500 MILLION PARTS FROM 12000 MANUFACTURERS

DATASHEET SEARCH ENGINE

Top Results

Part Manufacturer Description Datasheet BUY
PMP4332 Texas Instruments 5V80A Low Profile High Efficiency Power Supply visit Texas Instruments
PMP7426 Texas Instruments 6W Boost Converter Optimized for Low Profile/Small Area visit Texas Instruments
PMP7423 Texas Instruments 20W Boost Converter Optimized for Low Profile/Small Area visit Texas Instruments
PMP7424 Texas Instruments 24W Boost Converter Optimized for Low Profile/Small Area visit Texas Instruments
DP83848EVV/NOPB Texas Instruments 48-LQFP visit Texas Instruments
TMS320C53SPZ57 Texas Instruments TMS320C53S57 100-LQFP visit Texas Instruments

1.7 PC REFLOW PROFILE

Catalog Datasheet MFG & Type PDF Document Tags

CONNECTOR pcb mount square 75 ohm threaded rg6

Abstract: 364A2595 press-fit center pin locks the connector into the PC board so it is held firmly for reflow or wave , 3M61V704 Mini- BNC Jack W/ Teflon for Reflow Solder 75 Phos./Gold - - Low Profile .270 , BNC Connectors Reduced Size PCB Right Angle Mount The Super LowTM Profile BNC PC jack reduces the , 38 . Fig 35A PC Layout for Super Low Profile Fig. 38 *Denotes that items are not , , Solder .500 Mtg. Hole Centers 22 Figure 19 Figure 20 Figure 21 Figure 22 PC Board
Bomar Interconnect Products
Original
QQ-C-576 BS4271 CONNECTOR pcb mount square 75 ohm threaded rg6 364A2595 364M2595 valox 750 310A105A 361V509E QQ-B-626 QQ-B-750 QQ-C-530 MIL-H-7199 L-P403

IC 358 smd

Abstract: ic 1496 specifications stability Low profile Reflow solderable Excellent solderability (Nickel barrier + Au flash termination , .: ±0.3 (0.012) Recommended Land Pattern Recommended Reflow Profile mm (inches) 5.0 (0.197 , · Excellent frequency stability Low profile Reflow solderable Excellent solderability (Nickel , 3.58 to 8.00 (op. ±0.3%) Recommended Reflow Profile mm (inches) 2.5 (0.098) Frequency , PC Peripherals 14 MC14069UB (Motorola) 1 2 3 4 HOW TO ORDER PBRC - 4.00 G R
AVX
Original
MC74HC04 IC 358 smd ic 1496 specifications IC 358 mc14069ub motorola PBRC

MFZ Series

Abstract: w Profile M ethod : Air or Infrated Reflow ·R e c o m m e n d e d Solder Land on PC Board Series : M , or lifting up the PC board during reflow soldering : 6 Location of infrared ray lamps : 1R retiow as , prevent the capacitor body Reverse voltage from sliding or lifting up on PC board during reflow soldering , jjg ja j SURFACE MOUNT ALUMINUM ELECTROLYTIC CAPACITORS RECOMMENDED REFLOW SOLDERING CONDITIONS The following conditions are recom m ended for air or infrared reflow soldering o f the surface
-
OCR Scan
MFZ Series

AYF333135

Abstract: AYF331135 recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile , reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector , resistance to solder creepage FEATURES 1. Slim and low profile design (Pitch: 0.3 mm) The use of a back lock mechanism enables a 3.15 mm (with lever) low profile design. 0.9 3.1 5 APPLICATIONS , concentration 3±1 ppm, humidity 75 to 80% R.H. Reflow soldering Soldering iron Repeated insertion and removal
Panasonic
Original
AYF33 AYF330735 AYF331135 AYF333135 AYF333935 ACCTB31E 201201-T AYF330835 AYF330935

FPC CONNECTOR Front lock

Abstract: AYF33 . Accordingly, carefully position the terminal with the PC board pattern. · The recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile Y3FT/Y3F/Y3B/Y5B/Y5BW , setting the reflow soldering conditions. · When performing reflow soldering on the back of the PC board , profile and space saving body of 1.0 mm high and 3.20 mm deep (3.70 mm including the lever) Y5B and , profile, space saving back lock type with improved lever operability · Mechanical design freedom
NAiS
Original
AYF53 FPC CONNECTOR Front lock FPC CONNECTOR AYF531235 Connector 0.3mm pitch AYF532265

ATMEL reflow temp

Abstract: cason paste Sn-3%Ag-0.5%Cu lead free paste The reflow profile depends on the thermal mass of the other , actual reflow profile used to produce good board level reliability result is shown in Figure 4 (no clean , °C range. An actual reflow profile used to produce good board level reliability result is shown in Figure , advised. 3 3438B­DFLSH­3/17/2004 Figure 4. PbSn Reflow Profile Note: Time between 150°C - 170°C: 120 sec Time above 183°C: 50 sec Peak Temp: 218°C Figure 5. Pb-Free Reflow Profile Note
Atmel
Original
IPC-SM-782 ATMEL reflow temp cason cason 8 pcb pattern ATMEL JEDEC-STD-020 SOIC-8s2 8S2 8-lead 128-M

SAC387

Abstract: NXR-1400 using hot-air BGA rework station using reflow profile shown in figure 12 DOE Reflow Process , SMD125T16L_Ver C Side A Reflow Profile Definitions · Ramp-to-spike: RTS, figure 11 · Ramp-soak-spike: Reg RSS , parameters for successful reflow assembly of PowerPAK 1212-8 package in other PC board designs. However, we , 16-layer PC board assembly for solder joint reliability, passing the temperature cycles, including , the associated assembly costs while utilizing well established reflow processes. As of April 2010
Vishay Siliconix
Original
SAC387 NXR-1400 tamura solder paste SN63 PB37 alpha PowerPAK 1212-8 stencil ekra e5 AEC-Q101 1212D IPC-9701 AN825

IPC-7527

Abstract: PCB design for 0.2mm pitch csp package Profile The solder reflow profile will be dependent on PCB design, PCB thickness, type of components, component density, and the recommended profile of the solder paste being used. A reflow profile will need to be developed for each PCB type using various CSP packages. Refer to the reflow profile in the , Reflow After Reflow The reflow profile guidelines are based on the temperature at the actual solder , procedure are as follows: 1234567- Pc board preheat Reflow of component solder Vacuum removal of
Carsem
Original
IPC-7527 PCB design for 0.2mm pitch csp package tssop 16 exposed pad stencil IPC7527 QFN 16 CARSEM package outline metcal VPI-1000 VPI-1000

PANEL MOUNT BNC TO BNC 75 OHM

Abstract: 861V509ER6 design for PC. Edge mounted BNC and F configurations. Lowest profile anywhere, locks into PC board for , Profile, Black 1.44 Standard Profile, Metal 2.44 Low Profile, Metal 2.57 Super-Low Profile PC BNC , Thin-Net Plenum RGB Monitor Cable, Mini RG59 59, 62, 210 PVC 174, 188, 316 (4 Pc.) 179, 187 (4 Pc , Ohm for Reflow V-BiteTM BNC 50 Ohm with Thread Bushing V-BiteTM BNC 75 Ohm V-BiteTM BNC 75 Ohm for Reflow V-BiteTM BNC 75 Ohm with Thread Bushing V-BiteTM BNC F V-BiteTM F for Reflow TM Fig
-
Original
PANEL MOUNT BNC TO BNC 75 OHM 861V509ER6 f connector rg6 coax sbc8241 SBC1855A 9659 BNC 310A205A18 310A205F 310A205FS 310A205FV 310A205FV2 310A204G
Abstract: Recommended Reflow Profiles Lead Process (Sn/Pb) Typical reflow temperature for this profile is 240 ° C of profile : Example of profile : Note : Reflow profile to use depends on solder characteristics. Each , step. Lead Free Process : Typical reflow temperature for this profile is 250 to 260 ° C Example of profile : Note : Reflow profile to use depends on solder characteristics. Each soldering material supplier has its own recommendation. TEMEX use the above temperature profile to test reflow compliance of Temex
Original

ASDL-4360

Abstract: ASDL-4360-C22 °C to Peak Temperature The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process , based on Tj ­ 110 °C and thermal resistance at 250 °C/W 2 0.6 0.8 Recommended Reflow Profile MAX 260C T - TEMPERATURE (°C) 255 R3 230 217 200 180 R2 R4 60 sec to 90 , DRY 150 200 P3 SOLDER REFLOW 250 300 t-TIME (SECONDS) P4 COOL DOWN Symbol
Lite-On Technology
Original
ASDL-4360 ASDL-4360-C22

AV02-0274EN

Abstract: ASDL-4360 °C to Peak Temperature The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process , based on Tj ­ 110 °C and thermal resistance at 250 °C/W 2 0.6 0.8 Recommended Reflow Profile MAX 260C T - TEMPERATURE (°C) 255 R3 230 217 200 180 R2 R4 60 sec to 90 , DRY 150 200 P3 SOLDER REFLOW 250 300 t-TIME (SECONDS) P4 COOL DOWN Symbol
Avago Technologies
Original
AV02-0274EN

861VH509ER6

Abstract: RG179 BNC termination Reflow, 50 V-BiteTM Low Profile, 50 V-BiteTM with Flange, 50 , Threaded V-BiteTM with Flange, 75 , (4 GHz), Threaded V-BiteTM Low Profile for Reflow, 75 V-BiteTM with Flange, 75 , Threaded Lock Washer , 10-24 2.89 - 2.89 - 19 20 21 22 23 COAXIAL/RF CONNECTORS F type jacks for bulkhead, inline or PC , Male Terminator PC Board Jack, Right-Angle, Long PC Board Jack, Right-Angle, Short V-BiteTM PC Board Jack, Edge Mount, RG59 V-BiteTM PC Board Jack, Edge Mount, RG6, RG59 V-BiteTM PC Board Jack, Edge Mount
RS Components
Original
861V509E 861VH509ER6 335R544 RG179 BNC termination 910A204M 310A205MV SMA Connectors Bulkhead HBC1505A HBC1694A HBC1855A HBC179DT 179DT RG179

AYF32

Abstract: AYF323915 PC board pattern. · The recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile Y3FT/Y3F/Y3B Upper limit (Soldering heat resistance) Lower limit , the back of the PC board after reflow soldering the connector, secure the connector using, for , concentration 3±1 ppm, humidity 75 to 80% R.H. Reflow soldering Soldering iron Repeated insertion and , . Recommended PC board and metal mask patterns Appropriate control of solder amount is required to minimize
NAiS
Original
AYF32 AYF323915 TEMPERATURE CONTROL soldering iron AYF321515 AYF321715 AYF322315
Abstract: recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile , reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector , 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Reflow soldering Soldering iron Repeated , . Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.3 , reference. Recommended PC board pattern (Mount pad arrangement pattern) 0.50±0.03 Connector outline Panasonic
Original
201201-T1 AYF321115 AYF321315 ACCTB13E

AYF31

Abstract: AYF311515 recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile , . 70 sec. Time Y5S · When performing reflow soldering on the back of the PC board after , 5±1% Bath temperature 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Reflow soldering , embossed tape feeding direction Type Y3FT Direction of tape progress NOTES 1. Recommended PC , high-density mounting. Refer to the recommended PC board pattern. B±0.05 0.60±0.03 0.30±0.03 0.30±0.03
NAiS
Original
AYF31 AYF311515 AYF311715 AYF312315 AYF312515 AYF312715
Abstract: recommended reflow temperature profile is given in the figure below Recommended reflow temperature profile , reflow soldering on the back of the PC board after reflow soldering the connector, secure the connector , 40±2°C, gas concentration 3±1 ppm, humidity 75 to 80% R.H. Reflow soldering Soldering iron Repeated , Direction of tape progress Y3FT NOTES 1. Recommended PC board and metal mask patterns Connectors are , metal mask patterns. Please use them as a reference. Recommended PC board pattern (Mount pad Panasonic
Original

PBGA 256 reflow profile

Abstract: bt 2328 PBGA Assembly Reflow t Recommended profile: 210-215° C peak, 75 seconds above 183° C. (any standard surface mount reflow profile) t Follow guidelines recommended by Solder paste vendor t Flux , Six pads, four corners and two across middle. t Solder reflow process t Carefully profile with , Paste Type B PBGA Solder Joint Voids Second Void Study - Reflow Profile Experiments t Three-cell , Information PBGA Solder Joint Voids Second Void Study - Reflow Profile Experiments 6 to 7 3 to 4
Motorola
Original
PBGA 256 reflow profile bt 2328 pbga 144 OSP FLIPCHIP CRACK JESD22-A113 BGA cte

c110

Abstract: c177 -40 to +85 See reflow soldering profile (Figure 9 & 10) Units mA mA mW V °C °C °C Notes , FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX. Figure 9. Recommended Reflow Soldering Profile. Figure 10. Recommended Pb-Free Reflow Soldering Profile. 0.8 (0.031) 1.5 (0.059) 1.2 (0.047 , for all around use. The HSMx-C170 has the widely used 2.0 x 1.25 mm footprint with 0.8 mm profile. The HSMx-C177 has the widely used 2.0 x 1.25 mm footprint with 0.4 mm profile. The HSMx-C19x series
Agilent Technologies
Original
c110 c177 HSMG-C150 C150 C170 C190 C170/C177/C190/C191/ C197/C265
Abstract: high reliability. Reflow solderable. Slide Applications Rotary ● Encoders ● Power , SPVM110200 With SPVM210100 Without SPVM210200 Without terminal 1 1 For PC board , Two-way Operation Type SPVM Series Dimensions No. Unit:mm Photo PC board mounting hole , 260±5â"ƒ, Resistance to soldering heat soldering 5±1s Reflow soldering 350±5â"ƒ, 3s max , of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2 ALPS
Original
DC/50BA SPVM110100 SPPW81
Showing first 20 results.