500 MILLION PARTS FROM 12000 MANUFACTURERS

Datasheet Archive - Datasheet Search Engine

 

0.5 mm pitch mlp

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: (custom products). Body width Body length Body thickness Pitch MLP 5x6 (mm) 4.0 5.0 1.75 1.27 Body width Body length Body thickness Pitch 5 6 0.9 1.27 MLP 6x8 (mm) Body width , thickness Pitch MLP 5x6 (mm) 4.0 5.0 1.75 1.27 Body width Body length Body thickness Pitch 5 6 0.9 1.27 MLP 6x8 (mm) Body width Body length Body thickness Pitch 6 8 0.9 1.27 , thickness Pitch TSSOP8 (mm) MSOP8 (mm) Devices offered in industrial and automotive temperature ... STMicroelectronics
Original
datasheet

12 pages,
627.91 Kb

FLASH NOR 64mb M25PXX AN1470 SO8 WIDE m25pe 512 M25P16 M45PE20 128x512Kb m25pe MSOP8 Part marking STMicroelectronics marking code date me stmicroelectronics eeprom EEPROM 16Mb M25P SO8 NARROW AN2043 MARKING code mf stmicroelectronics MLP8 m25p64 MLP8 2x3mm TEXT
datasheet frame
Abstract: Dimension and Component Shear Strength Size and Pin Pad Pitch Pad Width Pad Length Count nom. (mm , broader MLP guidelines specified in IPC-SM-782 IPC-SM-782. For lead pitch 0.65mm and above, the solder mask can , 12LD, MLP, QUAD, JEDEC MO-220 MO-220, 4mm SQUARE MLP12C MLP12C 14LD, DQFN, JEDEC MO-241 MO-241, 2.mm X 3.0mm MLP14A MLP14A , Pattern Design and Surface Mount Guidelines for MLP Packages Introduction MLP Package Construction , (MLP) has emerged as one of today's fastest growing packaging technologies due to a number of ... Fairchild Semiconductor
Original
datasheet

13 pages,
573.13 Kb

MLP06C MLP06K IPC-SM-782 AN-5067 MLP10A MLP24A MLP16A MLP06A MO-220 packaging IPC-SM-785 MLP32A mo-229 pad layout Thin Quad flat package mo-220 IPC-9701 MLP06J JEDEC Drawing MO-220 7mm MO-226 MO-229 MO-229 footprint IPC-7525 TEXT
datasheet frame
Abstract: platform offers low inductance I/O pads on a 0.5-mm pitch. In addition, an exposed conductive center die , 4.0 mm MLP package is shown in Figure 6. DIE DEVELOPMENT Once the package format was selected , 2.81 4.00 4.80 METALLIZED LEADFRAME 0.50 PITCH Dimensions in mm VIA 0.20 v Fig. 6 , per short side on a 0.5 mm pitch. The 2.8 × 4.8 mm center die pad must be soldered to the PCB to , PRODUCT FEATURE RF DIGITAL ATTENUATORS IN PLASTIC MLP PACKAGES B Fig. 1 Relative sizes ... M/A-COM
Original
datasheet

6 pages,
84.4 Kb

MMIC cross AT-106 AT-107 AT-263 AT-283 AT90-0001 AT90-0106 AT90-0107 data sheet of IC 4047 Driver IC 4047 GAAS FET CROSS REFERENCE HP MMIC ic 4047 datasheet ceramic attenuator MHz diode EGP 30 0.5 mm pitch mlp 16 pin GAAS FET rf switch CROSS REFERENCE IC 4047 TEXT
datasheet frame
Abstract: ) (in mm) MLP 3X2 Body width Body length Body thickness Pitch PDIP 7.11 x 10.16mm PDIP8 7.11 10.16 5.33 2.54 Body width Body length Body thickness Pitch 2 3 0.9 0.5 MLP 2 x 3mm SO8W 7.70 x 5.15mm SO8N 6 x 5mm MLP 5 x 6mm (in mm) SO8W (in mm) SO8N (in mm) MLP 5X6 Body width Body length Body thickness Pitch 5.4 5.35 2.03 1.27 Body , thickness Pitch 5.0 6.0 0.9 1.27 TSSOP8 6.4 x 3mm (in mm) Body width Body length Body ... STMicroelectronics
Original
datasheet

8 pages,
320.17 Kb

M24C64 M24C04 M24C08 M24C16 M24C32 M24C01 M25P M24128B CMOS SERIAL FLASH M50FW002 MSOP8 Package PLCC32 SO8N SO8w footprint M24C02 TSSOP40 m45pe40 M45PE 4MB flash bios chip 8 pin TEXT
datasheet frame
Abstract: pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) FAB , using MLP General Information The 2FAB-M20R 2FAB-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE E T E L O S B O Electrical & Thermal Characteristics Electrical ... Bourns
Original
datasheet

4 pages,
302.81 Kb

B0412 2FAB-M20R TEXT
datasheet frame
Abstract: pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) FAA , using MLP General Information The 2FAA-M20R 2FAA-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE E T E L O S B O Electrical & Thermal Characteristics Electrical ... Bourns
Original
datasheet

4 pages,
302.28 Kb

B0412 2FAA-M20R "IEC 61000" modem TEXT
datasheet frame
Abstract: using MLP General Information The 2FAJ-M16R 2FAJ-M16R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3 mm x 3 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE Electrical & Thermal Characteristics Electrical Characteristics Symbol , Active Device using MLP Product Dimensions Recommended Pad Layout This silicon-based device is ... Bourns
Original
datasheet

4 pages,
278.12 Kb

B0412 2FAJ-M16R "IEC 61000" modem FAJ 20 ESD FAJ 20 TEXT
datasheet frame
Abstract: using MLP General Information The 2FAB-M20R 2FAB-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE Electrical & Thermal Characteristics Electrical Characteristics Symbol , Active Device using MLP Product Dimensions Recommended Pad Layout This silicon-based device is ... Bourns
Original
datasheet

4 pages,
290.1 Kb

2FAB-M20R "IEC 61000" modem B0412 TEXT
datasheet frame
Abstract: using MLP General Information The 2FAA-M20R 2FAA-M20R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE Electrical & Thermal Characteristics Electrical Characteristics Symbol , Active Device using MLP Product Dimensions Recommended Pad Layout This silicon-based device is ... Bourns
Original
datasheet

4 pages,
289.61 Kb

2FAA-M20R "IEC 61000" modem B0412 TEXT
datasheet frame
Abstract: using MLP General Information The 2FAI-M16R 2FAI-M16R device, manufactured using Thin Film on Silicon , specified in IEC 61000-4-2. The device measures 3 mm x 3 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. MLP PACKAGE Electrical & Thermal Characteristics Electrical Characteristics Symbol , Active Device using MLP Product Dimensions Recommended Pad Layout This silicon-based device is ... Bourns
Original
datasheet

4 pages,
277.5 Kb

B0412 2FAI-M16R "IEC 61000" modem TEXT
datasheet frame

Archived Files

Abstract Saved from Date Saved File Size Type Download
No abstract text available
/download/9761900-868466ZC/hotline.tar
Texas Instruments 08/02/1999 15343 Kb TAR hotline.tar