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"lead material" DIP

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Abstract: of Ron (see Functional Description). All devices are available in 16 lead DIP packages. The HI , PART NUMBER TEMPERATURE RANGE PACKAGE H11-5040-7 H11-5040-7 0°C to +75°C + 96 Hr. Burn-In 16 Lead Ceramic DIP HI1-5048-5 HI1-5048-5 0°C to +75°C 16 Lead Ceramic DIP HI1-5048-7 HI1-5048-7 0°C to +75°C + 96 Hr. Burn-In 16 Lead Ceramic DIP HI3-5040-5 HI3-5040-5 0°C to +75°C 16 Lead Plastic DIP H11-5040-2 H11-5040-2 -55°C to +125°C 16 Lead Ceramic DIP HI3-5048-5 HI3-5048-5 0°C to +75°C 16 Lead Plastic DIP H11-5040-5 H11-5040-5 0°C to +75°C 16 Lead Ceramic DIP ... OCR Scan
datasheet

11 pages,
360.88 Kb

IH5048 H11-5040-5 h13-50 DG180 HI-5046A HI-5047 HI-5047A HI-5048 HI-5050 HI-5051 h1-5051 HI-5040 H13-5042-5 H1-5046 H1-5043 H11-5051-5 TEXT
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Abstract: width and depth • Parallel cascade minimizes bubble-through • 5V ± 10% supply • 300-mil DIP , reset logic -EF .FF -xö/hf C420-1 C420-1 DIP Top View c420-3 Cypress Semiconductor Corporation ESöTbbE , Plastic Leaded Chip Carrier Commercial CY7C419 CY7C419— 10PC P21 28-Lead (300-MU 300-MU) Molded DIP CY7C419 CY7C419â , CY7C419-15PC CY7C419-15PC P21 28-Lead (300-MU 300-MU) Molded DIP CY7C419-15VC CY7C419-15VC V21 28-tead (300-MU 300-MU) Molded SOJ CY7C419 CY7C419 , -MU) Molded DIP CY7C419-15 CY7C419-15 VI V21 28-tead (300-MU 300-MU) Molded SOJ . CY7C419- CY7C419- 15DMB 15DMB, » 'JÖ22 . 28 ... OCR Scan
datasheet

24 pages,
1125.85 Kb

CY7C419 IDT7204 IDT7203 IDT7202 CY7C429 CY7C428 CY7C428-25PC uv led 365 B 503 Potentiometers U 2561B V0120 2561b Y7C425 TEXT
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Abstract: €¢ Parallel cascade minimizes bubble-through • 5V ± 10% supply • 300-mil DIP packaging • 7x7 TQFP â , prevented by careful layout and guard rings. Logic Block Diagram Pin Configurations DIP Top View 5-26 , €”10PC P21 28-Lead (300-Mil) Molded DIP CY7C419 CY7C419—10VC V21 28-Lead (300-Mil) Molded SOJ 15 CY7C419 CY7C419â , Carrier CY7C419 CY7C419—15PC P21 28-Lead (300-Mil) Molded DIP CY7C419- CY7C419- 15VC V21 28-Lead (300-Mil) Molded , -Lead (300-Mil) Molded DIP CY7C419 CY7C419—15VI V21 28-Lead (300-Mil) Molded SOJ CY7C419 CY7C419 — 15DMB 15DMB D22 28 ... OCR Scan
datasheet

22 pages,
826.6 Kb

IDT7204 CY7C419 FF p21 IDT7200 IDT7201 IDT7202 IDT7203 CY7C425- cy7c421 B 503 Potentiometers CY7C419/21/25/29/33 TEXT
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Abstract: PACKAGING PACKAGE/PIN COUNT PART NAME DIP M80C85AH M80C85AH CPUs M 80C86A-10 80C86A-10 M 80C88A-10 80C88A-10 M 81C55-5 81C55-5 M82C12 M82C12 , 20 20 40 40 40 40 24 40 28 24 24 40 28 18 20 32 32 32 32 - i /n l/U DIP, while GS denotes plastic QFP/SO P, and JS denote QFJ. DIP QFP/SOP QFJ PACKAGING - · 18 PIN PLASTIC DIP DIP18-P-300 DIP18-P-300 22.6. 0.2 mu Package material Lead tram« materia! Pin treatment , . · 24 PIN PLASTIC DIP DIP24-P-600 DIP24-P-600 INDEX MARK / © < , 2 C O SEATING 5 PLANE 1 ® s 2 1 ... OCR Scan
datasheet

6 pages,
146.87 Kb

82C54-2 DIP40-P-600 OKI M82C37B-5 80C88A-10 M82C59A-2 m82c84a-2 M82C88-2 oki m82c55a-2 m82c55a-2 M82C12 OKI M82C51a-2 M82C51A-2 m80c85ah M80C85AH M80C85AH 80C86A-10 80C86A-10 81C55-5 82C53-2 M82C55A-2 M82C84A-2 TEXT
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Abstract: ) TTL-compatible Width and Depth Expansion Capability 5V± 10% supply PLCC, LCC, 300-mil and 600-mil DIP , EXPANSION LOGIC Pin Configurations PLCC/LCC Top View RESET LOGIC ■ MR ■ FL/RT . EF ■ FF DIP Top , Carrier Commercial CY7C460A-1 CY7C460A-1 OPC P15 28-Lead (600-Mil) Molded DIP CY7C460A-1 CY7C460A-1 OPTC P21 28-Lead (300-Mil) Molded DIP CY7C460A-1OJI CY7C460A-1OJI J65 32-Lead Plastic Leaded Chip Carrier Industrial 15 CY7C460A-15JC CY7C460A-15JC J65 32-Lead Plastic Leaded Chip Carrier Commercial CY7C460A-15PC CY7C460A-15PC P15 28-Lead (600-Mil) Molded DIP CY7C460A-15 CY7C460A-15 PTC ... OCR Scan
datasheet

15 pages,
544.27 Kb

P15 Package IDT7208 IDT7207 IDT7206 IDT7205 CY7C466A CY7C464A CY7C462A CY7C460A 8K/16K/32K/64K TEXT
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Abstract: compatible Retransmit in standalone Expandable in width PLCC, 7x7 TQFP, SOJ, 300-mil and 600-mil DIP Pin , .ef .ff .xo/hf DIP Top View 4 3 2 lì 323130 »5 2sc .cfe di f >6 28c ^ >7 27c 1 nc >8 , CY7C419-1 CY7C419-1 OPC P21 28-Lead (300-Mil) Molded DIP CY7C41 CY7C41 9-1 OVC V21 28-Lead (300-Mil) Molded SOJ 15 , Operating Range 25 CY7C420 CY7C420—25PC P15 28-Lead (600-Mil) Molded DIP Commercial 40 CY7C420 CY7C420—40PC P15 28-Lead (600-Mil) Molded DIP Commercial 65 CY7C420 CY7C420—65PC P15 28-Lead (600-Mil) Molded DIP Commercial ... OCR Scan
datasheet

21 pages,
659.88 Kb

IDT7204 CY7C421 CY7C425 CY7C428-65PC CY7C429 CY7C433 IDT7200 IDT7201 IDT7202 IDT7203 CY7C419 CY7C419/21/25/29/33 TEXT
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Abstract: . The CY7C130 CY7C130 and CY7C140 CY7C140 are available in both 48-pin DIP and 48-pin LCC. The CY7C131 CY7C131 and CY7C141 CY7C141 are available in 52-pin LCC, PLCC, and POFP. Logic Block Diagram Pin Configurations DIP B0S?L AOL - üel-R , Range 30 CY7C130 CY7C130—30PC P25 48-Lead (600-Mil) Molded DIP Commercial CY7C130 CY7C130—30PI P25 48-Lead (600-Mil) Molded DIP Industrial 35 CY7C130 CY7C130—35PC P25 48-Lead (600-Mil) Molded DIP Commerciai CY7C130 CY7C130—35PI P25 48-Lead (600-Mil) Molded DIP Industrial CY7C130 CY7C130—35DMB 35DMB D26 48-Lead (600-Mil) Sidebraze DIP ... OCR Scan
datasheet

13 pages,
405.73 Kb

ZT12 IDT7140 IDT7130 CY7C141 CY7C140 CY7C131 CY7C130 cy7c131-55nc CY7C130/CY7C131 CY7C140/CY7C141 TEXT
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Abstract: port-to-port communication (52-pin PLCC/PQFP versions) • Available in 48-pin DIP (CY7C132/142 CY7C132/142), 52 , CY7C132/CY7C142 CY7C132/CY7C142 are available in 48-pin DIP. The CY7C136/CY7C146 CY7C136/CY7C146 are available in 52-pin PLCC and PQFP , ) and interruptlogic (7c136/7c146 only) ■ CER ■SËr ■ R/WR i ntj2l INTr[2] c132-1 DIP Top , Package Type Operating Range 30 CY7C132-30PC CY7C132-30PC P25 48-Lead (600-M 600-M I) Molded DIP Commercial CY7C132-30PI CY7C132-30PI P25 48-Lead (600-M 600-M I) Molded DIP Industrial 35 CY7C132-35PC CY7C132-35PC P25 48-Lead (600-M 600-M I) Molded DIP ... OCR Scan
datasheet

18 pages,
721.65 Kb

idt7132 CY7C146 CY7C136 CY7C132 2Kx8 Dual-Port Static RAM TEXT
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Abstract: Standard dual-in-line packages (DIP), which fulfill these basic requirements, have enjoyed wide usage in , Smaller size SURFACE MOUNTING TYPE DIP SOP SSOP SOJ TSOP QFJ ZIP Higher Pin Count TQFP/LQFP QFP SKINNY DIP TCP PGA SHRINK-DIP BGA/LGA CSP Figure 1.1.1 Packaging Trend , (DIP, ZIP, SIP, PGA, etc.) 80 Usage rate (%) 60 Surface mounting type package (SOP, QFP , Ceramic & CER-DIP Surface Mounting Type Throughhole Mounting Type DIP Dual Lead Rows ... OKI Electric Industry
Original
datasheet

25 pages,
1635.85 Kb

ED-7401-2 QFP 64 Cavity package TSOP 86 land pattern HQFP208-P-4040-0 QFP 128 bonding land pattern for TSOP land pattern for TSOP 2 44 PIN ED730 land pattern for TSOP 2 86 SOJ 44 PCB land land pattern tsop 66 Reliability Data Plastic Packages QFP TSOP 66 pin Package thermal resistance ic packages TSOP 54 land pattern oki naming qfp 64 0.4 mm pitch land pattern land pattern for TSOP 56 pin land pattern for TSOP 2 54 pin land pattern for TSOP 2 86 PIN TEXT
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Abstract: flag for port-to-port communication • Available in 48-pin DIP (CY7C130/140 CY7C130/140), 52-pin PLCCand 52 , are available in 48-pin DIP. The CY7C131 CY7C131 and CY7C141 CY7C141 are available in 52-pin PLCC and PQFP Logic , ■ OEr ■ R/Wr _[2] INTL 1 W21 Pin Configurations DIP Top View cel C 1 48 h Voc R/WL C 2 , ) Ordering Code Package Name Package Type Operating Range 30 CY7C130-30PC CY7C130-30PC P25 48-Lead (600-M 600-M I) Molded DIP Commercial CY7C130-30PI CY7C130-30PI P25 48-Lead (600-M 600-M I) Molded DIP Industrial 35 CY7C130-35PC CY7C130-35PC P25 48-Lead (600-M 600-M I ... OCR Scan
datasheet

16 pages,
675.9 Kb

CY7C141 CY7C140 CY7C131 CY7C130 TEXT
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Archived Files

Abstract Saved from Date Saved File Size Type Download
DIP SOT23-5 LEAD FRAME MATERIAL Copper Copper Copper Copper LEAD COATING Tin plating Tin plating Tin set in the ST qualification program UDCS_0118623. Then device TS954 TS954 is qualified for SOIC,DIP and
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/7556.htm
STMicroelectronics 31/01/2001 8.37 Kb HTM 7556.htm
SOLDERABILITY MONITOR SOLDERABILITY DOUBLE SOLDER DIP FLOW
/datasheets/files/texas-instruments/sc/docs/military/quality/sts/assyspc.htm
Texas Instruments 17/12/1996 11.17 Kb HTM assyspc.htm
0.6 0.5 + 0.6 0.5 + 0.6 PACKAGE TYPE SO TSSOP DIP SOT23-5 LEAD FRAME MATERIAL Copper Copper Copper program UDCS_0118623. Then device TS924 TS924 is qualified for SOIC,DIP and TSSOP packages. NB : Detailed
/datasheets/files/stmicroelectronics/stonline/books/ascii/docs/7553.htm
STMicroelectronics 31/01/2001 9.9 Kb HTM 7553.htm
インデックス Type Package name Package Material* 1 Lead pitch Lead shape Lead pull-out direction Sony Package mark Symbol Description Inserted Standard DIP DUAL  IN-LINE  PACKAGE P C 2.54mm  (100mil) Through Hole Lead 2-direction P D SIP SINGLE  IN-LINE  PACKAGE P 1-direction L ZIP ZIG-ZAG 
/datasheets/files/sony/dataseet/package.html
Sony 30/10/1998 9.61 Kb HTML package.html
speed and noise immunity) Available in 24-pin standard slim DIP (300mil) plastic or SOL
/datasheets/files/philips/pip/74f30244_3-v1.html
Philips 14/02/2002 15.31 Kb HTML 74f30244_3-v1.html
brake down of element. (1) Use Rosin type flux or non-activated flux. (2) Do not dip the body into
/datasheets/files/murata/products/data/a11x/nthtu02.txt
Murata 08/10/1996 3.21 Kb TXT nthtu02.txt
Contact: Phosphor Bronze Plating: 1 m Hot Tin/Lead Dip PCB Mounting Hole Diameter: 22
/datasheets/files/molex/docs/00001/001f9.htm
Molex 20/12/1997 4.28 Kb HTM 001f9.htm
No abstract text available
/download/52510554-169551ZC/sitacopt.zip ()
Infineon 19/02/2000 23.57 Kb ZIP sitacopt.zip
hole DIP configurations in the molded dual-in-line package (MDIP) style. Other through hole
/datasheets/files/national/htm/nsc00046-v3.htm
National 13/08/1999 15.09 Kb HTM nsc00046-v3.htm
compound used for large die applications. National offers through hole DIP configurations in the
/datasheets/files/national/docs/wcd00000/wcd00061.htm
National 03/04/1998 11.27 Kb HTM wcd00061.htm