 1333MH PCE-5126QVG-00A1E

intel i7 processor mtbf

Abstract: ports Four SATA 300 ports VGA RS232 LGA 1155 socket 16 GPIO (8 in/8 out) Intel® Q67 LPC , Core i3/i5/i7 processor in LGA1155 socket Intel® XeonTM and CoreTM i3, i5 and i7 Processors
Portwell
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RUBY-D711VG2AR 82579LM 82574L

RUBY-D712VG2AR

Abstract: 24-pin power connector VGA RS232 LGA 1155 socket 16 GPIO (8 in/8 out) Intel® Q67 LPC , : Intel® CoreTM i3/i5/i7 processor in LGA1155 socket Watchdog Timer Intel® CoreTM i3, i5 and i7
Portwell
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RUBY-D712VG2AR

1155 lga socket

Abstract: DDR3 eccn Board Form Factor Socket Embedded Options Available Launched Q1'11 Mini- ITX LGA 1155 No No 95 W N /A
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DH61DL DDR3 eccn intel i5 2430 Dh61 612492 61-2492 DDR3-1333/1066 7-2630QM

socket lga 1156 pinout

Abstract: intel i5 MOTHERBOARD pcb CIRCUIT diagram LGA1156 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the , Mechanism (ILM) provides the force needed to seat the 1156-LGA land package onto the socket contacts. The , Series and LGA1156 Socket Thermal/Mechanical Specifications and Design Guidelines January 2011 , LGA1156 socket may contain design defects or errors known as errata which may cause the product to deviate , . 16 LGA1156 Socket
Intel
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socket lga 1156 pinout intel i5 MOTHERBOARD pcb CIRCUIT diagram i3 desktop MOTHERBOARD CIRCUIT diagram 115XLM LGA 1156 PIN OUT diagram LGA 1150 Socket PIN diagram E20847 E21320 E58389

socket lga 1155 pinout

Abstract: socket lga 1156 pinout force needed to seat the 1155-LGA land package onto the socket contacts. PCH Platform Controller , through this surface mount, 1155-land socket. PECI The Platform Environment Control Interface (PECI , Socket 3 LGA1155 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the processors. The socket provides I/O, power and ground contacts. The socket contains 1155 , Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket Thermal Mechanical
Intel
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socket lga 1155 pinout Intel socket 1156 PIN LAYOUT lga1155 land profile pattern lga1155 pinout pinout diagram for LGA1155 processor socket core lga1155 land CHSP60PC UL1439

LGA 1155 PIN diagram

Abstract: LGA 1155 pin out device is housed in a low profile 4x4 mm, 16-pin, flip-chip LGA or a 3x3 mm 16 pin QFN package , SEL 3 10 Q VTSEL C 4 9 VCC VTD0 5 Figure 1. BGA-16 and LGA-16 Pinout , 10) -40 °C Symbol 25°C 70°C(LGA)/85°C(QFN)* Min Characteristic Typ Max Min , 1065 775 1355 960 1560 1155 925 1445 1080 1640 1275 670 125 510 0 325 800 215 , socket or mounted on a printed circuit board and transverse airflow greater than 500 lfpm is maintained
ON Semiconductor
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FCLGA-16 LGA 1155 pin out 1155 lga socket pins LGA 775 Socket PIN diagram lga 1155 QFN tray qfn 4x4 LGA16 3x3 footprint NBSG86A FCBGA-16 NBSG86A/D

lga 1155

Abstract: 1155 lga socket in a low profile 4x4 mm 16-pin Flip-Chip LGA (FCLGA) or a 3x3 mm 16 pin QFN package. The NBSG53A is , Figure 1. BGA-16 and LGA-16 Pinout (Top View) 6 7 8 VTD D D VTD Figure 2. QFN , = 2.5 V; VEE = 0 V (Note 8) -40°C Symbol Characteristic 25°C 70°C(LGA)/85°C(QFN)* Min , 1510 1065 775 1355 960 1560 1155 925 1445 1080 1640 1275 670 125 510 0 325 800 , established when mounted in a test socket or printed circuit board with maintained transverse airflow greater
ON Semiconductor
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NBSG53AMA1TBG LGA-16 3x3 FCLG 04/LGA 1150 Socket PIN diagram lga 4x4 footprint AMERICAN POWER DEVICES NBSG53A/D

LGA 1150 Socket PIN diagram

Abstract: LGA 1155 Socket PIN diagram low profile 4x4 mm 16-pin Flip-Chip LGA (FCLGA) or a 3x3 mm 16 pin QFN package. The NBSG53A is a , . BGA-16 and LGA-16 Pinout (Top View) Table 1. Pin Description Pin BGA C2 C1 QFN 1 2 Name VTCLK CLK I/O , 1540 1130 Max 57 1590 895 1420 1050 1620 1250 70°C(LGA)/85°C(QFN)* Min 33 1515 625 1295 840 1510 1065 Typ 45 1565 775 1355 960 1560 1155 Max 57 1615 925 1445 1080 1640 1275 mV Unit mA mV mV VOUTPP , thermal equilibrium has been established when mounted in a test socket or printed circuit board with
ON Semiconductor
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16 pins qfn 3x3 footprint

LGA 1155 PIN diagram

Abstract: LGA 1150 Socket PIN diagram device is housed in a low profile 4x4 mm, 16-pin, flip-chip LGA or a 3x3 mm 16 pin QFN package , 4 9 VCC VTD0 5 Figure 1. BGA-16 and LGA-16 Pinout (Top View) 6 VTD1 D1 7 , 10) -40°C Symbol 25°C 70°C(LGA)/85°C(QFN)* Min Characteristic Typ Max Min , 1065 775 1355 960 1560 1155 925 1445 1080 1640 1275 670 125 510 0 325 800 215 , socket or mounted on a printed circuit board and transverse airflow greater than 500 lfpm is maintained
ON Semiconductor
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lga-16 4x4 IC 2030 PIN CONNECTIONS transistor tip 1050 germanium transistor ac 128 qfn 3x3 tray dimension germanium diode

lga 1155 socket

Abstract: LGA 1155 pin out VEE Figure 1. BGA-16 and LGA-16 Pinout (Top View) Figure 2. QFN-16 Pinout (Top View) Table 1 , 605 1035 VTHR + 75 VIH 2500 1080 1.2 725 1155 VCC 1000* VCC 1400* 1140 845 1275 VCC VTHR - 75 1200 2.5 , socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical , been established when mounted in a test socket or printed circuit board with maintained transverse , thermal equilibrium has been established when mounted in a test socket or printed circuit board with
ON Semiconductor
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NBSG16VS EP16VS 526AB NBSG16VS/D

LGA 1155 PIN diagram

Abstract: lga 4x4 footprint . BGA-16 and LGA-16 Pinout (Top View) 6 7 8 NC VCTRL VEE Figure 2. QFN-16 Pinout (Top , 1330 605 1035 725 1155 845 1275 600 1010 720 1130 840 1250 Output LOW , equilibrium has been established when mounted in a test socket or printed circuit board with maintained , specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit , after thermal equilibrium has been established when mounted in a test socket or printed circuit board
ON Semiconductor
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485G

LGA 1156 PIN OUT diagram

Abstract: QSJ-44403 SKINNY DIP TCP PGA SHRINK-DIP BGA/LGA CSP Figure 1.1.1 Packaging Trend 2 PACKAGE , Mounting Type Throughhole Mounting Type Custom Type Memory Module Socket Type SIMM DIMM , Carrier Package) AV-Z VA Custom design Memory Module Socket type YS BS DS YA YB YC YD , plastic LGA type package consisting of 48 leads with package body height of 1.2 mm or less, package body
OKI Electric Industry
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QSJ-44403 IC107-26035-20-G REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative marking 453 8p DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 DIP20-P-300-2 54-W1

1.27mm pitch zif socket 3M 21X21

Abstract: 1155 lga socket pins . We offer land sockets for BGA and QFP packages. Socket Receptacles "Socket receptacles" are parts , . Socket receptacles typically plug into one of our surface mount emulator feet, although we do offer some QFP socket receptacle parts (RE-QFE) that are mounted directly to the target system. PO Box 21151 , , LGA, PLCC, SOIC, QFP and through holes packages, closely mimics the actual SMT device, providing , . EMULATOR SUPPORT - MINI GRID EXTENDER - PGA MALE/MALE SOCKET PGA FEMALE EMULATOR HEAD IRONWOOD PGA
Ironwood Electronics
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1.27mm pitch zif socket 3M 21X21 PGA zif socket 289 17X17* BGA 289 amp bga 25x25 BGA169C TEXTOOL 15x15 pga MGA10/100A-

LGA 1155 Socket PIN diagram

Abstract: socket lga 1156 pinout processor socket type is noted as LGA 1156. The package is a 37.5 x 37.5 mm Flip Chip Land Grid Array (FCLGA , .74 Socket Pinmap (Top View, Upper-Left Quadrant) .76 Socket Pinmap (Top View, Upper-Right Quadrant) .77 Socket Pinmap (Top View, Lower-Left Quadrant) .78 Socket Pinmap (Top View, Lower-Right Quadrant
Intel
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Socket 1156 VID pinout LGA 1156 Socket diagram INTEL Core i5 760 INTEL Core i7 860 i7-870 Processor LGA 1156 PIN diagram
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