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R8A77450HA02BG#UA
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Renesas Electronics Corporation
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High Performance Microprocessors with 1.0 GHz Dual-core Arm® Cortex®-A7 CPUs, with 3D Graphics and Video CODEC Engine |
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68697-450HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in)Pitch. |
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95687-450HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 9.14 mm (0.36in) Mating, 9.14 mm (0.36in) Tail. |
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89891-450HLF
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Amphenol Communications Solutions
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Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 100 Positions, 2.54mm (0.100in) Pitch |
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68693-450HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in)Pitch.. |
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68692-450H
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch. |
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