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131-3114-11H
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Amphenol Communications Solutions
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Paladin® 112Gb/s Backplane Connector, 3-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP. |
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77311-415-03LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 03 Positions, 2.54 mm Pitch. |
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77311-418-07LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 07 Positions, 2.54 mm Pitch. |
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77311-418-18LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch. |
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77311-418-28LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch. |
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