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Part Manufacturer Description Datasheet BUY
BQ24022DRC Texas Instruments 2-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, 3 X 3 MM, MLP-10 visit Texas Instruments
BQ24023DRC Texas Instruments 2-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, 3 X 3 MM, MLP-10 visit Texas Instruments
BQ24020DRC Texas Instruments 2-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO10, 3 X 3 MM, MLP-10 visit Texas Instruments
ISL35822IK Intersil Corporation SPECIALTY TELECOM CIRCUIT, PBGA192, 17 X 17 MM, 1 MM PITCH, EBGA-192 visit Intersil
ISL35822LPIK Intersil Corporation SPECIALTY TELECOM CIRCUIT, PBGA192, 17 X 17 MM, 1 MM PITCH, EBGA-192 visit Intersil
BBT3821-JH Intersil Corporation SPECIALTY TELECOM CIRCUIT, PBGA192, 17 X 17 MM, 1 MM PITCH, EBGA-192 visit Intersil

0.5 mm pitch mlp

Catalog Datasheet MFG & Type PDF Document Tags

MLP8 2x3mm

Abstract: MLP8 m25p64 (custom products). Body width Body length Body thickness Pitch MLP 5x6 (mm) 4.0 5.0 1.75 1.27 Body width Body length Body thickness Pitch 5 6 0.9 1.27 MLP 6x8 (mm) Body width , thickness Pitch MLP 5x6 (mm) 4.0 5.0 1.75 1.27 Body width Body length Body thickness Pitch 5 6 0.9 1.27 MLP 6x8 (mm) Body width Body length Body thickness Pitch 6 8 0.9 1.27 , thickness Pitch TSSOP8 (mm) MSOP8 (mm) Devices offered in industrial and automotive temperature
STMicroelectronics
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IPC-7525

Abstract: jedec package MO-220 Dimension and Component Shear Strength Size and Pin Pad Pitch Pad Width Pad Length Count nom. (mm , broader MLP guidelines specified in IPC-SM-782. For lead pitch 0.65mm and above, the solder mask can , 12LD, MLP, QUAD, JEDEC MO-220, 4mm SQUARE MLP12C 14LD, DQFN, JEDEC MO-241, 2.mm X 3.0mm MLP14A , Pattern Design and Surface Mount Guidelines for MLP Packages Introduction MLP Package Construction , (MLP) has emerged as one of today's fastest growing packaging technologies due to a number of
Fairchild Semiconductor
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IPC-7525 jedec package MO-220 MO-229 footprint MO-229 MO-226 MLP06J MLP56A MLP64A MLP64B AN-5067

IC 4047

Abstract: GAAS FET rf switch CROSS REFERENCE platform offers low inductance I/O pads on a 0.5-mm pitch. In addition, an exposed conductive center die , 4.0 mm MLP package is shown in Figure 6. DIE DEVELOPMENT Once the package format was selected , 2.81 4.00 4.80 METALLIZED LEADFRAME 0.50 PITCH Dimensions in mm VIA 0.20 v Fig. 6 , per short side on a 0.5 mm pitch. The 2.8 × 4.8 mm center die pad must be soldered to the PCB to , PRODUCT FEATURE RF DIGITAL ATTENUATORS IN PLASTIC MLP PACKAGES B Fig. 1 Relative sizes
M/A-COM
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AT-263 AT-283 AT90-0001 IC 4047 GAAS FET rf switch CROSS REFERENCE 0.5 mm pitch mlp 16 pin ceramic attenuator MHz diode EGP 30 ic 4047 datasheet AT90XXXX AT90XXXX-TB

M45PE

Abstract: 4MB flash bios chip 8 pin ) (in mm) MLP 3X2 Body width Body length Body thickness Pitch PDIP 7.11 x 10.16mm PDIP8 7.11 10.16 5.33 2.54 Body width Body length Body thickness Pitch 2 3 0.9 0.5 MLP 2 x 3mm SO8W 7.70 x 5.15mm SO8N 6 x 5mm MLP 5 x 6mm (in mm) SO8W (in mm) SO8N (in mm) MLP 5X6 Body width Body length Body thickness Pitch 5.4 5.35 2.03 1.27 Body , thickness Pitch 5.0 6.0 0.9 1.27 TSSOP8 6.4 x 3mm (in mm) Body width Body length Body
STMicroelectronics
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PLCC32 TSSOP40 M45PE 4MB flash bios chip 8 pin m45pe40 CMOS SERIAL FLASH MSOP8 Package

C1620

Abstract: 2FAB-M20R pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) FAB , using MLP General Information The 2FAB-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE E T E L O S B O Electrical & Thermal Characteristics Electrical
Bourns
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C1620 B0412 EXT10 INT10 EIA-481

2FAA-M20R

Abstract: B0412 pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) FAA , using MLP General Information The 2FAA-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE E T E L O S B O Electrical & Thermal Characteristics Electrical
Bourns
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FAJ 20 ESD

Abstract: FAJ 20 using MLP General Information The 2FAJ-M16R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3 mm x 3 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE Electrical & Thermal Characteristics Electrical Characteristics Symbol , Active Device using MLP Product Dimensions Recommended Pad Layout This silicon-based device is
Bourns
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FAJ 20 ESD FAJ 20

B0412

Abstract: 2FAB-M20R using MLP General Information The 2FAB-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE Electrical & Thermal Characteristics Electrical Characteristics Symbol , Active Device using MLP Product Dimensions Recommended Pad Layout This silicon-based device is
Bourns
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B0412

Abstract: 2FAA-M20R using MLP General Information The 2FAA-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE Electrical & Thermal Characteristics Electrical Characteristics Symbol , Active Device using MLP Product Dimensions Recommended Pad Layout This silicon-based device is
Bourns
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B0412

Abstract: 2FAI-M16R pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.000 (0.1181) FAI , using MLP General Information The 2FAI-M16R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3 mm x 3 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE E T E L O S B O Electrical & Thermal Characteristics Electrical
Bourns
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FAJ 20 ESD

Abstract: 2FAJ-M16R pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.000 (0.1181) 0.700 , using MLP General Information The 2FAJ-M16R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3 mm x 3 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE E T E L O S B O Electrical & Thermal Characteristics Electrical
Bourns
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"IEC 61000" modem

Abstract: 2FAI-M16R using MLP General Information The 2FAI-M16R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3 mm x 3 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE Electrical & Thermal Characteristics Electrical Characteristics Symbol , Active Device using MLP Product Dimensions Recommended Pad Layout This silicon-based device is
Bourns
Original
Abstract: Operating Temperature Range -40C to +85C -40C to +85C Package 10-Lead, Ultrathin MLP, 1.4 x 1.8 x 0.55 mm Package, 0.40 mm Pitch 8-Lead, MLP 2.0 x 2.0 x 0.8 mm Package, 0.5 mm Pitch Packing Method , -Lead UMLP (1.4 mm x 1.8 mm) and 8-Lead MLP (2.0 mm x 2.0 mm) Packages Description The FT8010 is a timer , Leadless Package (MLP), 2.0 x 2.0 x 0.8 mm Package drawings are provided as a service to customers , Configuration Figure 2. MLP Pin Configuration(1) (Top Through View) Figure 3. UMLP Pin Configuration Fairchild Semiconductor
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FT8010UMX FT8010MPX W2020D V2009 MKT-MLP08R

2FAI-M16R

Abstract: B0412 using MLP General Information The 2FAI-M16R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3 mm x 3 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE Electrical & Thermal Characteristics Electrical Characteristics Symbol , Active Device using MLP Product Dimensions Recommended Pad Layout This silicon-based device is
Bourns
Original

FAJ 20 ESD

Abstract: B0412 using MLP General Information The 2FAJ-M16R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3 mm x 3 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE Electrical & Thermal Characteristics Electrical Characteristics Symbol , Active Device using MLP Product Dimensions Recommended Pad Layout This silicon-based device is
Bourns
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F B0412 FAJ ESD FAJ 40

ecopack2

Abstract: ST 2x3 eeprom packing for easy handling, easy as BGA for mounting QQ Thickness: from 0.65 down to 0.33 mm QQ Pitch , : 3 mm QQ Pitch: 0.5 mm ® QQ ST's lead-free ECOPACK2 , RoHS compliant www.st.com/eeprom Key , Dimensions x,y (mm) Thickness (max) (mm) Pitch (mm) 5.5 UFDFPN 2x3 0.6 0.5 3.6 , EEPROMs in miniature packages MLP 2x3, WLCSP Innovative solutions for EEPROMs As well as , millimeters with wafer level CSP or MLP 2x3 to allow you to save space and cost. The smallest packaging
STMicroelectronics
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M95512-R ecopack2 ST 2x3 eeprom ufdfpn I2C Memory ic hearing aids M95640-R M24C64-F M95128-R M24128-BF M24256-BF M24256-BR

ufdfpn

Abstract: ecopack2 packing for easy handling, easy as BGA for mounting QQ Thickness: from 0.65 down to 0.33 mm QQ Pitch , : 3 mm QQ Pitch: 0.5 mm ® QQ ST's lead-free ECOPACK2 , RoHS compliant www.st.com/eeprom Key , Dimensions x,y (mm) Thickness (max) (mm) Pitch (mm) 5.5 UFDFPN 2x3 0.6 0.5 3.6 , EEPROMs in miniature packages MLP 2x3, WLCSP Innovative solutions for EEPROMs As well as , millimeters with wafer level CSP or MLP 2x3 to allow you to save space and cost. The smallest packaging
STMicroelectronics
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0.5 mm pitch mlp M24C02-R M24C04-R M24C08-R M93C66-R M95020-R M95256-R M24512-R M24M01-R M95M01-R FLEEPROM1109

DSR+40

Abstract: Operating Temperature Range -40°C to +85°C -40°C to +85°C Package 10-Lead, Ultrathin MLP, 1.4 x 1.8 x 0.55 mm Package, 0.40 mm Pitch 8-Lead, MLP 2.0 x 2.0 x 0.8 mm Package, 0.5 mm Pitch Packing Method , -Lead UMLP (1.4 mm x 1.8 mm) and 8-Lead MLP (2.0 mm x 2.0 mm) Packages Description The FT8010 is a timer , -Lead, Ultrathin MLP, 1.4 x 1.8 x 0.55 mm Package Package drawings are provided as a service to customers , . 8-Lead, Molded Leadless Package (MLP), 2.0 x 2.0 x 0.8 mm Package drawings are provided as a
Fairchild Semiconductor
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DSR+40

0.5 mm pitch mlp 16 pin

Abstract: 2FAA-M20R arranged for easy PCB routing. The pitch is 0.5 mm and the dimensions for the packaged device are shown , and SMART Cards 2FAA-M20R - Integrated Passive & Active Device using MLP General information The , per the ESD test method specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal , performance in their specific applications. 2FAA-M20R - Integrated Passive & Active Device using MLP pOURNSÂ
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OCR Scan
MT10 0170 v1

mlp8 land pattern

Abstract: Operating Temperature Range -40C to +85C -40C to +85C Package 10-Lead, Ultrathin MLP, 1.4 x 1.8 x 0.55mm Package, 0.40 mm Pitch 8-Lead, Molded Leadless Package (MLP), Dual JEDEC, MO-229 2.0 x 2.0 mm , , 1.4 x 1.8 x 0.55 mm Package, 0.40 mm Pitch Package drawings are provided as a service to customers , . 8-Lead, Molded Leadless Package (MLP), Dual JEDEC, MO-229 2.0 x 2.0 mm Package drawings are , at TA = -40C to +85C Available in 8-Lead MLP and 10-Lead UMLP Packages ESD Protection Exceeds
Fairchild Semiconductor
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mlp8 land pattern FT3001 JESD22-A114 FT3001UMX FT3001MPX
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