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Part Manufacturer Description PDF Samples Ordering
ICM7556IPD Intersil Corporation IC DUAL SQUARE, 1 MHz, TIMER, PDIP14, PLASTIC, DIP-14, Analog Waveform Generation Function ri Buy
CD4098BDMS Intersil Corporation IC 4000/14000/40000 SERIES, DUAL MONOSTABLE MULTIVIBRATOR, CDIP16, DIP-16, Prescaler/Multivibrator ri Buy
HA5023IJ Intersil Corporation IC DUAL OP-AMP, 100 MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8, Operational Amplifier ri Buy

"lead material" DIP

Catalog Datasheet Results Type PDF Document Tags
Abstract: , material, and mounting method. QFP 4-way Lead TQFP / LQFP Flat SOP SSOP Bidirectional Lead TSOP SHP Surface Mounting Type SOJ 4-way Lead Chip Carrier Bidirectional Lead QFJ , CER-DIP Surface Mounting Type Throughhole Mounting Type DIP Bidirectional Lead Skinny DIP Miniature Shrink DIP Unidirectional Lead Flat ZIP QFP 4-way Lead PGA Matrix Bidirectional Lead DIP Standard TCP (TAB) COB Custom Type Memory Module Socket Type SIMM ... Original
datasheet

1 pages,
23.94 Kb

tab ic BGA and QFP Package mounting datasheet abstract
datasheet frame
Abstract: TUBE CONTAINER UNIT : mm 8.6 15.5 18.3 11.2 MD600-1A MD600-1A 22.4 MD600-2A MD600-2A Length : 501�0 +0.3 Thickness : 0.7-0.2 Tolerance : �4 Material : Plastic (With Antistatic Finish) Applied Package Quantity(pcs) 24-Pin Plastic DIP MAX. 14 28-Pin Plastic DIP MAX. 12 42-Pin Plastic DIP MAX. 8 42-Pin Plastic Shrink DIP MAX. 12 48-Pin Plastic Shrink DIP MAX. 10 42-Pin Ceramic Shrink DIP (brazed lead) MAX. 10 48-Pin Ceramic Shrink DIP (brazed lead ... Original
datasheet

1 pages,
13.87 Kb

dip 28 datasheet abstract
datasheet frame
Abstract: Unit : mm 8.6 15.5 18.3 11.2 MD600-1A MD600-1A 22.4 MD600-2A MD600-2A Length : 500�0 +0.3 Thickness : 0.7-2.0 Tolerance : �4 Material : Plastic (With Antistatic Finish) Applied Package Quantity(pcs) 24-Pin Plastic DIP 14 28-Pin Plastic DIP 12 42-Pin Plastic DIP 8 42-Pin Plastic Shrinked DIP 12 48-Pin Plastic Shrink DIP 10 42-Pin Ceramic Shrinked DIP (brazed lead) 10 48-Pin Ceramic Shrinked DIP (brazed lead) 10 ... Original
datasheet

1 pages,
4.62 Kb

MD600-1A datasheet abstract
datasheet frame
Abstract: UNIT : mm 8.7 13.5 8.3 4.3 14.2 LB-002 LB-002 length : 495�0 +0.2 thickness : 0.5 -0.1 tolerance : �4 material : plastic (with antistatic finish) Applied Package Quantity (pcs) 14-pin � Ceramic DIP (brazed lead) MAX. 24 16-pin � Ceramic DIP (brazed lead) MAX. 24 18-pin � Ceramic DIP (brazed lead) MAX. 20 20-pin � Ceramic DIP (brazed lead) MAX. 18 ... Original
datasheet

1 pages,
3.56 Kb

LB-002 LB-002 abstract
datasheet frame
Abstract: PLATING SPECIFICATIONS PACKAGE MATERIAL EPOXY RESIN SONY CODE DIP-8P-01 LEAD TREATMENT SOLDER PLATING EIAJ CODE DIP008-P-0300 DIP008-P-0300 LEAD MATERIAL COPPER ALLOY LEAD MATERIAL COPPER , SONY CODE DIP-8P-01 LEAD TREATMENT SOLDER PLATING EIAJ CODE DIP008-P-0300 DIP008-P-0300 LEAD , MATERIAL EPOXY RESIN SONY CODE SOP-8P-L03 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-SOP8-4.4x5.0-1.27 LEAD MATERIAL 42/COPPER 42/COPPER ALLOY PACKAGE MASS 0.1g JEDEC CODE ­6­ Sony ... Original
datasheet

6 pages,
136.98 Kb

DIP008-P-0300 DIP-8P-01 CXA1642P-M CXA1642P CXA1642M SOP-8P-L03 DIP008-P- CXA1642P/M CXA1642P/M abstract
datasheet frame
Abstract: O K I Semiconductor Packaging (Unit: mm) 16-Pin Plastic DIP DIPI 6-P-300 6-P-300 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 ym or more 0.99 TYP. 18-Pln Plastic DIP DIPI 8-P-300 8-P-300 Package material Lead , DIP DIP22-P-400 DIP22-P-400 Package material Lead frame material Pin treatment Solder plate thickness , (Unit: mm) 30-Pin Plastic Shrink DIP SDIP30-P-400 SDIP30-P-400 Package material Lead frame material Pin ... OCR Scan
datasheet

8 pages,
181.69 Kb

DIP22-P-400 6-P-300 6-P-300 abstract
datasheet frame
Abstract: Enable 16-Lead DIP, See Diag. 249 0vcc 0 Enable 2 Q Input F 0 Output F 0 Input E Q Output E 0 Input D , Buffer w/2 & 4 Line Enable 16-Lead DIP, See Diag. 249 0 Vcc 2 Enable 2 Q Input F 0 Output F Input E Q Output E Q Input D Output D WTE6887 WTE6887: Non-Inverting NTE6886 NTE6886: Inverting NTE75188 NTE75188 14-Lead DIP, See Diag. 247 DTL Quad Line Driver, RS232C RS232C NTE75189 NTE75189 14-Lead DIP, See Diag. 247 DTL Quad Line Receiver, RS232C RS232C NTE75322 NTE75322 Dual TTL-MOS Driver 14-Lead DIP, See Diag. 247 NTE75450B NTE75450B 14-Lead DIP, See Diag. 247 Dual ... OCR Scan
datasheet

1 pages,
44.58 Kb

14-LEAD NTE6888 nte75453 NTE75453B NTE754 NTE6887 NTE6886 NTE6885 NTE75454B NTE75322 NTE75494 NTE75 NTE75450B NTE75452B NTE75188 NTE6885 abstract
datasheet frame
Abstract: External Lead Finish for Hermetic Packages For hermetic packages, National Semiconductor offers three primary lead finishes: solder dip, gold plate and tin plate. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The lead finish , SOLDER DIP The solder dip lead finish for hermetic packages is a 60%�% tin, 40%�% lead alloy. The , provide excellent solderability. Solder dip lead finish is typically lower in cost as compared to gold or ... Original
datasheet

2 pages,
12.79 Kb

MIL-M38510 lead finish gold plate 85# Tin Plate 40 lead ceramic flatpack datasheet abstract
datasheet frame
Abstract: UNIT : mm 8.7 13.5 12.5 7.0 18.0 LB-008 LB-008 length : 495�0 +0.2 thickness : 0.5-0.1 tolerance : �4 material : plastic (with antistatic finish) Applied Package Quantity (pcs) 22-pin � Ceramic DIP (brazed lead) MAX. 17 24-pin � Ceramic DIP (brazed lead) MAX. 15 28-pin � Ceramic DIP (brazed lead) MAX. 13 ... Original
datasheet

1 pages,
3.52 Kb

4950 LB-008 LB-008 abstract
datasheet frame
Abstract: lead Electrical values material housing >500 mating cycles Contacts 5, Female socket, dip , Product sheet Subminiature connectors Product Area Female socket, dip solder, front , Common values Material Connector Design Female socket Connector locking system Screw-locking Termination dip solder Wire gauge (mm) - Wire gauge (AWG) - Max. Cable outlet - Upper temperature +85 °C Lower temperature -40 °C Material of contact CuSn ... Original
datasheet

1 pages,
223.66 Kb

datasheet abstract
datasheet frame

Datasheet Content (non pdf)

Abstract Saved from Date Saved File Size Type Download
Over 1.1 million files (1986-2014): html articles, reference designs, gerber files, chemical content, spice models, programs, code, pricing, images, circuits, parametric data, RoHS data, cross references, pcns, military data, and more. Please note that due to their age, these files do not always format correctly in modern browsers. Disclaimer.
 
Type Package name Package Material* 1 Lead pitch Lead shape Lead pull-out direction Sony Package mark Symbol Description Inserted Standard DIP DUAL IN-LINE PACKAGE P C 2.54mm (100mil) Through Hole Lead 2-direction P D SIP SINGLE IN-LINE PACKAGE P 1-direction L ZIP
www.datasheetarchive.com/files/sony/dataseet/package.html
Sony 30/10/1998 9.61 Kb HTML package.html
the characteristic or material. 2. This product is designed for application in which is corrosive gas (SOX,Cl etc.) or under sun-light. 5. When the lead of this product is soldered, pay Rosin type flux or non-activated flux. (2) Do not dip the body into flux. Flux shall be coated to lead wire only for soldering. (3) Be sure that the pre-heat up does not melt the sold lead. Otherwise, it may cause break off of junction between lead and element, or may crack
www.datasheetarchive.com/files/murata/products/data/a11x/nthtu02.txt
Murata 08/10/1996 3.21 Kb TXT nthtu02.txt
MATERIAL MISMATCH OUTGOING DPA MONITOR LIFTED OR MATERIAL INCOMPATIBILITY ALUMINUM WIRE ON 98% ALUMINUM PAD MONITOR FOREIGN MATERIAL AUDIT OUTGOING DPA MONITOR EXTERNAL LEAD CORROSION 100% V&M GROUP D LEAD INTEGRITY MONITOR IN-LINE
www.datasheetarchive.com/files/texas-instruments/sc/docs/military/quality/sts/assyspc.htm
Texas Instruments 17/12/1996 11.17 Kb HTM assyspc.htm
outputs sink 160mA Multiple side pins are used for V CC and GND to reduce lead inductance (improves speed and noise immunity) Available in 24-pin standard slim DIP (300mil) plastic or SOL (1998-04-02) Typenumber Function Voltage Package Material Package Material Bit Width Bit Width Desired Maximum Propagation Delay Range (ns Dissipation Considerations Series Package Material Power Dissipation Considerations Logic
www.datasheetarchive.com/files/philips/pip/74f30244_3-v1.html
Philips 14/02/2002 15.31 Kb HTML 74f30244_3-v1.html
m Hot Tin/Lead Dip PCB Mounting Hole Diameter: 22 AWG-1.23-1.30mm (.048-.051") 24 and 26 Material 90198-0001 22, 24, 26 1.52 (.060) Reels of 10,000 Tin/Lead-Plated Phosphor Bronze
www.datasheetarchive.com/files/molex/docs/00001/001f9.htm
Molex 20/12/1997 4.28 Kb HTM 001f9.htm
"free" PC board trace material for the sense resistor. Logic controlled electronic shutdown mode draws typically in the 5mA to 100mA range. The LT1432 LT1432 LT1432 LT1432 is available in 8-pin surface mount and DIP packages. The Part numbers ending in PBF are lead free . Please contact LTC marketing for information on lead based
www.datasheetarchive.com/files/linear/product/1030.html
Linear 17/09/2010 11.62 Kb HTML 1030.html
conventional lead frame molded into an auto-insertable industry standard DIP or surface-mount SOIC package. The its silicon counterpart. A hybrid is manufactured using a commercially available hex inverter DIP is placed into an oversized plastic tub and filled with a potting material. Figure 1. Internal , silicon lines are available in a variety of industry standard DIP and SOIC packages (See Packaging Options lead version is offered. Finally, for surface mount applications, two solutions are available: 300-mil
www.datasheetarchive.com/files/maxim/0003/an14.htm
Maxim 02/05/2002 21.85 Kb HTM an14.htm
PACKAGE TYPE SO TSSOP DIP SOT23-5 LEAD FRAME MATERIAL Copper Copper Copper Copper LEAD COATING Tin WIRE MATERIAL Gold Gold Gold Gold WIRE DIAMETER 25 um 25 um 25 um 25 um MOLD MATERIAL HC10-2 HC10-2 HC10-2 HC10-2 Ciba qualification program UDCS_0118623. Then device TS954 TS954 TS954 TS954 is qualified for SOIC,DIP and TSSOP packages. NB
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7556.htm
STMicroelectronics 31/01/2001 8.37 Kb HTM 7556.htm
PASSIVATION(mm) 0.5 + 0.6 0.5 + 0.6 0.5 + 0.6 0.5 + 0.6 PACKAGE TYPE SO TSSOP DIP SOT23-5 LEAD FRAME MATERIAL Copper Copper Copper Copper LEAD COATING Tin plating Tin plating Tin Dipping Tin Dipping DIE Thermosonic ball bonding Thermosonic ball bonding WIRE MATERIAL Gold Gold Gold Gold WIRE DIAMETER 25 um 25 um 25 um 25 um MOLD MATERIAL HC10-2 HC10-2 HC10-2 HC10-2 MP8000 MP8000 MP8000 MP8000 KMC184-3a MG46FC-AM MG46FC-AM MG46FC-AM MG46FC-AM MP8000 MP8000 MP8000 MP8000 DIE PROCESS UDCS_0118623. Then device TS924 TS924 TS924 TS924 is qualified for SOIC,DIP and TSSOP packages. NB : Detailed results are
www.datasheetarchive.com/files/stmicroelectronics/stonline/books/ascii/docs/7553.htm
STMicroelectronics 31/01/2001 9.9 Kb HTM 7553.htm
~ 128pin. PLCC Minimum lead pitch 0.4 mm SMP5pin Boards Material Available - Lead Dimensions 4 � 1mm typ. from stand off 4 � 1mm typ. Package SIP DIP Available Available Available Available Not L=14mm ~ 65mm H=7mm ~ 38mm L=14mm ~ 65mm H=7mm ~ 38mm - DIP
www.datasheetarchive.com/files/rohm/products/shortform/13hybd/hybd6.html
Rohm 05/02/2002 24.12 Kb HTML hybd6.html