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MC9S08GB32ACFUER Freescale Semiconductor IC 8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, 0.5 MM PITCH, MS-026BCD, LQFP-64, Microcontroller ri Buy
MC9S08GB32ACFUE Freescale Semiconductor IC 8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, 0.5 MM PITCH, MS-026BCD, LQFP-64, Microcontroller ri Buy
MC9S08GB60ACFUE Freescale Semiconductor IC 8-BIT, FLASH, 40 MHz, MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, 0.5 MM PITCH, MS-026BCD, LQFP-64, Microcontroller ri Buy

0.5 mm pitch mlp

Catalog Datasheet Results Type PDF Document Tags
Abstract: : 3 mm QQ Pitch: 0.5 mm ® QQ ST's lead-free ECOPACK2 , RoHS compliant www.st.com/eeprom Key , Dimensions x,y (mm) Thickness (max) (mm) Pitch (mm) 5.5 UFDFPN 2x3 0.6 0.5 3.6 UFDFPN 2x3 0.6 0.5 Supply voltage (Vcc) Generic part number Storage capacity (Kbits , packing for easy handling, easy as BGA for mounting QQ Thickness: from 0.65 down to 0.33 mm QQ Pitch , M95020-R M95020-R 2 SPI 1.8 5.5 UFDFPN 2x3 0.6 0.5 M24C04-F M24C04-F 4 I2C 1.7 5.5 ... Original
datasheet

2 pages,
2616.27 Kb

M95020-R hearing aids M95512-R M95080-R M95040-R M24C02-R M93C66-R M24C08-R M24C04-R ufdfpn ecopack2 ST 2x3 eeprom datasheet abstract
datasheet frame
Abstract: : 3 mm QQ Pitch: 0.5 mm ® QQ ST's lead-free ECOPACK2 , RoHS compliant www.st.com/eeprom Key , Dimensions x,y (mm) Thickness (max) (mm) Pitch (mm) 5.5 UFDFPN 2x3 0.6 0.5 3.6 UFDFPN 2x3 0.6 0.5 Supply voltage (Vcc) Generic part number Storage capacity (Kbits , packing for easy handling, easy as BGA for mounting QQ Thickness: from 0.65 down to 0.33 mm QQ Pitch , M95020-R M95020-R 2 SPI 1.8 5.5 UFDFPN 2x3 0.6 0.5 M24C04-F M24C04-F 4 I2C 1.7 5.5 ... Original
datasheet

2 pages,
146.44 Kb

ST 2x3 eeprom M24C02-R M24C04-R M24C08-R M93C66-R M95020-R M95040-R M95080-R 0.5 mm pitch mlp ecopack2 ufdfpn datasheet abstract
datasheet frame
Abstract: 0.5 mm pitch ® QQ ST's lead-free ECOPACK2 , RoHS compliant www.st.com/eeprom Key benefits QQ , packing for easy handling, easy as BGA for mounting QQ Thickness: from 0.65 mm to 0.33 mm QQ Pitch from , voltage (Vcc) max (V) Package Dimensions x,y (mm) Thickness (Max) (mm) Pitch (mm) M24C02-R M24C02-R 2 I2C 1.8 5.5 UFDFPN 2x3 0.6 0.5 M34E02-F M34E02-F 2 I2C 1.7 3.6 UFDFPN 2x3 0.6 0.5 M95020-R M95020-R 2 SPI 1.8 5.5 UFDFPN 2x3 0.6 0.5 ... Original
datasheet

2 pages,
145.26 Kb

M24C16-R M24C02-R M24C04-R M24C08-R M93C66-R M95020-R M95040-R M95080-R hearing aids ecopack M95M01-R BR-256 ST 2x3 eeprom ecopack2 datasheet abstract
datasheet frame
Abstract: (custom products). Body width Body length Body thickness Pitch MLP 5x6 (mm) 4.0 5.0 1.75 1.27 Body width Body length Body thickness Pitch 5 6 0.9 1.27 MLP 6x8 (mm) Body width , 1.27 TSOP (mm) TSOP32 TSOP32 (mm) 10.1 20.2 1.2 0.5 8.1 14.2 1.2 0.5 All these packages , thickness Pitch MLP 5x6 (mm) 4.0 5.0 1.75 1.27 Body width Body length Body thickness Pitch 5 6 0.9 1.27 MLP 6x8 (mm) Body width Body length Body thickness Pitch 6 8 0.9 1.27 ... Original
datasheet

12 pages,
627.91 Kb

TSOP32 footprint m25pe STMicroelectronics marking code date me 128x512Kb SO8 WIDE AN1470 MSOP8 Part marking M45PE20 M25PXX m25pe 512 M25P16 stmicroelectronics eeprom EEPROM 16Mb datasheet abstract
datasheet frame
Abstract: interconnect medium from die to PCB. The pads are arranged for easy PCB routing. The pitch is 0.5 mm and the , 2FAA-M20R 2FAA-M20R - Integrated Passive & Active Device using MLP General information The 2FAA-M20R 2FAA-M20R device , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test , applications. 2FAA-M20R 2FAA-M20R - Integrated Passive & Active Device using MLP pOURNS® Device Pin Out The Pin-Out for ... OCR Scan
datasheet

4 pages,
242.7 Kb

MT10 2FAA-M20R 0170 v1 0.5 mm pitch mlp 16 pin datasheet abstract
datasheet frame
Abstract: 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) 3.51 (0.138 , (0.016) 0.51 (0.020) 0.5 (0.020) How to Order 2.01 (0.0790) 2 FAA ­ M 20 R 0.75 , using MLP General Information The 2FAA-M20R 2FAA-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test ... Original
datasheet

4 pages,
289.61 Kb

2FAA-M20R "IEC 61000" modem B0412 datasheet abstract
datasheet frame
Abstract: 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) 3.51 (0.138 , (0.016) 0.51 (0.020) 0.5 (0.020) How to Order 2.01 (0.0790) 2 FAB - M 20 R 0.75 , using MLP General Information The 2FAB-M20R 2FAB-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test ... Original
datasheet

4 pages,
290.1 Kb

2FAB-M20R "IEC 61000" modem B0412 datasheet abstract
datasheet frame
Abstract: pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) FAA , ) 3.51 (0.138) 0.40 (0.016) 2.01 (0.079) 0.51 (0.020) 0.5 (0.020) How to Order , using MLP General Information The 2FAA-M20R 2FAA-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test ... Original
datasheet

4 pages,
302.28 Kb

B0412 2FAA-M20R "IEC 61000" modem datasheet abstract
datasheet frame
Abstract: pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) FAB , ) 3.51 (0.138) 0.40 (0.016) 2.01 (0.079) 0.51 (0.020) 0.5 (0.020) How to Order , using MLP General Information The 2FAB-M20R 2FAB-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test ... Original
datasheet

4 pages,
302.81 Kb

B0412 2FAB-M20R datasheet abstract
datasheet frame
Abstract: performance as shown in this application note from any Fairchild part in an MLP package with pitches from 0.5 , with the broader MLP guidelines specified in IPC-SM-782 IPC-SM-782. For lead pitch 0.65mm and above, the , 0.5 to 1 mil in the hole. Moreover, HASL contains lead which is not acceptable in Pb-free , MLP12B MLP12B 12LD, MLP, QUAD, JEDEC MO-220 MO-220, 4mm SQUARE MLP12C MLP12C 14LD, DQFN, JEDEC MO-241 MO-241, 2.mm X 3.0mm , Pattern Design and Surface Mount Guidelines for MLP Packages Introduction MLP Package Construction ... Original
datasheet

13 pages,
573.13 Kb

IPC7525 IPC-SM-782 IPC 9701 AN-5067 MLP08I MLP10A MLP48 MO-220 sn63pb37 solder wire MO-220 packaging MLP06A IPC-SM-785 MLP32A mo-229 pad layout AN-5067 abstract
datasheet frame

Datasheet Content (non pdf)

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www.datasheetarchive.com/download/31640697-365068ZC/1978a.zip (DC1810A.DSN)
Linear 30/08/2012 4880.49 Kb ZIP 1978a.zip