NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
NEW DATABASE - 350 MILLION DATASHEETS FROM 8500 MANUFACTURERS
| Catalog Datasheet Results | Type | Document Tags |
| Abstract: , material, and mounting method. QFP 4-way Lead TQFP / LQFP Flat SOP SSOP Bidirectional Lead TSOP SHP Surface Mounting Type SOJ 4-way Lead Chip Carrier Bidirectional Lead QFJ , CER-DIP Surface Mounting Type Throughhole Mounting Type DIP Bidirectional Lead Skinny DIP Miniature Shrink DIP Unidirectional Lead Flat ZIP QFP 4-way Lead PGA Matrix Bidirectional Lead DIP Standard TCP (TAB) COB Custom Type Memory Module Socket Type SIMM ... | Original |
1 pages, |
tab ic BGA and QFP Package mounting datasheet abstract |
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| Abstract: Unit : mm 8.6 15.5 18.3 11.2 MD600-1A MD600-1A 22.4 MD600-2A MD600-2A Length : 500�0 +0.3 Thickness : 0.7-2.0 Tolerance : �4 Material : Plastic (With Antistatic Finish) Applied Package Quantity(pcs) 24-Pin Plastic DIP 14 28-Pin Plastic DIP 12 42-Pin Plastic DIP 8 42-Pin Plastic Shrinked DIP 12 48-Pin Plastic Shrink DIP 10 42-Pin Ceramic Shrinked DIP (brazed lead) 10 48-Pin Ceramic Shrinked DIP (brazed lead) 10 ... | Original |
1 pages, |
MD600-1A datasheet abstract |
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| Abstract: TUBE CONTAINER UNIT : mm 8.6 15.5 18.3 11.2 MD600-1A MD600-1A 22.4 MD600-2A MD600-2A Length : 501�0 +0.3 Thickness : 0.7-0.2 Tolerance : �4 Material : Plastic (With Antistatic Finish) Applied Package Quantity(pcs) 24-Pin Plastic DIP MAX. 14 28-Pin Plastic DIP MAX. 12 42-Pin Plastic DIP MAX. 8 42-Pin Plastic Shrink DIP MAX. 12 48-Pin Plastic Shrink DIP MAX. 10 42-Pin Ceramic Shrink DIP (brazed lead) MAX. 10 48-Pin Ceramic Shrink DIP (brazed lead ... | Original |
1 pages, |
dip 28 datasheet abstract |
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| Abstract: UNIT : mm 8.7 13.5 8.3 4.3 14.2 LB-002 LB-002 length : 495�0 +0.2 thickness : 0.5 -0.1 tolerance : �4 material : plastic (with antistatic finish) Applied Package Quantity (pcs) 14-pin � Ceramic DIP (brazed lead) MAX. 24 16-pin � Ceramic DIP (brazed lead) MAX. 24 18-pin � Ceramic DIP (brazed lead) MAX. 20 20-pin � Ceramic DIP (brazed lead) MAX. 18 ... | Original |
1 pages, |
LB-002 LB-002 abstract |
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| Abstract: PLATING SPECIFICATIONS PACKAGE MATERIAL EPOXY RESIN SONY CODE DIP-8P-01 LEAD TREATMENT SOLDER PLATING EIAJ CODE DIP008-P-0300 DIP008-P-0300 LEAD MATERIAL COPPER ALLOY LEAD MATERIAL COPPER , SONY CODE DIP-8P-01 LEAD TREATMENT SOLDER PLATING EIAJ CODE DIP008-P-0300 DIP008-P-0300 LEAD , MATERIAL EPOXY RESIN SONY CODE SOP-8P-L03 LEAD TREATMENT SOLDER PLATING EIAJ CODE P-SOP8-4.4x5.0-1.27 LEAD MATERIAL 42/COPPER 42/COPPER ALLOY PACKAGE MASS 0.1g JEDEC CODE 6 Sony ... | Original |
6 pages, |
DIP008-P-0300 DIP-8P-01 CXA1642P-M CXA1642P CXA1642M SOP-8P-L03 DIP008-P- CXA1642P/M CXA1642P/M abstract |
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| Abstract: Enable 16-Lead DIP, See Diag. 249 0vcc 0 Enable 2 Q Input F 0 Output F 0 Input E Q Output E 0 Input D , Buffer w/2 & 4 Line Enable 16-Lead DIP, See Diag. 249 0 Vcc 2 Enable 2 Q Input F 0 Output F Input E Q Output E Q Input D Output D WTE6887 WTE6887: Non-Inverting NTE6886 NTE6886: Inverting NTE75188 NTE75188 14-Lead DIP, See Diag. 247 DTL Quad Line Driver, RS232C RS232C NTE75189 NTE75189 14-Lead DIP, See Diag. 247 DTL Quad Line Receiver, RS232C RS232C NTE75322 NTE75322 Dual TTL-MOS Driver 14-Lead DIP, See Diag. 247 NTE75450B NTE75450B 14-Lead DIP, See Diag. 247 Dual ... | OCR Scan |
1 pages, |
14-LEAD NTE6885 NTE6886 NTE6887 NTE6888 NTE75322 NTE754 NTE75453B NTE75454B NTE75494 NTE75450B NTE75 NTE75451B NTE75452B NTE75188 NTE6885 abstract |
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| Abstract: External Lead Finish for Hermetic Packages For hermetic packages, National Semiconductor offers three primary lead finishes: solder dip, gold plate and tin plate. The component lead finish serves as a protective coating to prevent oxidation of the lead base material prior to use. The lead finish , SOLDER DIP The solder dip lead finish for hermetic packages is a 60%�% tin, 40%�% lead alloy. The , provide excellent solderability. Solder dip lead finish is typically lower in cost as compared to gold or ... | Original |
2 pages, |
gold plate 85# Tin Plate 40 lead ceramic flatpack datasheet abstract |
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| Abstract: UNIT : mm 8.7 13.5 12.5 7.0 18.0 LB-008 LB-008 length : 495�0 +0.2 thickness : 0.5-0.1 tolerance : �4 material : plastic (with antistatic finish) Applied Package Quantity (pcs) 22-pin � Ceramic DIP (brazed lead) MAX. 17 24-pin � Ceramic DIP (brazed lead) MAX. 15 28-pin � Ceramic DIP (brazed lead) MAX. 13 ... | Original |
1 pages, |
LB-008 LB-008 abstract |
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| Abstract: lead Electrical values material housing >500 mating cycles Contacts 3, Female socket, dip , Product sheet Subminiature connectors Product Area Female socket, dip solder, front , Common values Material Connector Design Female socket Connector locking system Screw-locking Termination dip solder Wire gauge (mm) - Wire gauge (AWG) - Max. Cable outlet - Upper temperature +85 °C Lower temperature -40 °C Material of contact CuSn ... | Original |
1 pages, |
datasheet abstract |
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| Abstract: lead Electrical values material housing >500 mating cycles Contacts 5, Female socket, dip , Product sheet Subminiature connectors Product Area Female socket, dip solder, front , Common values Material Connector Design Female socket Connector locking system Screw-locking Termination dip solder Wire gauge (mm) - Wire gauge (AWG) - Max. Cable outlet - Upper temperature +85 °C Lower temperature -40 °C Material of contact CuSn ... | Original |
1 pages, |
datasheet abstract |
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| Abstract | Saved from | Date Saved | File Size | Type | Download |
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| (0.600") 7700 62.7x14.1x3.8 8 Table of main material declaration - Family representative: DIP24 .25) reference weight (mg) body (mm) packing quantity DIP8(0.300") 470 10.9x6.6x3.3 50 DIP14(0.300") 1000 20x6.3x3.3. 25 DIP16(0.300") 1025 20x6.3x3.3 25 DIP18(0.300") 1100 23.2x6.3x3.3 20 DIP20(0.300") 1360 25.4x6.3x3.3 20 DIP22(0.300") 2038 28.1x8.2x3.8 17 DIP24(0.300") 2590 35.5x8.2x3.8 15 DIP24 www.datasheetarchive.com/files/stmicroelectronics/stonline/company/environm/chemical/032-v1.htm |
STMicroelectronics | 20/10/2000 | 4.34 Kb | HTM | 032-v1.htm |
| 52x14.1x3.8 9 DIP48(0.600") 7700 62.7x14.1x3.8 8 Table of main material declaration - Family representative: DIP24(0.600) Name of the part Material weight (mg) Material name .25) reference weight (mg) body (mm) packing quantity DIP8(0.300") 470 10.9x6.6x3.3 50 DIP14(0.300") 1000 20x6.3x3.3. 25 DIP16(0.300") 1025 20x6.3x3.3 25 DIP18(0.300") 1100 23.2x6.3x3.3 20 DIP20(0.300") 1360 25.4x6.3x3.3 20 DIP22(0.300") 2038 28.1x8.2x3.8 17 www.datasheetarchive.com/files/stmicroelectronics/stonline/company/environm/chemical/032-v2.htm |
STMicroelectronics | 02/04/1999 | 4.18 Kb | HTM | 032-v2.htm |
| 52x14.1x3.8 9 DIP48(0.600") 7700 62.7x14.1x3.8 8 Table of main material declaration - Family representative: DIP24(0.600) Name of the part Material weight (mg) Material name .25) reference weight (mg) body (mm) packing quantity DIP8(0.300") 470 10.9x6.6x3.3 50 DIP14(0.300") 1000 20x6.3x3.3. 25 DIP16(0.300") 1025 20x6.3x3.3 25 DIP18(0.300") 1100 23.2x6.3x3.3 20 DIP20(0.300") 1360 25.4x6.3x3.3 20 DIP22(0.300") 2038 28.1x8.2x3.8 17 www.datasheetarchive.com/files/stmicroelectronics/stonline/company/environm/chemical/032.htm |
STMicroelectronics | 21/01/1999 | 4.22 Kb | HTM | 032.htm |
| 52x14.1x3.8 9 DIP48(0.600") 7700 62.7x14.1x3.8 8 Table of main material declaration - Family representative: DIP24(0.600) Name of the part Material weight (mg) Material name .25) reference weight (mg) body (mm) packing quantity DIP8(0.300") 470 10.9x6.6x3.3 50 DIP14(0.300") 1000 20x6.3x3.3. 25 DIP16(0.300") 1025 20x6.3x3.3 25 DIP18(0.300") 1100 23.2x6.3x3.3 20 DIP20(0.300") 1360 25.4x6.3x3.3 20 DIP22(0.300") 2038 28.1x8.2x3.8 17 www.datasheetarchive.com/files/stmicroelectronics/stonline/company/environm/chemical/032-v3.htm |
STMicroelectronics | 14/06/1999 | 4.18 Kb | HTM | 032-v3.htm |
| .6 Die attach material 4.5 Soft Solder Pb Sn 95 5 Wires 3.5 Gold Au 99.99 Leads weight (mg) body (mm) packing quantity PowerDIP8(0.300") 600 9.8x7.1x4.1 50 PowerDIP16(0.300") 1000 20x7.1x4.6 25 PowerDIP18(0.300") 1,350 24.8x7.1x4.6 20 PowerDIP20(0.300") 1380 24.8x7.1x4.6 20 Table of main material declaration - Family representative: POWERDIP20 POWERDIP20 POWERDIP20 POWERDIP20 Name of the part Material weight (mg) Material name Material analysis (element) Material www.datasheetarchive.com/files/stmicroelectronics/stonline/company/environm/chemical/034-v2.htm |
STMicroelectronics | 02/04/1999 | 2.98 Kb | HTM | 034-v2.htm |
| .6 Die attach material 4.5 Soft Solder Pb Sn 95 5 Wires 3.5 Gold Au 99.99 Leads weight (mg) body (mm) packing quantity PowerDIP8(0.300") 600 9.8x7.1x4.1 50 PowerDIP16(0.300") 1000 20x7.1x4.6 25 PowerDIP18(0.300") 1,350 24.8x7.1x4.6 20 PowerDIP20(0.300") 1380 24.8x7.1x4.6 20 Table of main material declaration - Family representative: POWERDIP20 POWERDIP20 POWERDIP20 POWERDIP20 Name of the part Material weight (mg) Material name Material analysis (element) Material www.datasheetarchive.com/files/stmicroelectronics/stonline/company/environm/chemical/034-v3.htm |
STMicroelectronics | 14/06/1999 | 2.98 Kb | HTM | 034-v3.htm |
| .6 Die attach material 4.5 Soft Solder Pb Sn 95 5 Wires 3.5 Gold Au 99.99 Leads weight (mg) body (mm) packing quantity PowerDIP8(0.300") 600 9.8x7.1x4.1 50 PowerDIP16(0.300") 1000 20x7.1x4.6 25 PowerDIP18(0.300") 1,350 24.8x7.1x4.6 20 PowerDIP20(0.300") 1380 24.8x7.1x4.6 20 Table of main material declaration - Family representative: POWERDIP20 POWERDIP20 POWERDIP20 POWERDIP20 Name of the part Material weight (mg) Material name Material analysis (element) Material www.datasheetarchive.com/files/stmicroelectronics/stonline/company/environm/chemical/034.htm |
STMicroelectronics | 21/01/1999 | 3.02 Kb | HTM | 034.htm |
| ) reference weight (mg) body (mm) packing quantity PowerDIP8(0.300") 600 9.8x7.1x4.1 50 PowerDIP16(0.300") 1000 20x7.1x4.6 25 PowerDIP18(0.300") 1,350 24.8x7.1x4.6 20 PowerDIP20(0.300") 1380 24.8x7.1x4.6 20 Table of main material declaration - Family representative: POWERDIP20 POWERDIP20 POWERDIP20 POWERDIP20 Name of the part Material weight (mg) Material name Material analysis (element) Material analisys (weight%) Leadframe 645 Cu www.datasheetarchive.com/files/stmicroelectronics/stonline/company/environm/chemical/034-v1.htm |
STMicroelectronics | 20/10/2000 | 3.11 Kb | HTM | 034-v1.htm |
| issue date SOT102-2 DIP18 plastic dual in-line package; 18 leads (300 mil); slim corner leads 2/13/2003 Chemical content Part Material Weight (mg) bond wire Au 2 mg leadframe Packages Information on package SOT102-2 plastic dual in-line package; 18 leads (300 mil); slim corner leads www.datasheetarchive.com/files/philips/packages/sot102-2-v3.html |
Philips | 16/06/2005 | 3.41 Kb | HTML | sot102-2-v3.html |
| Packages Information on package SOT102-2 plastic dual in-line package; 18 leads (300 mil); slim corner leads Outline drawing Package version Package name Package description Drawing issue date SOT102-2 DIP18 plastic dual in-line package; 18 leads (300 mil); slim corner leads 03-02-13 Chemical content Part Material Weight (mg) leadframe Cu www.datasheetarchive.com/files/philips/packages/sot102-2.html |
Philips | 15/04/2003 | 3.28 Kb | HTML | sot102-2.html |