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Part Manufacturer Description Datasheet BUY
CS4234-ENZR Cirrus Logic Analog Circuit, 1 Func, 6 X 6 MM, LEAD FREE, QFN-40 visit Digikey
CS8422-CNZ Cirrus Logic Consumer Circuit, CMOS, 5 X 5 MM, LEAD FREE, MO-220, QFN-32 visit Digikey
CS42L51-DNZR Cirrus Logic Consumer Circuit, 5 X 5 MM, LEAD FREE, MO-220, QFN-32 visit Digikey
CS42L52-CNZR Cirrus Logic Consumer Circuit, 6 X 6 MM, LEAD FREE, MO-220, QFN-40 visit Digikey
CS42L52-DNZ Cirrus Logic Consumer Circuit, 6 X 6 MM, LEAD FREE, MO-220, QFN-40 visit Digikey
CS42L52-DNZR Cirrus Logic Consumer Circuit, 6 X 6 MM, LEAD FREE, MO-220, QFN-40 visit Digikey

"lead material" DIP

Catalog Datasheet MFG & Type PDF Document Tags
Abstract: of Ron (see Functional Description). All devices are available in 16 lead DIP packages. The HI , PART NUMBER TEMPERATURE RANGE PACKAGE H11-5040-7 0°C to +75°C + 96 Hr. Burn-In 16 Lead Ceramic DIP HI1-5048-5 0°C to +75°C 16 Lead Ceramic DIP HI1-5048-7 0°C to +75°C + 96 Hr. Burn-In 16 Lead Ceramic DIP HI3-5040-5 0°C to +75°C 16 Lead Plastic DIP H11-5040-2 -55°C to +125°C 16 Lead Ceramic DIP HI3-5048-5 0°C to +75°C 16 Lead Plastic DIP H11-5040-5 0°C to +75°C 16 Lead Ceramic DIP -
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HI-5040 HI-5051 HI-5046A HI-5047A HI-5048 HI-5047 H11-5051-5 H1-5043 H1-5046 H13-5042-5 h1-5051
Abstract: width and depth â'¢ Parallel cascade minimizes bubble-through â'¢ 5V ± 10% supply â'¢ 300-mil DIP , reset logic -EF .FF -xö/hf C420-1 DIP Top View c420-3 Cypress Semiconductor Corporation ESöTbbE , Plastic Leaded Chip Carrier Commercial CY7C419â'" 10PC P21 28-Lead (300-MU) Molded DIP CY7C419â , CY7C419-15PC P21 28-Lead (300-MU) Molded DIP CY7C419-15VC V21 28-tead (300-MU) Molded SOJ CY7C419 , -MU) Molded DIP CY7C419-15 VI V21 28-tead (300-MU) Molded SOJ . CY7C419- 15DMB, » 'JÃ22 . 28 -
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IDT7202 IDT7203 IDT7204 CY7C429 Y7C425 V0120 U 2561B 2561b B 503 Potentiometers CY7C428-25PC IDT7200 EDT7201 CY7C419/21/25/29/33
Abstract: '¢ Parallel cascade minimizes bubble-through â'¢ 5V ± 10% supply â'¢ 300-mil DIP packaging â'¢ 7x7 TQFP â , prevented by careful layout and guard rings. Logic Block Diagram Pin Configurations DIP Top View 5-26 , '"10PC P21 28-Lead (300-Mil) Molded DIP CY7C419â'"10VC V21 28-Lead (300-Mil) Molded SOJ 15 CY7C419â , Carrier CY7C419â'"15PC P21 28-Lead (300-Mil) Molded DIP CY7C419- 15VC V21 28-Lead (300-Mil) Molded , -Lead (300-Mil) Molded DIP CY7C419â'"15VI V21 28-Lead (300-Mil) Molded SOJ CY7C419 â'" 15DMB D22 28 -
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IDT7201 cy7c421 CY7C425- COML-55 FF p21 cy7c425 CY7C420/1 CY7C424/5 CY7C428/9 CY7C432/3 CY7C433
Abstract: PACKAGING PACKAGE/PIN COUNT PART NAME DIP M80C85AH CPUs M 80C86A-10 M 80C88A-10 M 81C55-5 M82C12 , 20 20 40 40 40 40 24 40 28 24 24 40 28 18 20 32 32 32 32 - i /n l/U DIP, while GS denotes plastic QFP/SO P, and JS denote QFJ. DIP QFP/SOP QFJ PACKAGING - · 18 PIN PLASTIC DIP DIP18-P-300 22.6. 0.2 mu Package material Lead tram« materia! Pin treatment , . · 24 PIN PLASTIC DIP DIP24-P-600 INDEX MARK / © < , 2 C O SEATING 5 PLANE 1 ® s 2 1 -
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M82C37B-5 M82C51A-2 82C54-2 M82C59A-2 M82C88-2 OKI M82C51a-2 m82c55a-2 oki m82c55a-2 m82c84a-2 82C53-2 M82C55A-2
Abstract: ) TTL-compatible Width and Depth Expansion Capability 5V± 10% supply PLCC, LCC, 300-mil and 600-mil DIP , EXPANSION LOGIC Pin Configurations PLCC/LCC Top View RESET LOGIC â  MR â  FL/RT . EF â  FF DIP Top , Carrier Commercial CY7C460A-1 OPC P15 28-Lead (600-Mil) Molded DIP CY7C460A-1 OPTC P21 28-Lead (300-Mil) Molded DIP CY7C460A-1OJI J65 32-Lead Plastic Leaded Chip Carrier Industrial 15 CY7C460A-15JC J65 32-Lead Plastic Leaded Chip Carrier Commercial CY7C460A-15PC P15 28-Lead (600-Mil) Molded DIP CY7C460A-15 PTC -
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CY7C460A CY7C462A CY7C464A CY7C466A IDT7205 IDT7206 8K/16K/32K/64K CY7C42X/46X
Abstract: compatible Retransmit in standalone Expandable in width PLCC, 7x7 TQFP, SOJ, 300-mil and 600-mil DIP Pin , .ef .ff .xo/hf DIP Top View 4 3 2 lì 323130 »5 2sc .cfe di f >6 28c ^ >7 27c 1 nc >8 , CY7C419-1 OPC P21 28-Lead (300-Mil) Molded DIP CY7C41 9-1 OVC V21 28-Lead (300-Mil) Molded SOJ 15 , Operating Range 25 CY7C420â'"25PC P15 28-Lead (600-Mil) Molded DIP Commercial 40 CY7C420â'"40PC P15 28-Lead (600-Mil) Molded DIP Commercial 65 CY7C420â'"65PC P15 28-Lead (600-Mil) Molded DIP Commercial -
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CY7C428-65PC AM7200 AM7201 AM7202 AM7203 AM7204 600-M
Abstract: . The CY7C130 and CY7C140 are available in both 48-pin DIP and 48-pin LCC. The CY7C131 and CY7C141 are available in 52-pin LCC, PLCC, and POFP. Logic Block Diagram Pin Configurations DIP B0S?L AOL - üel-R , Range 30 CY7C130â'"30PC P25 48-Lead (600-Mil) Molded DIP Commercial CY7C130â'"30PI P25 48-Lead (600-Mil) Molded DIP Industrial 35 CY7C130â'"35PC P25 48-Lead (600-Mil) Molded DIP Commerciai CY7C130â'"35PI P25 48-Lead (600-Mil) Molded DIP Industrial CY7C130â'"35DMB D26 48-Lead (600-Mil) Sidebraze DIP -
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IDT7130 IDT7140 cy7c131-55nc ZT12 CY7C130/CY7C131 CY7C140/CY7C141 CY7C140/ CY7C130/
Abstract: port-to-port communication (52-pin PLCC/PQFP versions) â'¢ Available in 48-pin DIP (CY7C132/142), 52 , CY7C132/CY7C142 are available in 48-pin DIP. The CY7C136/CY7C146 are available in 52-pin PLCC and PQFP , ) and interruptlogic (7c136/7c146 only) â  CER â SÃ'r â  R/WR i ntj2l INTr[2] c132-1 DIP Top , Package Type Operating Range 30 CY7C132-30PC P25 48-Lead (600-M I) Molded DIP Commercial CY7C132-30PI P25 48-Lead (600-M I) Molded DIP Industrial 35 CY7C132-35PC P25 48-Lead (600-M I) Molded DIP -
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CY7C146 CY7C136 2Kx8 Dual-Port Static RAM CY7C132 idt7132 CY7C132/CY7C136 CY7C142/CY7C146 CY7C136/146 IDT7132/IDT7142 CY7C132/CY7C136/CY7C142
Abstract: Standard dual-in-line packages (DIP), which fulfill these basic requirements, have enjoyed wide usage in , Smaller size SURFACE MOUNTING TYPE DIP SOP SSOP SOJ TSOP QFJ ZIP Higher Pin Count TQFP/LQFP QFP SKINNY DIP TCP PGA SHRINK-DIP BGA/LGA CSP Figure 1.1.1 Packaging Trend , (DIP, ZIP, SIP, PGA, etc.) 80 Usage rate (%) 60 Surface mounting type package (SOP, QFP , Ceramic & CER-DIP Surface Mounting Type Throughhole Mounting Type DIP Dual Lead Rows OKI Electric Industry
Original
land pattern for TSOP 2 86 PIN land pattern for TSOP 2 54 pin land pattern for TSOP 56 pin qfp 64 0.4 mm pitch land pattern oki naming TSOP 54 land pattern
Abstract: flag for port-to-port communication â'¢ Available in 48-pin DIP (CY7C130/140), 52-pin PLCCand 52 , are available in 48-pin DIP. The CY7C131 and CY7C141 are available in 52-pin PLCC and PQFP Logic , â  OEr â  R/Wr _[2] INTL 1 W21 Pin Configurations DIP Top View cel C 1 48 h Voc R/WL C 2 , ) Ordering Code Package Name Package Type Operating Range 30 CY7C130-30PC P25 48-Lead (600-M I) Molded DIP Commercial CY7C130-30PI P25 48-Lead (600-M I) Molded DIP Industrial 35 CY7C130-35PC P25 48-Lead (600-M I -
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IDT7130/IDT7140 CY7C130/CY7C131/CY7C140 38-00027-M
Abstract: Dissipation Cerdip (Derate 9.5 mW/°C above +70°C) . 675 mW Plastic DIP (Derate 7 mW/°C above +70°C , INPUTS* T2â'ž - T3â'ž T4|. NC = NO CONNECT Figure 1. AD230 DIP/SOIC Pin Configuration \ T5|. NC , /CMOS INPUT Figure 2. AD230 Typical Operating Circuit DIP C + C- |_2 V- [3 T2out [7 R2 'IN R2out , -232 INPUTS* AD231 NC = NO CONNECT Figure 3. AD231 DIP & SOIC Pin Configurations â'¢INTERNAL 400k , Tin T2,â'ž Figure 5. AD232 DIP/SOIC Pin Configuration R1, R2n 10(jiF_J_+ 6.3V ~p 4.7|jLF"tE -
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MAX230-241 AD235 AD236 AD241 AD233 AD232JN max232cwe MAX233EPP MAX239CNG max232eje RS-232 RS-232-C
Abstract: in 20-pin plastic and ceramic DIP, plastic SOJ, and ceramic LCC packages- The ceramic package can be , functional variations of the product family. Logic Symbols and DIP and SOJ Pinouts 16R8 16R6 16R4 16L8 , DIP Commercial PALC16L8L-25VC V5 20-Lead (300-Mil) Molded SOJ PALC16L8L-25WC W6 20-Lead (300-Mil) Windowed CerDIP 70 PALC16L8â'"25PC/PI P5 20-Lead (300-Mil) Molded DIP PALC16L8â , -Lead (300-Mil) Windowed CerDIP 35 45 PALC16L8L-35PC P5 20-Lead (300-Mil) Molded DIP Commercial -
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PALC20 247Q PALC16R6-25WC carrier 40QMB 16L8 PALC16R4-35WC CERAMIC LEADLESS CHIP CARRIER PALC16R8 20WMB 300-M PALC16R8L-25PC PALC16R8L-25WC
Abstract: Temperature Range Ceramic DIP Molded DIP Operating Temperature Range Extended (/iA9636AM) Commercial (mA9636AC) Lead Temperature Ceramic DIP (soldering, 60 s) Molded DIP (soldering, 10 s) Internal Power Dissipation12 8L-Ceramic DIP 8L-Molded DIP V+ Lead Potential to Ground Lead V - Lead Potential to Ground Lead V , DIP, and 150°C for the Molded DIP. 2. Ratings apply to ambient temperature at 25°C. Above this temperature, derate the SL-Ceramic DIP at 8.7 mW/°C, and the 8L-Molded DIP at 7.5 mW/'C. Connection Diagram -
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A9636A RS-423 1N4448 ma9636a 9636A a9636 JZ 1-1A A9636AM A9636AC
Abstract: O K I Semiconductor Packaging (Unit: mm) 16-Pin Plastic DIP DIPI 6-P-300 Package material , Solder plating 5 ym or more 0.99 TYP. 18-Pln Plastic DIP DIPI 8-P-300 Package material Lead , DIP DIP22-P-400 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 nm or more 1.90TYP. 28-Pin Plastic DIP , (Unit: mm) 42-Pin Plastic DIP DIP42-P-600 51.98 * 0.3 INDEX M AR K ; S EA T IN G PLANE 0.59TYP -
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DIP28-P-600 SDIP30-P-400 QFP44-P-910-K QFP44-P-910-2K
Abstract: Supply Voltages â'"5.0 V Or 12 V Connection Diagram 16-Lead DIP (Top View) THRESHOLD/ ,â'" CONTROLS) B , 6B MA75154PC 9B Package Description Ceramic DIP Molded DIP Absolute Maximum Ratings Storage Temperature Range Ceramic DIP Molded DIP Operating Temperature Range Lead Temperature Ceramic DIP (soldering, 60 s) Molded DIP (soldering, 10 s) Internal Power Dissipation1, 2 16L-Ceramic DIP 16L-Molded DIP , the Ceramic DIP, and 150°C for the Molded DIP. 2. Ratings apply to ambient temperature at 25 -
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1N3064 ma75154 MA75154 RS-232C A75154
Abstract: -
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54LS 74LS T54LS245D2 T74LS245B1 T74LS245XX T54LS245/T74LS245 T54LS245 T74LS245
Abstract: °C Plastic (soldering, 10 s) 265°C Internal Power Dissipation,1, 2 28L-Ceramic DIP 24L-Ceramic DIP 18L-Ceramic DIP 32L-Brazed Flatpak 24L-Brazed Flatpak 24L-Ceramic Flatpak 44L-PLCC 28L-PLCC Supply Voltage, Vcci , to ambient temperature at 25°C. Above this temperature, derate the 28L-Ceramlc DIP at 16.7 mW/'C the 24L-Ceramic DIP at 13 mW/°C, the 18L-Ceramic DIP at 10.5 mW/*C, the 32L-Brazed Flatpak at 12.5 mW/°C , Manufacturer juA248X â'¢ JUÃ"248XR Series Connection Diagram 24-Lead DIP (Top View) Connection Diagram 18 -
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UA248 ssi 117 CR042 ha2488 PA2-48 SSI117 MA248X A248XR UA248X A248X
Abstract: CJl CT) CO & Cî O cd o < < C/0 r+ fi] ^ n' O S O CO JJ , ) DEVICE PACKAGE TYPE ORDER NO. CM6400 28-Lead Plastic DIP CM6400 - P 28-Lead Ceramic DIP CM6400 - C CM6400 - 3 28-Lead Plastic DIP CM6400 - 3P 28-Lead Ceramic DIP CM6400 - 3C MM6400 28-Lead Ceramic DIP , . CM6400A 24-Lead Plastic DIP CM6400A - P 24-Lead Ceramic DIP CM6400A - C CM6400A - 3 24-Lead Plastic DIP -
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CM6400-3C CM6400-3P TWX910-3399388 CM6400- CM6400A-3 MM6400A M6400 M6400A
Abstract: epitaxial growth to ensure low input voltage noise. The LH2108 consists of two LM108 ICs in one 16-lead DIP , -Lead DIP (Top View) 16-Lead DIP (Top View) +VS (A) U Comp (A) [2" Comp/Vos Trim (A) [T -Input (A) [T , Thermal Characteristics Parameter 8-Lead Metal Can 8-Lead Ceramic DIP 16-Lead Ceramic DIP Maximum , (continued) 8-Lead Ceramic DIP Symbol Inches Millimeters Notes Min. Max. Min. Max. A â'" .200 â , Dimensions (continued) 16-Lead Ceramic DIP Notes: Symbol Inches Millimeters Notes Min. Max. Min. Max -
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LM108A BSC 60g LH2108A LM108D MIL-STD-883B LM108A/LH2108A LM108AD/883B LM108T LM108T/883B
Abstract: applications include general purpose video and pulse amplifiers. Connection Diagram 8-Lead DIP and SO , Description Molded DIP Molded Surface Mount · · · · 90 MHz Bandwidth Typ Selectable Gains From 0 To 400 Typ No Frequency Compensation Required Adjustable Pass Band Connection Diagram 14-Lead DIP (Top View) Absolute Maximum Ratings Storage Temperature Range Ceramic DIP M olded DIP, SO-8 Operating Tem perature Range Extended (/JA592M) Commercial (pA592C) Lead Temperature Ceramic DIP (soldering, 60 -
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A592PC a592 MA592 A592TC PC07740F PC07810F
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