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LT1103CY Linear Technology IC SWITCHING CONTROLLER, Switching Regulator or Controller
LT3524S Linear Technology IC SWITCHING CONTROLLER, PDSO, Switching Regulator or Controller
LT1945IMS Linear Technology IC 0.4 A DUAL SWITCHING CONTROLLER, PDSO8, PLASTIC, MSOP-10, Switching Regulator or Controller
LTC3830DWF Linear Technology IC SWITCHING CONTROLLER, 250 kHz SWITCHING FREQ-MAX, UUC, DIE, Switching Regulator or Controller
LT1103IY Linear Technology IC 2 A SWITCHING CONTROLLER, PSFM7, TO-220, 7 PIN, Switching Regulator or Controller
LT3524CN Linear Technology IC SWITCHING CONTROLLER, PDIP, Switching Regulator or Controller

wafer fab control plan Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
DIGITAL IC TESTER report for project

Abstract: wafer fab control plan atmel 823 PPAP submission requirement table PPAP PPAP flow wafer fab control JESD20 electrical engineering projects dc0327
Text: Reliability Testing Failure Analysis and Yield enhancement 12 Control Plan Control plan is composed of the following: - Wafer fab Control Plan for Z92G process Assembly Control Plan Test Control Plan , .22 12 CONTROL PLAN , . Measurement System Analysis Study 11. Qualified Laboratory Documentation 12. Control Plan 13. Part , .14 5.1 5.2 5.3 WAFER PROCESSING


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PDF TSS463B TSS463B TSS463B-TERA DIGITAL IC TESTER report for project wafer fab control plan atmel 823 PPAP submission requirement table PPAP PPAP flow wafer fab control JESD20 electrical engineering projects dc0327
1996 - INCOMING RAW MATERIAL INSPECTION

Abstract: INCOMING RAW MATERIAL INSPECTION procedure plate INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL flowchart raw material control log sheet INCOMING RAW MATERIAL INCOMING RAW MATERIAL specification program curve tracer oxygen sensor magnetron INCOMING RAW MATERIAL INSPECTIONs
Text: FABRICATION FLOWCHART Generic Bipolar Process Vendor: Package: Location of Wafer Fab : Assembly: Final , FLOWCHART Generic CMOS Process Vendor: Package: Location of Wafer Fab : Assembly: Final Test: Q.C , Bath Nanospec 3 Wafer /Cycle QUALITY ASSURANCE PROGRAM FLOWCHART INCOMING FAB REWORK , Bipolar Process Vendor: Package: Location of Wafer Fab : Assembly: Final Test: Q.C. Test: Source , ) FLOWCHART Generic CMOS or Bipolar Process Vendor: Package: Location of Wafer Fab : Assembly: Final Test


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intersil DATE CODE MARKING

Abstract: pin diagram details of CD4015 y2010 R4573 B TA3842 TA388* transistor ESD test plan R4573 ta5142 wafer fab control plan
Text: BONDED WAFER EPI WAFER FAB CONTINUED Title: QML QUALITY MANAGEMENT PLAN Specification Type , Document PHOTOMASK SUBCONTRACTED GENERAL Photomasks are used in the Wafer Fab forming operations to , 3.1A. QML Qualified Wafer Fabrication Process Technologies are listed in the HUB. WAFER FAB , Sweden is an Intersil approved subcontractor for Design, Mask Generation, and Wafer Fab operations · , Document Date Printed: 07-Aug-2000 10:33:38 WAFER FABRICATION FLOW - Continued FAB *DIFFUSION


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PDF 07-AUG-2000 28-SEP-1995 03-NOV-1995 21-SEP-1995 28-SEP-1995 intersil DATE CODE MARKING pin diagram details of CD4015 y2010 R4573 B TA3842 TA388* transistor ESD test plan R4573 ta5142 wafer fab control plan
2000 - INCOMING RAW MATERIAL INSPECTION checklist

Abstract: INCOMING RAW MATERIAL INSPECTION procedure STORES RECEIVED RAW MATERIAL CHECK LIST INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION method raw material control log sheet INCOMING RAW MATERIAL INSPECTIONs plate INCOMING RAW MATERIAL INSPECTION procedure INCOMING RAW MATERIAL flowchart INCOMING RAW MATERIAL INSPECTION chart
Text: PROGRAM WAFER FABRICATION FLOWCHART Generic Bipolar, Process Vendor: Package: Location of Wafer Fab , FABRICATION FLOWCHART Generic CMOS Process Vendor: Package: Location of Wafer Fab : Assembly: Final Test , Nanospec 3 Wafer /Cycle Revision A. 14-74 QUALITY ASSURANCE PROGRAM FLOWCHART INCOMING FAB , Vendor: Package: Location of Wafer Fab : Assembly: Final Test: Q.C. Test: Source Accept Test , of Wafer Fab : Assembly: Final Test: Q.C. Test: Source Accept Test: Quality Contact: FLOWCHART


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1998 - INCOMING RAW MATERIAL INSPECTION procedure

Abstract: INCOMING RAW MATERIAL INSPECTION plate INCOMING RAW MATERIAL INSPECTION procedure ionograph raw material control log sheet INCOMING RAW MATERIAL INSPECTION chart INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL flowchart INCOMING RAW MATERIAL INSPECTIONs visual inspection of raw materials
Text: FABRICATION FLOWCHART Generic Bipolar, Process Vendor: Package: Location of Wafer Fab : Assembly: Final , Generic CMOS Process Vendor: Package: Location of Wafer Fab : Assembly: Final Test: Q.C. Test , Nanospec 3 Wafer /Cycle 15-57 QUALITY ASSURANCE PROGRAM FLOWCHART INCOMING FAB REWORK PROCESS , Bipolar Process Vendor: Package: Location of Wafer Fab : Assembly: Final Test: Q.C. Test: Source , (END-OF-LINE) FLOWCHART Generic CMOS or Bipolar Process Vendor: Package: Location of Wafer Fab : Assembly


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2000 - wafer fab control plan

Abstract: SPC3 SPC2 LINEAR TECHNOLOGY flowchart
Text: Control Plan Detail for Bipolar Wafer Fab SPC Node and Process Critical Features Measurement , group (e.g., Wafer Fab ) has a formal SPC presence in the form of an SPC Quality Control Team (QCT). , (flowcharts and control plan details), an SPC training program, each of which is defined in the Company , End-of-Line QCT Wafer Fab QCT SPC Steering Committee Worldwide Assembly QCT Quality & , the engineering staff for systematic and continuous improvement. Flowcharts and Control Plan Details


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Eftec ra 308

Abstract: Ablebond 84-1LMISR4 JM2500 wafer fab control plan MICRON 64T
Text: control charts has an Out of Control Response Plan that provides instructions for actions to be taken in , . 8 SPC and Variability Reduction Plan , . 11 0.35 micron cMOS, C3(x) Processes, Fab 10, 3.3 volts . 12 0.5 micron cMOS, C5(x) Processes, Fab 10, 5 volts . 17 0.5 micron cMOS, L5(x) Processes, Fab 10, 3.3 volts


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1996 - statistical process control

Abstract: wafer fab control plan pareto SPC-2 wafer fab control TIONA SPC Technology spc data sheet process control system SPC-3
Text: Control Plan Detail for Bipolar Wafer Fab Process Capability Cp Cpk 1.59 ~ 1.89 1.12 ~ 1.41 SPC , group (e.g., Wafer Fab ) has a formal SPC presence in the form of an SPC Quality Control Team (QCT). , (flowcharts and control plan details), an SPC training program, each of which is defined in the Company , End-of-Line QCT Wafer Fab QCT SPC Steering Committee Worldwide Assembly QCT Quality & , the engineering staff for systematic and continuous improvement. Flowcharts and Control Plan Details


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1998 - wafer fab control plan

Abstract: LINEAR TECHNOLOGY flowchart
Text: the related Control Plan Detail for one operational area (e.g., The Wafer Fabrication Area) Figure 2 , with built-in contingency action plans, operational area documentation (flowcharts and control plan , operating employees and representatives of related functions. Each operating group (e.g., Wafer Fab ) has a , leadership responsibility for SPC at Linear Technology. End-of-Line QCT Wafer Fab QCT SPC , . Flowcharts and Control Plan Details The flowcharts serve to graphically display the flow of products in


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1997 - APPLICATION CD4094

Abstract: ta3842 tA 1507 989XXXX TA384 icl7667 die 51122A TA5072 ta1313 TA07667B
Text: Harris QM Plan provides a description of the database systems used to control the internal Harris specifications used to fabricate each part type of every technology. Title: QML QUALITY MANAGEMENT PLAN , specification Base Wafer Mask Number Flow/Traveler numbers ( Wafer Fab /Assembly/Test/QCI) Wafer fab product , 4 WAFER FAB FAB 54 FAB 59 FAB 4 FAB 5 ASSEMBLY TEST X X X X X Somerville, N.J. X Findlay, Ohio , specification number Package code QCI traveler number In addition, the Harris Document Control electronic data


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PDF 19-SEP-1997 APPLICATION CD4094 ta3842 tA 1507 989XXXX TA384 icl7667 die 51122A TA5072 ta1313 TA07667B
1997 - ta3842

Abstract: APPLICATION CD4094 CD40110 equivalent cd40110 87XXXX 211026001 HA-5320 alps-rh ta5072 TA388
Text: the Harris QM Plan provides a description of the database systems used to control the internal Harris specifications used to fabricate each part type of every technology. Title: QML QUALITY MANAGEMENT PLAN , specification Base Wafer Mask Number Flow/Traveler numbers ( Wafer Fab /Assembly/Test/QCI) Wafer fab product , of the QM Plan that list the SEC's, PM's & TCV's by technology and fab will be formally changed , Carolina X MATERIAL FAB 4 WAFER FAB X FAB 54 X X FAB 59 Findlay, Ohio Kuala


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PDF 02-JUN-1997 ta3842 APPLICATION CD4094 CD40110 equivalent cd40110 87XXXX 211026001 HA-5320 alps-rh ta5072 TA388
PCF75652W

Abstract: RFD14N05LSM9A FAIRCHILD SMD MARKING Fairchild wafer fab 100C HUF75652G3 HUFA75345P3 HUF766 HUF75631P3 wafer fab control
Text: Plan Numbers Additional Qualification Data Title Qualification of ASMC Fab as an alternate wafer , run on our 6-inch and 8-inch wafer fab lines in Mountain Top, PA. The products affected by this , transfer of wafer fabrication of these devices to another QS9000 approved wafer fab site will have no , : Clint.Chamberlin@notes.fairchildsemi.com Phone: 570-474-3240 PCN Type: Alternate Fab Location Effectivity Expected 1st Device , Mountain Top 6-inch fab line is scheduled for closure. The Mountain Top 8-inch fab line will remain open


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PDF HUF75545P3 HUF75545S3ST HUF75631SK8T HUF75639S3 HUF75645P3 HUF75652G3 HUF76419D3ST HUF76419S3ST HUF76429S3ST HUFA76429D3 PCF75652W RFD14N05LSM9A FAIRCHILD SMD MARKING Fairchild wafer fab 100C HUF75652G3 HUFA75345P3 HUF766 HUF75631P3 wafer fab control
1997 - 40F-701-1-15

Abstract: nikon STEPPER 71007 MIL-STD-883 method 5003 INCOMING MATERIAL INSPECTION procedure harris top marking product change notification
Text: DIWAFER BONDED WAFER EPIWAFER FAB CONTINUED Title: QML QUALITY MANAGEMENT PLAN Specification , the Wafer Fab forming operations to transfer the patterns of the various levels of the IC design onto the photoresist coated wafer . The Photomask Fab Operations at Harris Corporation produce a wide , Fabrication Process Technologies are listed in the HUB. WAFER FAB CAPABILITIES Reference section 3.3 for a , Controlled Document WAFER FABRICATION FLOW - Continued FAB CONTINUED *DIFFUSION/IMPLANT (device


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PDF 19-SEP-1997 210XXX 710-010-XX 40F-400-0-0 40F-701-1-15 nikon STEPPER 71007 MIL-STD-883 method 5003 INCOMING MATERIAL INSPECTION procedure harris top marking product change notification
1997 - apqp MANUAL

Abstract: quality acceptance plan wafer fab control plan FORD apqp manual Ford in-process quality ford ppap MATERIAL CONTROL PROCEDURE PPAP MANUAL Ford Part Number PPAP flow
Text: Engineer. Fab and Assembly will typically have a single control plan for each process/package flow. Final , Control Plan Manual. 3.0 Responsibility The responsibility for starting the procedure of generating a Control Plan resides with the Program Manager for the project. The Product engineer is chiefly responsible for assembling the data for the control plan but he requires the assistance of other members of , : Wafer Fab - Manufacturing QA Assembly - Manufacturing QA or Subcontractors. Final Test - Manufacturing


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PDF 07-NOV-1995 QOP-SMV-002 QOP-SMV-004 95QP004 apqp MANUAL quality acceptance plan wafer fab control plan FORD apqp manual Ford in-process quality ford ppap MATERIAL CONTROL PROCEDURE PPAP MANUAL Ford Part Number PPAP flow
1997 - TM2004

Abstract: MIL-STD-883 method 5003 TM1011 ACT-R01 54XXXX 40F-701-1-15 marking 25b harris top marking product change notification Harris top marking
Text: EPI WAFER FAB CONTINUED - flow s.ppt Title: QML QUALITY MANAGEMENT PLAN Specification , PHOTOMASK Generation Procedures Photomasks are used in the Wafer Fab forming operations to transfer the patterns of the various levels of the IC design onto the photoresist coated wafer . The Photomask Fab , Fabrication Process Technologies are listed in the HUB. WAFER FAB CAPABILITIES Reference section 3.3 for a , the wafer fab , assembly and test travelers. These travelers reference process specifications where the


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PDF 02-JUN-1997 210XXX 710-010-XX 40F-400-0-0 TM2004 MIL-STD-883 method 5003 TM1011 ACT-R01 54XXXX 40F-701-1-15 marking 25b harris top marking product change notification Harris top marking
EPIC-1S

Abstract: WAFER SN74ACT245 wafer fab control plan
Text: TEXAS INSTRUMENTS Initial Notification for the Planned 150mm Diameter Wafer Qualification of the Sherman, Texas Wafer Fab December 8, 1998 Abstract The Texas Instruments Wafer Fabrication Facility in Sherman, Texas (SFAB) plans to convert the wafer diameter from 125mm to 150mm for the EPIC-1S wafer , process variance were built with 150mm diameter wafer . One control lot was built with 125mm diameter , Qualification of the Sherman, Texas Wafer Fab SFAB W/F Process Product Family EPIC-1S AHC, AHCT, AC, ACT


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PDF 150mm 125mm SN74ACT245 60sec EPIC-1S WAFER wafer fab control plan
Evaluating pHEMT Process Improvements Using Wafer Level RF Tests

Abstract: No abstract text available
Text: actually a performance improvement. Good wafer fab Process Control Monitor (PCM) and DC wafer probe tests , to move product from wafer fab completion through package assembly delays feedback to the wafer fab , performance. The time required to move product from wafer fab completion through module assembly and test delays feedback to the wafer fab process engineer. Adding wafer level RF tests provides quick feedback , fab . DISCUSSION Wafer level tests employed by Skyworks include PCM and DC and RF wafer probe of the


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rh-24v

Abstract: JESD22-A105 a105 transistor HUF75309D3ST rfp70n06 RFD3055LESM9A JESD22-A110 HRF3205 equivalent HUF75343 HUF75344P3
Text: qualified at several wafer fab lines as noted in the "Change of Description" section. The products affected , for wafer fabrication. This will be an alternate fab site for these products. CSMC address is for , : Clint.Chamberlin@notes.fairchildsemi.com Phone: 570-474-3240 PCN Type: Alternate Fab Location Effectivity Expected 1st Device , Todang-Dong Wonmi-District Bucheon City, Kyonggi Province Korea Effect of Change: The alternative wafer fabrication of these devices to another QS9000 approved wafer fabrication site will have no effect on device


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PDF RFG70N06 RFP45N06 HRF3205 HUF75307D3ST HUF75309D3S HUF75309T3ST HUF75321D3ST HUF75321S3ST R4908 HUF75329D3ST rh-24v JESD22-A105 a105 transistor HUF75309D3ST rfp70n06 RFD3055LESM9A JESD22-A110 HRF3205 equivalent HUF75343 HUF75344P3
2002 - Mark W4

Abstract: SM-0202-02 7133W
Text: Equipment Material Testing Manufacturing Site Data Sheet Other To consolidate Wafer Fab production from , IDT's Wafer Fab facility in Hillsboro, Oregon. These devices will be upgraded from Cmos 7 (.64µm) to , products from Salinas, California Wafer Fab Facility ( Fab 2) to Hillsboro, Oregon Wafer Fab Facility ( Fab 4). Part Name 7132S 7132SF 7133W 7134W Current Wafer Fab Manufacturing Technology Wafer Site , inch Die Revision S SF W W Transfer Wafer Fab Manufacturing Technology Wafer Site Size Hillsboro


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PDF SM-0202-02 IDT7130 IDT7132 IDT71321 IDT7140 IDT7142 IDT71421 Mark W4 7133W
2002 - QCA-1795

Abstract: CMOS 7 CMOS7 1509-01 idt6116la IDT7164 6116L4
Text: Other Date Effective: To consolidate Wafer Fab production from Salinas, California ( Fab 2) to Hillsboro, Oregon ( Fab 4).These qualified products will be transferred to IDT's Wafer Fab facility in , Detail of Change Transfer existing qualified products from Salinas, California Wafer Fab Facility ( Fab 2) to Hillsboro, Oregon Wafer Fab Facility ( Fab 4). Current Wafer Fab Manufacturing Technology Wafer Site Size Salinas, CA Salinas, CA Cmos 7 Cmos 7 6 inch 6 inch Transfer Wafer Fab Manufacturing


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PDF SR-0203-02 IDT7164 IDT6116 FRA-1509-01 QCA-1795 SR-0203-02 IDT6116LA IDT6116SA QCA-1795 CMOS 7 CMOS7 1509-01 6116L4
2001 - 71256SA

Abstract: 71256TT
Text: Fabrication Facility. Salinas California Wafer Fabrication Facility has been qualified for 6 " wafer Fab and , for Cmos 9 (.35µm). Current Wafer Fab Transfer Wafer Fab Manufacturing Site Salinas, CA Salinas, CA , for change in Wafer Fab site Datecode>B 0114x Datecode>YY 0117x Datecode>TT 0117x Datecode>TT 0117x , upon request DESCRIPTION AND PURPOSE OF CHANGE: Die Technology Wafer Fabrication Process Assembly , product from Hillsboro, Oregon ( Fab 4) to Salinas, California ( Fab 2) to enhance Fab capacity loading


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PDF SR0102-02 Man2001 61298TT FRC-1509-01 QCC-1795 71256SA 71256TT
84-3MV

Abstract: twl3025 PTWL3025BZGM TWL3025BZGM TWL3025BZGMR identification trace code texas A07s t3025bggm texas instruments lot trace code twl3025bzqwr
Text: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 PCN# 20050304000 New Wafer Fab for IOTA A07s , Instruments PCN# 20050304000 PCN Number: 20050304000 Title: New Wafer Fab for IOTA A07s Customer , Type: Assembly Site Design Test Site Wafer Bump Site Wafer Fab Site 05/02/2005 Phone: 03 , Electrical Specification Packing/Shipping/Labeling Wafer Bump Material Wafer Fab Materials Quality , Wafer Fab Process PCN Details Description of Change: As per initial notification (PCN 20040630000


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PDF T3025BGGM T3025BGQW 84-3MV twl3025 PTWL3025BZGM TWL3025BZGM TWL3025BZGMR identification trace code texas A07s t3025bggm texas instruments lot trace code twl3025bzqwr
HD4004

Abstract: JESD22-A104-A Polyimide JESD22-A114-A a103 transistor Tsi310A-133CE IBM DATE CODE JESD22-A118 TSI310A
Text: request DESCRIPTION AND PURPOSE OF CHANGE: Die Technology This PCN is to document wafer fab production from IBM Altis, France to Wafer Fabrication Process IBM Burlington, USA. In relation to this , CHANGE NOTICE (PCN) ATTACHMENT I - PCN #: I0909-01 PCN Type: Fab Site and Material Change Data Sheet Change: None Detail of Change: This PCN is to document wafer fab production from IBM , Wafer Fab Die Revision Fab Technology Minimum Gate Length (µm) Die Dimensions (mm2) Sample


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PDF I0909-01 TSI310A-133CE, TSI310A-133CEY EIA/JESD78 JESD22-A118 JESD22-A104-A JESD22-A103-B JESD22-A113 5V/140 HD4004 JESD22-A104-A Polyimide JESD22-A114-A a103 transistor Tsi310A-133CE IBM DATE CODE JESD22-A118 TSI310A
320F2812PGFA

Abstract: tms dsp 320F2812PGFA 320f2811pbka 320F2810PBKA TI TMS F2812 ti part naming convention TMS320F281x 320F2811PBKQ TMS320F2812 CC BGA 1833c05
Text: Controller Additional Wafer Fab and Silicon Revision Change Final Change Notification / Sample Request , Wafer Bump Site Wafer Fab Site June 30, 2004 Samples Available date: Assembly Process Electrical Specification Packing/Shipping/Labeling Wafer Bump Material Wafer Fab Materials 04/01/2004 Assembly Materials Mechanical Specification Test Process Wafer Bump Process Wafer Fab Process PCN , JOINT-KFAB/DM5 wafer fab manufacturing process in its 1833F05 technology and product development; and


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PDF TMS320F281X 320F2811PBKA 320F2811PBKS 320F2811PBKQ 320F2812PGFA 320F2812PGFQ 320F2812GHHA 320F2812GHHQ 320F2810PBKA 320F2810PBKQ 320F2812PGFA tms dsp 320F2812PGFA 320f2811pbka 320F2810PBKA TI TMS F2812 ti part naming convention 320F2811PBKQ TMS320F2812 CC BGA 1833c05
FAIRCHILD MM74HC

Abstract: Fairchild wafer fab MM74HC Fairchild wafer process 74LCX16500 74LCX 74VHC 74LCX573MSA 74LCX16500MTD 74LCX16500MEA
Text: listing. Description of Change: Fairchild Semiconductor is announcing an additional wafer fab location , -inch wafer fab located in South Portland, ME. The additional manufacturing facility will be ASMC (Advanced Semiconductor Manufacturing Corporation) 6-inch wafer fab located in Shanghai, China (PRC). This change is , intends to supply these devices interchangeably from either wafer fab location. There are no design , characteristics of any affected device. Products manufactured at the new wafer fab location will continue to be


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PDF 0033508-A 74LCX, 74VHC, MM74HC, MM74HCT MM74HCTdevices 74LCX16501MEAX FAIRCHILD MM74HC Fairchild wafer fab MM74HC Fairchild wafer process 74LCX16500 74LCX 74VHC 74LCX573MSA 74LCX16500MTD 74LCX16500MEA
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