NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: : 3 mm QQ Pitch: 0.5 mm ® QQ ST's lead-free ECOPACK2 , RoHS compliant www.st.com/eeprom Key , Dimensions x,y (mm) Thickness (max) (mm) Pitch (mm) 5.5 UFDFPN 2x3 0.6 0.5 3.6 UFDFPN 2x3 0.6 0.5 Supply voltage (Vcc) Generic part number Storage capacity (Kbits , packing for easy handling, easy as BGA for mounting QQ Thickness: from 0.65 down to 0.33 mm QQ Pitch , M95020-R M95020-R 2 SPI 1.8 5.5 UFDFPN 2x3 0.6 0.5 M24C04-F M24C04-F 4 I2C 1.7 5.5 ... | Original |
2 pages, |
ST 2x3 eeprom M24C02-R M24C04-R M24C08-R M93C66-R M95020-R M95040-R M95080-R ecopack2 0.5 mm pitch mlp ufdfpn datasheet abstract |
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| Abstract: : 3 mm QQ Pitch: 0.5 mm ® QQ ST's lead-free ECOPACK2 , RoHS compliant www.st.com/eeprom Key , Dimensions x,y (mm) Thickness (max) (mm) Pitch (mm) 5.5 UFDFPN 2x3 0.6 0.5 3.6 UFDFPN 2x3 0.6 0.5 Supply voltage (Vcc) Generic part number Storage capacity (Kbits , packing for easy handling, easy as BGA for mounting QQ Thickness: from 0.65 down to 0.33 mm QQ Pitch , M95020-R M95020-R 2 SPI 1.8 5.5 UFDFPN 2x3 0.6 0.5 M24C04-F M24C04-F 4 I2C 1.7 5.5 ... | Original |
2 pages, |
ecopack2 hearing aids M24C02-R M24C04-R M24C08-R M93C66-R M95020-R M95040-R M95080-R M95512-R ufdfpn ST 2x3 eeprom datasheet abstract |
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| Abstract: 0.5 mm pitch ® QQ ST's lead-free ECOPACK2 , RoHS compliant www.st.com/eeprom Key benefits QQ , packing for easy handling, easy as BGA for mounting QQ Thickness: from 0.65 mm to 0.33 mm QQ Pitch from , voltage (Vcc) max (V) Package Dimensions x,y (mm) Thickness (Max) (mm) Pitch (mm) M24C02-R M24C02-R 2 I2C 1.8 5.5 UFDFPN 2x3 0.6 0.5 M34E02-F M34E02-F 2 I2C 1.7 3.6 UFDFPN 2x3 0.6 0.5 M95020-R M95020-R 2 SPI 1.8 5.5 UFDFPN 2x3 0.6 0.5 ... | Original |
2 pages, |
M24C16-R M24C02-R M24C04-R M24C08-R M93C66-R M95020-R M95040-R M95080-R hearing aids ecopack M95M01-R BR-256 ST 2x3 eeprom ecopack2 datasheet abstract |
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| Abstract: (custom products). Body width Body length Body thickness Pitch MLP 5x6 (mm) 4.0 5.0 1.75 1.27 Body width Body length Body thickness Pitch 5 6 0.9 1.27 MLP 6x8 (mm) Body width , 1.27 TSOP (mm) TSOP32 TSOP32 (mm) 10.1 20.2 1.2 0.5 8.1 14.2 1.2 0.5 All these packages , thickness Pitch MLP 5x6 (mm) 4.0 5.0 1.75 1.27 Body width Body length Body thickness Pitch 5 6 0.9 1.27 MLP 6x8 (mm) Body width Body length Body thickness Pitch 6 8 0.9 1.27 ... | Original |
12 pages, |
stmicroelectronics traceability TSOP 28 SPI memory Package flash TSOP32 AN1470 SO8 WIDE M25P16 m25pe m25pe 512 MSOP8 Part marking M45PE20 M25PXX stmicroelectronics eeprom EEPROM 16Mb datasheet abstract |
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| Abstract: interconnect medium from die to PCB. The pads are arranged for easy PCB routing. The pitch is 0.5 mm and the , 2FAA-M20R 2FAA-M20R - Integrated Passive & Active Device using MLP General information The 2FAA-M20R 2FAA-M20R device , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test , applications. 2FAA-M20R 2FAA-M20R - Integrated Passive & Active Device using MLP pOURNS® Device Pin Out The Pin-Out for ... | OCR Scan |
4 pages, |
MT10 2FAA-M20R 0170 v1 0.5 mm pitch mlp 16 pin datasheet abstract |
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| Abstract: 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) 3.51 (0.138 , (0.016) 0.51 (0.020) 0.5 (0.020) How to Order 2.01 (0.0790) 2 FAA M 20 R 0.75 , using MLP General Information The 2FAA-M20R 2FAA-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test ... | Original |
4 pages, |
2FAA-M20R "IEC 61000" modem B0412 datasheet abstract |
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| Abstract: 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) 3.51 (0.138 , (0.016) 0.51 (0.020) 0.5 (0.020) How to Order 2.01 (0.0790) 2 FAB - M 20 R 0.75 , using MLP General Information The 2FAB-M20R 2FAB-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test ... | Original |
4 pages, |
2FAB-M20R "IEC 61000" modem B0412 datasheet abstract |
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| Abstract: pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) FAB , ) 3.51 (0.138) 0.40 (0.016) 2.01 (0.079) 0.51 (0.020) 0.5 (0.020) How to Order , using MLP General Information The 2FAB-M20R 2FAB-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test ... | Original |
4 pages, |
B0412 2FAB-M20R datasheet abstract |
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| Abstract: pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) FAA , ) 3.51 (0.138) 0.40 (0.016) 2.01 (0.079) 0.51 (0.020) 0.5 (0.020) How to Order , using MLP General Information The 2FAA-M20R 2FAA-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test ... | Original |
4 pages, |
B0412 2FAA-M20R "IEC 61000" modem datasheet abstract |
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| Abstract: pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.000 (0.1181) FAI , using MLP General Information The 2FAI-M16R 2FAI-M16R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3 mm x 3 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE E T E L O S B O Electrical & Thermal Characteristics Electrical ... | Original |
4 pages, |
B0412 2FAI-M16R datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| lead pitch of 0.5mm in a grid array. The grid is a 3 x 3 array of nine solder bumps with an filtering with a bandwidth-time (BT) product (bandwidth per bits) of 0.5 reduced to approximately 0.5uA. This digital shutdown control permits the PA to be turned on objectives include a cost of less than $1.00, a size of less than 10mm x 10mm, and solution (for example, SOIC-8 or MLP16 housings). This PA approach provides only the RF signal path www.datasheetarchive.com/files/maxim/0012/view_044.htm |
Maxim | 04/04/2001 | 34.92 Kb | HTM | view_044.htm |
| MLP Package Type, MLP 2.0 x 2.0 x 0.8mm Package,0.5mm Pitch | To operate at each Vcc, select the .258403E-1 258403E-1 258403E-1 258403E-1 -6.437921E-1 437921E-1 437921E-1 437921E-1 -5.998629E-1 998629E-1 998629E-1 998629E-1 -1.5138E0 -5.918893E-1 918893E-1 918893E-1 918893E-1 -6.111593E-1 111593E-1 111593E-1 111593E-1 -5.64375E-1 64375E-1 64375E-1 64375E-1 -1.476E0 -5.524149E-1 524149E-1 524149E-1 524149E-1 -5.732201E-1 732201E-1 732201E-1 732201E-1 -5.231116E-1 231116E-1 231116E-1 231116E-1 -1.4382E0 -5.13105E 13105E 13105E 13105E -1 -1.495E0 -5.722373E-1 722373E-1 722373E-1 722373E-1 -5.922713E-1 922713E-1 922713E-1 922713E-1 -5.438325E-1 438325E-1 438325E-1 438325E-1 -1.4425E0 -5.175677E 175677E 175677E 175677E 3.37117E-10 37117E-10 37117E-10 37117E-10 -1.8175E0 5.005703E-10 005703E-10 005703E-10 005703E-10 1.783501E-9 783501E-9 783501E-9 783501E-9 3.400267E-10 400267E-10 400267E-10 400267E-10 -1.84E0 5 www.datasheetarchive.com/files/fairchild/simulation-models/ft8010mpx.ibs |
Fairchild | 22/10/2012 | 1743.57 Kb | IBS | ft8010mpx.ibs |