NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Part | Manufacturer | Description | Samples | Ordering |
| MSP430F6630ZQWT | Texas Instruments | MSP430F663x Mixed Signal Microcontroller 100-BGA MICROSTAR JUNIOR | 
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| MSP430F6632ZQWT | Texas Instruments | MSP430F663x Mixed Signal Microcontroller 100-BGA MICROSTAR JUNIOR |
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| MSP430F6634ZQWT | Texas Instruments | MSP430F663x Mixed Signal Microcontroller 100-BGA MICROSTAR JUNIOR |
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| TMS320C2801ZGMS | Texas Instruments | 32-Bit Digital Signal Controller with ROM 100-BGA MICROSTAR -40 to 125 |
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| TMS320F2801GGMS | Texas Instruments | 32-Bit Digital Signal Controller with Flash 100-BGA MICROSTAR -40 to 125 |
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| Catalog Datasheet Results | Type | Document Tags |
| Abstract: 1 DATE: 04/28/08 DESCRIPTION: 100-Ball Low Profile Ball Grid Array (LBGA) PACKAGE CODE: NJ100 NJ100 DOCUMENT CONTROL #: PD-2055 PD-2055 08-0178 REVISION: B ... | Original |
1 pages, |
NJ100 PD-2055 NJ100 abstract |
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| Abstract: FW322 FW322 07 NV129/NV100/T100 NV129/NV100/T100 1394a PCI PHY/Link Open Host Controller Interface Product Brief Features 129-ball VTFSBGA/100-ball FSBGA/100-pin TQFP lead-free package. 1394a-2000 OHCI link and PHY core function in a single device: - Single-chip link and PHY enable smaller, simpler, more efficient motherboard and add-in card designs. - Compatibility with current Microsoft Windows ® drivers and common , 07 T100-DT T100-DT* Package 129-Ball VTFSBGAC 129-Ball VTFSBGAC 100-Ball FSBGA 100-Ball FSBGA 100-Pin ... | Original |
2 pages, |
T100 NV129 L-FW322-07-NV100-DB L-FW322 FW322 NV129/NV100/T100 FW322 abstract |
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| Abstract: 29f2g08 48-pad LLGA, 12 x 20 x 1.47 (8DP) C8 = 52-pad WLGA, 14 x 18 x 0.75 (DDP/QDP) H1 = 100-ball VBGA (Pb-free), 12 x 18 x 1.0 H2 = 100-ball TBGA (Pb-free), 12 x 18 x 1.2 H3 = 100-ball LBGA, (Pb-free) 12 x ... | Original |
1 pages, |
uLGA 16gb 63-ball 64G nand 64GB Nand flash 8G nand MICRON 1.8V 2GB NAND Micron 1GB NAND FLASH NAND 32G 133MT Micron NAND flash 32gb MICRON 63 Micron MLC temperature 64GB Nand flash VBGA datasheet abstract |
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| Abstract: Package Diagrams Thin Ball Grid Array Packages 48-Ball Thin Ball Grid Array (7 x 7 x 1.1 mm, 0.8 pitch) BB48 51-85109 1 Package Diagrams 100-Ball Thin Ball Grid Array (11 x 11 x 1.4 mm) BB100 BB100 51-85107 2 Package Diagrams 172-Ball FBGA BB172 BB172 51-85114 3 Package Diagrams 256-Ball Thin Ball Grid Array (17 x 17 x 1.4 mm) BB256 BB256 51-85108 4 Package Diagrams 400-Ball FBGA (21 x 21 x 1.4 mm) BB400 BB400 51-85111 5 ... | Original |
5 pages, |
BB48 BB100 datasheet abstract |
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| Abstract: MT29H8G08ACAH1 MT29H8G08ACAH1 MT29H16G08ECAH1 MT29H16G08ECAH1 MT29H32G08GCAH2 MT29H32G08GCAH2 Features Figure 1:100-Ball VBGA · Open NAND Flash , Package: 100-ball VBGA · RESET (FFh) required as first command following power-on Notes: 1. The ONFI , 100-ball 12 x 18 x 1.0mm VBGA (Pb-free) H2 = 100-ball 12 x 18 x 1.2mm TBGA (Pb-free) Valid Part Number , : Ball Assignment: 100-Ball VBGA Single x8 Device (MT29H8G08ACAH1 MT29H8G08ACAH1) 1 2 A NC NC B NC , Information Figure 4: Ball Assignment: 100-Ball VBGA/TBGA Dual x8 (MT29H16G08ECAH1 MT29H16G08ECAH1, MT29H32G08GCAH2 MT29H32G08GCAH2) 1 ... | Original |
8 pages, |
32G nand Micron NAND 16gb micron nand flash chip 16gb SAC305 Micron ONFi MT29H16G08ECAH1 ONFI nand flash micron nand flash chip 32gb Micron ONFI 2.2 datasheet NAND Qualification Reliability 32GB 32G nand flash MT29H8G08ACAH1 MT29H16G08ECAH1 MT29H8G08ACAH1 abstract |
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| Abstract: 68-Pin JLCC 68-Pin PLCC 84-Pin CPGA 84-Pin PLCC 100-Ball caBGA 100-Ball csBGA 100-Ball fpBGA ... | Original |
2 pages, |
1152-ball 416-ball PB1240H PB1240H abstract |
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| Abstract: (CPL version) (Pb-free) WC = 48-pin TSOP I (OCPL version) (Pb-free) H1 = 100-ball VFBGA (Pb-free), 12 x 18 x 1.0 H2 = 100-ball TFBGA (Pb-free), 12 x 18 x 1.2 HC = 63-ball VFBGA, 10.5 x 13 x 1.0 C2 = ... | Original |
1 pages, |
uLGA 16G nand 256gb nand flash 32G nand flash 128GB Nand flash NAND flash 64gb nand 29F MICRON NAND sLC MT29H Micron 1GB NAND FLASH Micron MLC temperature MT 29F 64G MICRON NAND MLC datasheet abstract |
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| Abstract: packages, the 2064VE 2064VE and 2128VE 2128VE are both available in 84-pin PLCC, 100-pin TQFP and 100-ball BGA packages , PLCC packages. It, too, will be available in a chip array package (100-ball) in 1Q99. The 128 I/O ... | Original |
2 pages, |
2192VE 2128VE 2064VE 2032VE 49-BGA PB1106 PB1106 abstract |
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| Abstract: 44-pin PLCC 44-pin TQFP 100-pin TQFP 100-ball caBGA* ispLSI 2096VE 2096VE 96 4.0 ns 250 MHz , 128 + 8 128 + 8 128 + 8 100-pin TQFP 100-ball caBGA* 160-pin PQFP 176-pin TQFP 208-ball fpBGA ... | Original |
2 pages, |
2192VE 2128VE 2096VE 2064VE 2032VE CABGA ORP 12 BFW transistors BFW 100 2000VE 2000VE abstract |
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| Abstract: industry-standard 100-ball BGA package and a source synchronous data interface that significantly boosts I/O , applications Industry-standard 100-ball BGA package Applications · Flash cards · USB flash drives · ... | Original |
2 pages, |
hynix nand intel nand flash "NAND Flash" nand flash NAND flash differences nand flash DQS hynix NAND ECC phison nand flash "open nand flash interface" Micron NAND Micron NAND DQS NAND qualification Micron ONFi datasheet abstract |
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| Abstract: Package: VBGA Pin Count:100-ball MT/s: 166 MT/s I/O: Common Bits/Cell:SLC Op Temp: -40C to +85C Please ... | Original |
1 pages, |
Micron NAND onfi Micron NAND MT29F16G08 64GB Nand flash datasheet abstract |
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| Abstract: Count:100-ball MT/s: 166 MT/s I/O: Separate Bits/Cell:SLC Op Temp: 0C to +70C Please Note ... | Original |
1 pages, |
MT29F128 MT29F128G08AUCBBH3 128GB Nand flash datasheet abstract |
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| Abstract: Rev. 0.0, Dec.2009 1Gb XDR features comparison with 512Mb A guide for user to use XDR DRAM Rev.0.0 1. XDR DRAM features comparison [Table 1] XDR DRAM features information table Comparison 512Mb E-die 1Gb E-die VDD 1.8V 1.5V Process 80nm 56nm Org X16/X8/X4/X2 X16/X8/X4/X2 X32/X16 X32/X16 Data rate 4.0/3.2/2.4Gbps 4.8/4.0/3.2Gbps Package ball 100 Ball 151 Ball Package size 14 x 14.5 (unit :mm) 15.5 x 15.5 (unit :mm) 2. XDR DRAM package ballout ... | Original |
2 pages, |
dram 80nm XDR 1gb XDR DRAM datasheet abstract |
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| Abstract: I (OCPL version) (Pb-free) H1 = 100-ball VFBGA (Pb-free), 12 x 18 x 1.0 H2 = 100-ball TFBGA ... | Original |
1 pages, |
128GB Nand flash 16G nand flash 1G NAND flash 32GB Nand flash 64G nand 64GB Nand flash 8G nand Micron 1GB NAND FLASH MICRON 63 Micron NAND flash SLC tfbga mlc flash 16G nand datasheet abstract |
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| Abstract: Package Diagrams Thin Ball Grid Array Packages 42-Ball Thin Ball Grid Array (6 x 5 x 1.2 mm) BB42 51-85139-*A 1 Package Diagrams 100-Ball Thin Ball Grid Array (11 x 11 x 1.4 mm) BB100 BB100 51-85107-*B 2 Package Diagrams 165-Ball FBGA (13 x 15 x 1.2 mm) BB165A BB165A 51-85122-*B 3 Package Diagrams 165-Ball FBGA (13 x 15 x 1.62 mm) BB165B BB165B 51-49026-* 4 Package Diagrams 165-Ball FBGA (15 x 17 x 1.20 mm) BB165C BB165C 51-85165-* 5 Package Diagrams 172-Ball FBGA (15 x 15 ... | Original |
15 pages, |
BB484 BB100 165 BALL FBGA BB209 datasheet abstract |
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| Abstract: MT29F64G08C MT29F64G08 Specifications Product Name: Component Density: 64Gb Pa11 Status Code: Production RoHS: Yes Depth: Bus Wi ... | Original |
1 pages, |
datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
| Over 1.1 million files (1986-2013): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer. |
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| Packages SOT598-1 ; plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm SOT598-1 TFBGA100 TFBGA100 TFBGA100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm 00-11-22 Soldering Information Thermal considerations www.datasheetarchive.com/files/philips/packages/sot598-1-v2.html |
Philips | 05/02/2002 | 4.99 Kb | HTML | sot598-1-v2.html |
| Packages Information on package SOT598-1 plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm Outline drawing Package version Package name Package description Drawing issue date SOT598-1 TFBGA100 TFBGA100 TFBGA100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm 3/3/2003 General package information www.datasheetarchive.com/files/philips/packages/sot598-1-v1.html |
Philips | 17/06/2005 | 1.93 Kb | HTML | sot598-1-v1.html |
| Packages Information on package SOT872-1 plastic low profile fine-pitch ball grid array package; 100 balls; body 9 x 9 x 1.05 mm Outline drawing Package version Package name Package description Drawing issue date SOT872-1 LFBGA100 LFBGA100 LFBGA100 LFBGA100 plastic low profile fine-pitch ball grid array package; 100 balls; body 9 x 9 x 1.05 mm 11/2/2004 General package information www.datasheetarchive.com/files/philips/packages/sot872-1.html |
Philips | 16/06/2005 | 1.95 Kb | HTML | sot872-1.html |
| Packages Information on package SOT777-1 plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm Outline drawing Package version Package name Package description Drawing issue date SOT777-1 TFBGA100 TFBGA100 TFBGA100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm 6/20/2002 General package information www.datasheetarchive.com/files/philips/packages/sot777-1-v1.html |
Philips | 16/06/2005 | 1.93 Kb | HTML | sot777-1-v1.html |
| Packages Information on package SOT598-1 plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm Outline drawing Package version Package name Package description Drawing issue date SOT598-1 TFBGA100 TFBGA100 TFBGA100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm 00-11-22 General package information Soldering Information Thermal www.datasheetarchive.com/files/philips/packages/sot598-1.html |
Philips | 24/04/2003 | 1.83 Kb | HTML | sot598-1.html |
| Packages Information on package SOT777-1 plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm Outline drawing Package version Package name Package description Drawing issue date SOT777-1 TFBGA100 TFBGA100 TFBGA100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 6 x 6 x 0.8 mm 02-06-20 General package information Soldering Information Thermal www.datasheetarchive.com/files/philips/packages/sot777-1.html |
Philips | 24/04/2003 | 1.83 Kb | HTML | sot777-1.html |
| Packages Information on package SOT598-1 plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm Outline drawing Package version Package name Package description Drawing issue date SOT598-1 TFBGA100 TFBGA100 TFBGA100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm 3/3/2003 Chemical content Part www.datasheetarchive.com/files/philips/packages/sot598-1-v3.html |
Philips | 16/06/2005 | 3.93 Kb | HTML | sot598-1-v3.html |
| temperature range Compact 100-ball FBGA package [Information as of 11-Feb-2005] www.datasheetarchive.com/files/national/pf/scan921821.html |
National | 17/02/2005 | 9.58 Kb | HTML | scan921821.html |
| 10x10 mm 100 balls www.datasheetarchive.com/files/stmicroelectronics/stonline/prodpres/dedicate/wireless/technolo/lfbga.htm |
STMicroelectronics | 20/07/2000 | 6.51 Kb | HTM | lfbga.htm |
| ; 100 balls; body 6 x 6 x 0.8 mm - (EIAJ) MO-195 MO-195 MO-195 MO-195 (JEDEC) - (IEC) 2002-06-20 SOT598-1 TFBGA100 TFBGA100 TFBGA100 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm MO-216 MO-216 MO-216 MO-216 www.datasheetarchive.com/files/philips/packages/plastic/surfacemount/array/zzz_other/tfbga.html |
Philips | 15/04/2003 | 15.33 Kb | HTML | tfbga.html |