| Contextual Datasheet Results |
1 - 50 of about 206 for 106A |
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First line: R95-001 Hold Down Clip with following sockets R95-106A includes clip R95-107 R95-110 Abstract: .. Hold Down Clip For use with the following sockets: • R95−106A includes clip • R95−107 • R95−110 • R95−111 • R95−117 Clip not included • R95−120 • R95−121 • R95−122 • R95−148 • R95−149 • R95−150 .. datasheet abstract.. |
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First line: R95-105 11-Pin Heavy Duty Square Base Socket Features Panel / Surface Mount Pressure Clamp Abstract: .. R95−106A. 14−Pin Miniature Socket Features • Panel/Surface Mount • Pressure Clamp Screws • DPDT or 4PDT • Screws: 4−40 x 1/4” Steel, Nickel Plated • Hold down clip supplied with socket, also available .. datasheet abstract.. |
94.99 Kb |
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First line: CT-Concept Technology Ltd. 2SD106A channel driver IGBTs 1200V 106A ultra-compact dual SCALE Abstract: .. The 2SD 106A is an ultra-compact dual SCALE driver for IGBTs with blocking voltages up to 1200V. The two drive channels feature an electrical isolation between the control electronics and the .. datasheet abstract.. |
60.19 Kb |
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First line: GaAs Hall Element HG-106A GaAs Hall element. mini-mold package. packet-tape reel 4000pcs Abstract: .. HG-106A•High-stability GaAs Hall element.•Ultra mini-mold SMT package.•Shipped in packet-tape reel 4000pcs per reel . Item Symbol Limit Unit. Vin 8 V Max. Input Voltage. PD 150 mW Max. Power .. datasheet abstract.. |
309.91 Kb |
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First line: GaAs Hall Element HG-106A GaAs Hall element. mini-mold package. packet-tape reel 4000pcs Abstract: .. HG-106A•High-stability GaAs Hall element.•Ultra mini-mold SMT package.•Shipped in packet-tape reel 4000pcs per reel . Item Symbol Limit Unit. Vin 8 V Max. Input Voltage. PD 150 mW Max. Power .. datasheet abstract.. |
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First line: DBD2102AAC Dual Duplex Tower Mounted Amplifier 1850-1990 1850-1910 1930-1990 Improves Base Station Abstract: .. ANT Surge Suppression: DC Ground BTS Surge Suppression: IEC 60 / 2; 126V / 1.2 x 50 ws; 106A / 8 x 20 ws. Mechanical Electrical. Packing Size: 51 x 38 x 28 cm 20î x 15î x 11î Shipping Weight: 7.7 kg 17 lbs .. datasheet abstract.. |
90.44 Kb |
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First line: APT20M20JFLL 200V 106A 0.020W POWER FREDFET Power generation loss high voltage N-Channel Abstract: .. 44mH, RG = 25W, Peak IL = 106A. 2 Pulse Test: Pulse width < 380 μS, Duty Cycle < 2% APT Reserves the right to change, without notice, the specifications and information contained herein. SOURCE-DRAIN .. datasheet abstract.. |
62.95 Kb |
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First line: APT20M20JLL 200V 106A POWER Power generation loss high voltage N-Channel enhancement mode Abstract: .. 4 Starting Tj = +25°C, L = 0.44mH, RG = 25W, Peak IL = 106A. 2 Pulse Test: Pulse width < 380 μS, Duty Cycle < 2% APT Reserves the right to change, without notice, the specifications and information contained .. datasheet abstract.. |
60.92 Kb |
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First line: Diode Arrays Avalanche Diode Chip Scale Package SP0501BACT product silicon structure tailored Abstract: .. Enteck: Cu Plus 106A 28 mils. 14 mils 18 mils. 10 mils. 2 mils. Solder stencil opening/PCB land .. datasheet abstract.. |
183.46 Kb |
3 Pages |
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First line: Fuseholders Voltage Fuse Applications RoHS Twist-Lock In-Line Type 100U Series SPECIFICATIONS Electrical Abstract: .. 155 106U 1/4" x 3/4" 155 106A SFE 6. 155 17.5U 1/4" x 7/8" 155 17.5A SFE 71/2. 155 109U 1/4" x 7/8" 155 109A SFE 9. 155 114U 1/4" x 11/16" 155 114A SFE 14. 155 120U 1/4" x 11/4" 155 120A SFE 20. ORDERING INFORMATION .. datasheet abstract.. |
160.59 Kb |
1 Pages 
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First line: Next Previous Fuseholders Voltage Fuse Applications Twist-Lock In-Line Type SPECIFICATIONS Electrical Intended Abstract: .. 155 106U 1/4" x 3/4" 155 106A SFE 6. 155 17.5U 1/4" x 7/8" 155 17.5A SFE 71/2. 155 109U 1/4" x 7/8" 155 109A SFE 9. 155 114U 1/4" x 11/16" 155 114A SFE 14. 155 120U 1/4" x 11/4" 155 120A SFE 20. ORDERING INFORMATION .. datasheet abstract.. |
89.9 Kb |
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First line: Fuseholders Voltage Fuse Applications RoHS Twist-Lock In-Line Type 100U Series SPECIFICATIONS Electrical Abstract: .. 155 106U 1/4" x 3/4" 155 106A SFE 6. 155 17.5U 1/4" x 7/8" 155 17.5A SFE 71/2. 155 109U 1/4" x 7/8" 155 109A SFE 9. 155 114U 1/4" x 11/16" 155 114A SFE 14. 155 120U 1/4" x 11/4" 155 120A SFE 20. ORDERING INFORMATION .. datasheet abstract.. |
156.15 Kb |
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First line: FUSEHOLDERS VOLTAGE FUSE APPLICATIONS Twist-Lock In-Line Type SPECIFICATIONS Electrical Intended volts less Abstract: .. 155 106U 1/4" x 3/4" 155 106A SFE 6. 155 17.5U 1/4" x 7/8" 155 17.5A SFE 71/2. 155 109U 1/4" x 7/8" 155 109A SFE 9. 155 114U 1/4" x 11/16" 155 114A SFE 14. 155 120U 1/4" x 11/4" 155 120A SFE 20. ORDERING INFORMATION .. datasheet abstract.. |
86.06 Kb |
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First line: Fuseholders Voltage Fuse Applications Twist-Lock In-Line Type SPECIFICATIONS Electrical Intended volts less Abstract: .. 155 106U 1/4" x 3/4" 155 106A SFE 6. 155 17.5U 1/4" x 7/8" 155 17.5A SFE 71/2. 155 109U 1/4" x 7/8" 155 109A SFE 9. 155 114U 1/4" x 11/16" 155 114A SFE 14. 155 120U 1/4" x 11/4" 155 120A SFE 20. ORDERING INFORMATION .. datasheet abstract.. |
83.84 Kb |
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First line: Embedded Power Business-Critical Continuity DS1300-3 Watts Distributed Power System Distributed Power Bulk Abstract: .. Output Main DC voltage +12v @ 74A 90VAC or 106A 180VAC Stand-By +3.3vsb @ 7A. Adjustment range Factory Set, no pot adjustments Regulation +12vdc; ±3%; +3.3vsb; ±3% Over current +12vdc; 110 .. datasheet abstract.. |
270.82 Kb |
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First line: KOHSHIN Characteristic Characteristic main characteristics their details described below. Each characteristic specified Abstract: .. Materials: HC-TN series gap=1.7 Input current = 106A r.m.s , Sine wave. Relationship between input current frequency and core temperature increase. Amorphous t=0.025. Silicon steel plate .. datasheet abstract.. |
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First line: Next Previous Silicon Protection Circuits Avalanche Diode Array Bipolar Chip Scale Package Abstract: .. OSP Entek Cu Plus 106A PRINTED CIRCUIT BOARD RECOMMENDATIONS. 0 48 97. Time s 145 194 242 290 339 387 435. EXH CD RF Z Z4 Z3 Z2 PH EXH. 250. 225. 200. 175. 150. 125. 100. 75. 50. 25. Temperature o. C Typical Solder .. datasheet abstract.. |
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First line: Next Previous Silicon Protection Circuits Avalanche Diode Array Unipolar Chip Scale Package Abstract: .. OSP Entek Cu Plus 106A PRINTED CIRCUIT BOARD RECOMMENDATIONS. Typical Solder Reflow Thermal Profile No Clean Flux Next Previous. SP0504BAC, SP0508BAC, SP0516BAC. Silicon Protection Circuits .. datasheet abstract.. |
150.62 Kb |
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First line: EMIF6-100FC Only Name Means ProT ekTion TER / TVS ARRA APPLICA TIONS Cellular Phones Abstract: .. OSP Entek Cu Plus 106A ±50μm. ±20μm 60 Seconds. 240°C. Pad Size on PCB. Pad Shape Pad Definition. Solder Mask Opening Solder Stencil Thickness. Solder Stencil Aperture Opening laser cut, 5% tapered .. datasheet abstract.. |
114.4 Kb |
5 Pages |
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First line: EMIF4100 Only Name Means ProT ekTion TER / TVS ARRA APPLICA TIONS Cellular Phones Abstract: .. OSP Entek Cu Plus 106A ±50μm. ±20μm 60 Seconds. 240°C. Pad Size on PCB. Pad Shape Pad Definition. Solder Mask Opening Solder Stencil Thickness. Solder Stencil Aperture Opening laser cut, 5% tapered .. datasheet abstract.. |
110.12 Kb |
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First line: California Micro Devices N.McCarthy Blvd Milpitas PRELIMINARY CSPEMI607 4-Channel Filter Array with Abstract: .. Bond Trace Finish OSP Entek Cu Plus 106A Tolerance – Edge to Corner Ball ±50μm. Solder Ball Side Coplanarity ±20μm. Soldering Minimum Temperature 205’C for at least 30 seconds. Maximum Dwell Time .. datasheet abstract.. |
197.55 Kb |
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First line: AFS4000 AFS6000 Rack Mountable Power Shelves Front-end shelves AFE2000 series power supplies Abstract: .. AFS6000-4U3P 48V @ 124A 54.5V @ 109A 56.2V @ 106A. 12V @ 3A 12V @ 3A 12V @ 3A. AFS Power Shelf Characteristics. International Safety Standard Approvals. EN60950/IEC950 File No. E9972397. UL1950 File .. datasheet abstract.. |
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First line: EMIF6-100LLFC FILTER / TVS ARRAY APPLICATIONS Cellular Phones Notebooks Personal Digital Assistant PDA Ground Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
88.02 Kb |
5 Pages
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First line: California Micro Devices N.McCarthy Blvd Milpitas OBJECTIVE CSPEMI400 Card Filter Array with Abstract: .. Bond Trace Finish OSP Entek Cu Plus 106A Soldering Minimum Temperature 205’C for at least 30 seconds. Soldering Maximum Temperature 240’C for at less than 2 minutes. Solder Reflow Profile. California .. datasheet abstract.. |
149.33 Kb |
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First line: AFS4000 AFS6000 Rack Mountable Power Shelves Front-end shelves AFE2000 series power supplies Abstract: .. AFS6000-4U3P 48V @ 124A 54.5V @ 109A 56.2V @ 106A. 12V @ 3A 12V @ 3A 12V @ 3A. AFS Power Shelf Characteristics. International Safety Standard Approvals. EN60950/IEC950 File No. E9972397. UL1950 File .. datasheet abstract.. |
282.77 Kb |
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First line: ESD4-LFC Only Name Means ProT ekTion CAPACIT ANCE FLIP CHIP ARRA APPLICA Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
89.98 Kb |
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First line: EMIF6-100LFC Only Name Means ProT ekTion TER / TVS ARRA APPLICA TIONS Cellular Phones Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
112.59 Kb |
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First line: EMIF4-100LFC Only Name Means ProT ekTion TER / TVS ARRA APPLICA TIONS Cellular Phones Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
107.89 Kb |
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First line: EMIF4-100FCD4 Only Name Means ProT ekTion TER / TVS ARRA APPLICA TIONS Cellular Phones Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
114.83 Kb |
5 Pages
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First line: EMIF4-100FC Only Name Means ProT ekTion TER / TVS ARRA APPLICA TIONS Cellular Phones Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
109.78 Kb |
5 Pages
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First line: EMIF2SPK-10FCC Only Name Means ProT ekTion TER / TVS ARRA APPLICA TIONS Cellular Phones Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
87.37 Kb |
4 Pages
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First line: EMIF2MIC-68FCC Only Name Means ProT ekTion TER / TVS ARRA APPLICA TIONS Cellular Phones Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
87.76 Kb |
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First line: AFS4000 AFS6000 Rack Mountable Power Shelves NOTICE SOME MODELS LISTED THIS DOCUMENT Abstract: .. AFS6000-4U3P 48V @ 124A 54.5V @ 109A 56.2V @ 106A. 12V @ 3A 12V @ 3A 12V @ 3A. AFS Power Shelf Characteristics. NOTICE SOME MODELS LISTED IN THIS DOCUMENT HAVE BEEN DISCONTINUED. Please contact your local .. datasheet abstract.. |
283.1 Kb |
3 Pages
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First line: ULLC0408FC05C Only Name Means ProT ekTion UNBUMPED CAPACIT ANCE FLIP CHIP ARRA Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
107.41 Kb |
5 Pages
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First line: CSPRC032A Channel Filter Network Features filter lines device Filters attenuate 30dB 3GHz Abstract: .. Pad Protective Finish OSP Entek Cu Plus 106A Tolerance — Edge To Corner Ball +50μm. Solder Ball Side Coplanarity +20μm. Maximum Dwell Time Above Liquidous 60 seconds. Maximum Soldering Temperature .. datasheet abstract.. |
381.95 Kb |
5 Pages
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First line: CM1300 Channel Filter Network Features Functionally compatible with CSPRC032A OptiGuard coated improved Abstract: .. Pad Protective Finish OSP Entek Cu Plus 106A Tolerance — Edge To Corner Ball +50μm. Solder Ball Side Coplanarity +20μm. Maximum Dwell Time Above Liquidous 60 seconds. Maximum Soldering Temperature .. datasheet abstract.. |
389.63 Kb |
5 Pages
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First line: CM1205 Channel Protection Array Chip Scale Package Features Functionally compatible with CMDs Abstract: .. Pad Protective Finish OSP Entek Cu Plus 106A Tolerance — Edge To Corner Ball +50μm. Solder Ball Side Coplanarity +20μm. Maximum Dwell Time Above Liquidous 60 seconds. Maximum Soldering Temperature .. datasheet abstract.. |
97.07 Kb |
5 Pages
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First line: CM1204 4-Channel Array Features Functionally compatible with CMDs CSPESD304 Optiguard coated improved Abstract: .. Pad Protective Finish OSP Entek Cu Plus 106A Tolerance — Edge To Corner Ball +50μm. Solder Ball Side Coplanarity +20μm. Maximum Dwell Time Above Liquidous 60 seconds. Maximum Soldering Temperature .. datasheet abstract.. |
183.86 Kb |
6 Pages
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First line: PRSB6.8C Only Name Means ProT ekTion ANDARD COMPONENTS APPLICA TIONS Noise Suppression Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
88.17 Kb |
5 Pages
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First line: LC0408FC3.3C thru Only Name Means ProT ekTion LC0408FC36C CAPACIT ANCE FLIP CHIP Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
117.94 Kb |
6 Pages
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First line: TACLANE Encryptor KG-175 Price List more information please contact Attention INFOSEC Street Abstract: .. TL-106A Fiber Optic Cable For TACLANE-E100 & Mini only $35 ea. TL-107A Power Cable For TACLANE-Classic & E100 only $95 ea. WS-6900-1 TACLANE KG-175 Rack Mount Shelf Kit 19” Rack mount shelf .. datasheet abstract.. |
66.77 Kb |
2 Pages |
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First line: PKFC3.3C thru Only Name Means ProT ekTion PKFC36C PACKAGED FLIP CHIP ARRA Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
94.59 Kb |
5 Pages
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First line: PRELIMINARY CM1452 Camera Filter Array with Protection Features channels filtering 15kV protection Abstract: .. Bond Trace Finish OSP Entek Cu Plus 106A Tolerance – Edge to Corner Ball 50μm. Solder Ball Side Coplanarity 20μm. Soldering Minimum Temperature 205’C for at least 30 seconds. Maximum Dwell Time .. datasheet abstract.. |
166.59 Kb |
6 Pages
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First line: PF1010A Power Amplifier Module ADE-208-106A 2nd. Edition July Features Frequency range Surface Abstract: .. PF1010A. MOS FET Power Amplifier Module for P/C LAN. ADE-208-106A Z 2nd. Edition July 1996. Features. • Frequency range: 806 to 824 MHz • Surface mounted small package: 1 cc, 3g with shielded cover .. datasheet abstract.. |
71.14 Kb |
12 Pages |
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First line: CSPESD304 4-Channel Array Features Four channels protection +15kV protection each channel Product Abstract: .. Pad Protective Finish OSP Entek Cu Plus 106A Tolerance — Edge To Corner Ball +50μm. Solder Ball Side Coplanarity +20μm. Maximum Dwell Time Above Liquidous 60 seconds. Soldering Maximum Temperature .. datasheet abstract.. |
294.4 Kb |
6 Pages
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First line: CSPRC032A Channel Filter Network Features filter lines device Filters attenuate 30dB 3GHz Abstract: .. Pad Protective Finish OSP Entek Cu Plus 106A Tolerance — Edge To Corner Ball +50μm. Solder Ball Side Coplanarity +20μm. Maximum Dwell Time Above Liquidous 60 seconds. Soldering Maximum Temperature .. datasheet abstract.. |
413.93 Kb |
5 Pages
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First line: CM1300 Channel Filter Network Features Functionally compatible with CSPRC032A Optiguard coated improved Abstract: .. Pad Protective Finish OSP Entek Cu Plus 106A Tolerance — Edge To Corner Ball +50μm. Solder Ball Side Coplanarity +20μm. Maximum Dwell Time Above Liquidous 60 seconds. Soldering Maximum Temperature .. datasheet abstract.. |
414.6 Kb |
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First line: LC0406FC3.3C thru LC0406FC36C CAPACITANCE FLIP CHIP ARRAY APPLICATIONS Cellular Phones Personal Digital Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
73.11 Kb |
6 Pages
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First line: LC0404FC3.3C thru LC0404FC36C CAPACITANCE FLIP CHIP ARRAY APPLICATIONS Cellular Phones Personal Digital Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
71.49 Kb |
6 Pages
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First line: LC0402FC3.3C thru LC0402FC36C CAPACITANCE FLIP CHIP ARRAY APPLICATIONS Cellular Phones Personal Digital Abstract: .. Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP Entek Cu Plus 106A ±50μm ±20μm 60 Seconds 270°C. Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness .. datasheet abstract.. |
70.58 Kb |
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