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Part Manufacturer Description Datasheet Download Buy Part
LTC3854IDDB#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854EMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#TRMPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IMSE#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854EDDB#TRMPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C

to262 pcb footprint Datasheets Context Search

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to262 pcb footprint

Abstract: 51a marking irf1010ezpbf MARKING 51A AN-994
Text: on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. www.irf.com IRF1010EZ/S/LPbF TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking Information @Y6HQG@) UCDTÃDTÃ6IÃDSG" "G , IRF1010EZLPbF ID = 75A S TO-220AB IRF1010EZPbF D2Pak TO-262 IRF1010EZSPbF IRF1010EZLPbF , Junction-to-Ambient ­­­ 62 RJA Junction-to-Ambient ( PCB Mount, steady state) ­­­ 40 HEXFET® j


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PDF 5483A AN-994. IRF1010EZ/S/LPbF O-262 to262 pcb footprint 51a marking irf1010ezpbf MARKING 51A AN-994
to262 pcb footprint

Abstract: AN-994 IRFZ34N IRFZ34NL IRFZ34NS IRL3103L
Text: " square PCB (FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to , TO-262 Parameter ID @ TC = 25°C ID @ TC = 100°C IDM PD @TA = 25°C PD @TC = 25°C V GS EAS , Junction-to-Case Junction-to-Ambient ( PCB mount) * Typ. Max. Units 2.2 40 °C/W 1 07/19 , ) Notes: Repetitive rating; pulse width limited by D IRFZ34NS/LPbF TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking Information EXAMPLE : THIS IS AN


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PDF IRFZ34NS) IRFZ34NL) IRFZ34NSPbF IRFZ34NLPbF IRFZ34NS/LPbF O-262 IRL3103L to262 pcb footprint AN-994 IRFZ34N IRFZ34NL IRFZ34NS IRL3103L
to262 pcb footprint

Abstract: AN-994 IRF2804LPBF smd marking 634 IRF2804
Text: of other applications. TO-220AB IRF2804PbF D2Pak IRF2804SPbF TO-262 IRF2804LPbF , , Flat, Greased Surface RJA Junction-to-Ambient RJA Junction-to-Ambient ( PCB Mount, steady , % tested to this value in production. This is applied to D 2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. Max R DS(on) for D2Pak and TO-262 (SMD) devices. TO-220 device will have an Rth value of 0.45


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PDF 5332A IRF2804PbF IRF2804SPbF IRF2804LPbF EIA-418. O-220AB to262 pcb footprint AN-994 IRF2804LPBF smd marking 634 IRF2804
IRLZ34NS

Abstract: AN-994 IRLZ34N IRLZ34NL GS Logo, Marking 30A
Text: through-hole version (IRLZ34NL) is available for lowprofile applications. ID = 30A S D 2 Pak TO-262 , RJA Junction-to-Case Junction-to-Ambient ( PCB Mounted,steady-state)* Typ. Max. Units , ) TJ 175°C Uses IRLZ34N data and test conditions * When mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. 2 IRLZ34NS/LPbF TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking


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PDF IRLZ34NS) IRLZ34NL) IRLZ34NSPbF IRLZ34NLPbF AN-994. IRLZ34NS/LPbF O-262 3103L IRLZ34NS AN-994 IRLZ34N IRLZ34NL GS Logo, Marking 30A
marking 49M

Abstract: AN-994
Text: of other applications. TO-220AB IRF1405ZPbF D2Pak IRF1405ZSPbF TO-262 IRF1405ZLPbF , ( PCB Mount, steady state) ­­­ 40 i Units °C/W HEXFET® is a registered trademark of , is applied to D2Pak, when mounted on 1" square PCB Pulse width 1.0ms; duty cycle 2%. ( FR-4 or G-10 Material ). For recommended footprint and Coss eff. is a fixed capacitance that gives the same soldering , . 2 IRF1405Z/S/LPbF TO-262 Package Outline Dimensions are shown in millimeters (inches


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PDF IRF1405ZPbF IRF1405ZSPbF IRF1405ZLPbF AN-994. IRF1405Z/S/LPbF O-262 marking 49M AN-994
mJ 6920

Abstract: 5MAD AN-994 to262 pcb footprint J 6920 A IRFB3207ZPBF irfb3207z D670
Text: " square PCB (FR-4 or G-10 Material). For recom mended footprint and soldering techniques refer to application note #AN-994. R is measured at TJ approximately 90°C. IRFB/S/SL3207ZPbF TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking Information @Y6HQG@ , IRFS3207ZPbF TO-220AB IRFB3207ZPbF D TO-262 IRFSL3207ZPbF G D S Gate Drain Source , Junction-to-Ambient, TO-220 k ­­­ ­­­ Units 62 40 RJC 2 Junction-to-Ambient ( PCB Mount) , D Pak jk


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PDF 97213C IRFB3207ZPbF IRFS3207ZPbF IRFSL3207ZPbF 170Ac O-220AB O-262 mJ 6920 5MAD AN-994 to262 pcb footprint J 6920 A IRFB3207ZPBF irfb3207z D670
1999 - AN-994

Abstract: IRG4BH20K-L IRG4BH20K-S
Text: PD - 93764 PRELIMINARY TO-263 IRG4BH20K-S, TO-262 IRG4BH20K-L Short Circuit Rated , ) · Low-profile through-hole TO-262 (IRG4BH20KL) VCES = 1200V VCE(on) typ. = 3.17V G @VGE = , Junction-to-Case Case-to-Sink, Flat, Greased Surface Junction-to-Ambient ( PCB Mounted,steady-state , (oz) 1 8/17/99 TO-263 IRG4BH20K-S, TO-262 IRG4BH20K-L Electrical Characteristics @ TJ = 25 , ) junction temperature. (See fig. 13a) Pulse width 5.0µs, single shot. * When mounted on 1" square PCB


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PDF O-263 IRG4BH20K-S, O-262 IRG4BH20K-L IRG4BH20KS) O-262 IRG4BH20KL) Diod10) AN-994 IRG4BH20K-L IRG4BH20K-S
1999 - 3pn06l03

Abstract: ANPS071E smd diode marking 78A 3pn06 K TRANSISTOR SMD MARKING CODE INFINEON PART MARKING to263 OPTIMOS TRANSISTOR BIPP100N06S3L-03 INFINEON smd PART MARKING ID80A
Text: ambient, leaded RthJA - - 62 SMD version, device on PCB : RthJA @ min. footprint - , · n-Channel 55 RDS(on) max. SMD version Feature 100 A P- TO262 -3-1 P- TO263 , 3PN06L03 IPI100N06S3L-03 P- TO262 -3-1 - 3PN06L03 Maximum Ratings, at Tj = 25 °C, unless , www.infineon.com/optimos 2Qualified at -5V and +16V 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 4Defined by


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PDF IPI100N06S3L-03 IPP100N06S3L-03 IPB100N06S3L-03 IPP100N06S3L-03 3PN06L03 BIPP100N06S3L-03, 3pn06l03 ANPS071E smd diode marking 78A 3pn06 K TRANSISTOR SMD MARKING CODE INFINEON PART MARKING to263 OPTIMOS TRANSISTOR BIPP100N06S3L-03 INFINEON smd PART MARKING ID80A
1999 - IPP25N06S3L-21

Abstract: Diode smd marking 44 ANPS071E IPB25N06S3L-21 INFINEON smd PART MARKING
Text: version, device on PCB : RthJA @ min. footprint - - 62 @ 6 cm2 cooling area 3) - - , version P- TO262 -3-1 P- TO263 -3-2 V 21 m 25 RDS(on) · Enhancement mode 55 , 3N06L21 IPI25N06S3L-21 P- TO262 -3-1 - 3N06L21 Maximum Ratings, at Tj = 25 °C, unless , 2Qualified at -5V and +16V 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 4Defined by design. Not subject to


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PDF IPI25N06S3L-21 IPP25N06S3L-21 IPB25N06S3L-21 IPP25N06S3L-21 3N06L21 BIPP25N06S3L-21, Diode smd marking 44 ANPS071E IPB25N06S3L-21 INFINEON smd PART MARKING
1999 - 3N0625

Abstract: INFINEON PART MARKING 252 SMD marking code 1696 ANPS071E smd diode code marking 33A INFINEON smd PART MARKING IPI25N06S3-25 IPB25N06S3-25 IPP25N06S3-25 TO220 package infineon
Text: - 62 SMD version, device on PCB : RthJA @ min. footprint - - 62 @ 6 cm2 , On-Resistance RDS(on) IPI25N06S3-25 IPP25N06S3-25,IPB25N06S3-25 P- TO262 -3-1 V 24.9 m 25 , -25 P- TO262 -3-1 - 3N0625 Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter , on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 4Defined by design. Not subject to production test. Page 2


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PDF IPI25N06S3-25 IPP25N06S3-25 IPB25N06S3-25 IPP25N06S3-25 3N0625 BIPP25N06S3-25, 3N0625 INFINEON PART MARKING 252 SMD marking code 1696 ANPS071E smd diode code marking 33A INFINEON smd PART MARKING IPI25N06S3-25 IPB25N06S3-25 TO220 package infineon
Not Available

Abstract: No abstract text available
Text: . D i Pak TO-262 Absolute Maximum Ratings U n its P a ra m e te r M ax. lD @ Tc = 25 , Junction-to-Case Junction-to-Ambient ( PCB Mounted,steady-state)” — — Max. Units 3.3 40 , < 300(js; duty cycle < 2%. © Uses IRLZ24N data and test conditions * When mounted on 1" square PCB ( FR-4 or G-10 M aterial). For recommended footprint and soldering techniques refer to application , ) 1.14 (.045) MINIMUM RECOMMENDED FOOTPRINT 11.43 (.450) ff; NOTES: 1 DIMENSIONS AFTER SOLDER DIP


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PDF 1358D IRLZ24NS/L IRLZ24NS) IRLZ24NL)
1999 - 3N0607

Abstract: ANPS071E IPB80N06S3-07 IPI80N06S3-07 IPP80N06S3-07 DIODE 7387 smd diode code 102a c4 09 smd marking code
Text: - 62 SMD version, device on PCB : RthJA @ min. footprint - - 62 @ 6 cm2 , · Low On-Resistance RDS(on) IPI80N06S3-07 IPP80N06S3-07,IPB80N06S3-07 80 A P- TO262 , -07 P- TO262 -3-1 - 3N0607 Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter , on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 4Defined by design. Not subject to production test. Page 2


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PDF IPI80N06S3-07 IPP80N06S3-07 IPB80N06S3-07 IPP80N06S3-07 3N0607 BIPP80N06S3-07, 3N0607 ANPS071E IPB80N06S3-07 IPI80N06S3-07 DIODE 7387 smd diode code 102a c4 09 smd marking code
irf540

Abstract: IRF540NS to262 pcb footprint IRF540NL AN-994 IRF540N diode 16A 100V
Text: . *When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994 IRF540NS/IRF540NL TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262 Part Marking Information @Y6HQG@) UCDTÃDTÃ6IÃDSG" "G GPUÃ8P9@Ã


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PDF IRF540NS/IRF540NL IRF540N AN-994 O-262 irf540 IRF540NS to262 pcb footprint IRF540NL AN-994 diode 16A 100V
1999 - 3P03L04

Abstract: ANPS071E INFINEON smd PART MARKING IPI80P03P3L-04 INFINEON PART MARKING DIODE smd marking code UM 31 package to220 DIODE smd marking Ag IPP80P03P3L-04 IPB80P03P3L-04
Text: , leaded RthJA - - 62 SMD version, device on PCB : RthJA @ min. footprint - - , · Automotive AEC Q101 qualified 4 ID · Logic Level P- TO262 -3-1 V m -80 P , -3-2 - 3P03L04 IPI80P03P3L-04 P- TO262 -3-1 - Gate pin1 Marking 3P03L04 Maximum , information see app.-note ANPS071E available at www.infineon.com/optimos 2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without


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PDF IPI80P03P3L-04 IPP80P03P3L-04 IPB80P03P3L-04 IPP80P03P3L-04 3P03L04 BIPP80P03P3L-04, 3P03L04 ANPS071E INFINEON smd PART MARKING IPI80P03P3L-04 INFINEON PART MARKING DIODE smd marking code UM 31 package to220 DIODE smd marking Ag IPB80P03P3L-04
1999 - 3PN0603

Abstract: INFINEON smd PART MARKING ANPS071E BIPP100N06S3-03 IPB100N06S3-03 IPI100N06S3-03 IPP100N06S3-03
Text: - 62 SMD version, device on PCB : RthJA @ min. footprint - - 62 @ 6 cm2 , ID · AEC Q101 qualified · Low On-Resistance RDS(on) 55 P- TO262 -3-1 V 3 m 100 , -03 P- TO262 -3-1 - 3PN0603 Maximum Ratings, at Tj = 25 °C, unless otherwise specified Parameter , 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB


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PDF IPI100N06S3-03 IPP100N06S3-03 IPB100N06S3-03 IPP100N06S3-03 3PN0603 BIPP100N06S3-03, 3PN0603 INFINEON smd PART MARKING ANPS071E BIPP100N06S3-03 IPB100N06S3-03 IPI100N06S3-03
1999 - 3N06L06

Abstract: C4 diode ANPS071E IPB80N06S3L-06 IPI80N06S3L-06 IPP80N06S3L-06 INFINEON smd PART MARKING IPI80N06S3L06
Text: , leaded RthJA - - 62 SMD version, device on PCB : RthJA @ min. footprint - - , · n-Channel 55 RDS(on) max. SMD version Feature 80 A P- TO262 -3-1 P- TO263 , 3N06L06 IPI80N06S3L-06 P- TO262 -3-1 - 3N06L06 Maximum Ratings, at Tj = 25 °C, unless , www.infineon.com/optimos 2Qualified at -5V and +16V 3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. 4Defined by


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PDF IPI80N06S3L-06 IPP80N06S3L-06 IPB80N06S3L-06 IPP80N06S3L-06 3N06L06 BIPP80N06S3L-06, 3N06L06 C4 diode ANPS071E IPB80N06S3L-06 IPI80N06S3L-06 INFINEON smd PART MARKING IPI80N06S3L06
to262 pcb footprint

Abstract: AN-994 IRFZ48Z IRFZ48ZL IRFZ48ZS ISD 1720
Text: . ID = 61A S TO-220AB IRFZ48Z D2Pak IRFZ48ZS TO-262 IRFZ48ZL Absolute Maximum Ratings , Junction-to-Ambient RJA j Junction-to-Ambient ( PCB Mount, steady state) ­­­ 62 ­­­ 40 HEXFET , % tested to this value in production. This is applied to D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer to application note #AN-994. IRFZ48Z/S/LPbF TO-262 Package Outline Dimensions are shown in millimeters (inches) TO-262


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PDF IRFZ48ZPbF IRFZ48ZSPbF IRFZ48ZLPbF AN-994. IRFZ48Z/S/LPbF O-262 3103L to262 pcb footprint AN-994 IRFZ48Z IRFZ48ZL IRFZ48ZS ISD 1720
AN-994

Abstract: IRF2907Z IRF2907ZL IRF2907ZS
Text: D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and , . D2Pak IRF2907ZS TO-220AB IRF2907Z TO-262 IRF2907ZL Absolute Maximum Ratings Parameter , Junction-to-Ambient ( PCB Mount, steady state) k jk Units 0.45 °C/W 0.50 Junction-to-Case Max , °C. IRF2907Z/S/L TO-262 Package Outline Dimensions are shown in millimeters (inches) 1- GATE IGBT 2- COLLECTOR 3- EMITTER TO-262 Part Marking Information G " " G DS Ã I 6 Ã T D Ã


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PDF IRF2907Z IRF2907ZS IRF2907ZL for-994. IRF2907Z/S/L O-262 AN-994 IRF2907Z IRF2907ZL IRF2907ZS
2010 - AUIRG4BC30U-S

Abstract: AUG4BC30U-S AN-994 AUIRG4BC30USTRL
Text: Junction-to-Ambient, ( PCB Mounted,steady-state)* Typ. Max. Units ­­­ ­­­ 1.2 40 °C/W * * When mounted on 1" square PCB (FR-4 or G-10 Material ). For recommended footprint and soldering techniques , frequencies 8-40 kHz in hard switching, >200 kHz in resonant mode · Industry standard D2Pak & TO-262 package , TO-262 AUIRG4BC30U-S AUIRG4BC30U-SL G Gate C Collector E Emitter Stresses beyond , Sensitivity Level 2 MSL1 TO-262 Machine Model D PAK N/A Class M4 (+/-450V) AEC-Q101


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PDF AUIRG4BC30U-S AUIRG4BC30U-SL O-262 O-262 AUIRG4BC30U-S AUG4BC30U-S AN-994 AUIRG4BC30USTRL
AN-994

Abstract: 10mhz mosfet WE-270 High Efficiency Synchronous Rectification in SMPS
Text: S D G S D G D2Pak IRFS3307PbF TO-220AB IRFB3307PbF TO-262 IRFSL3307PbF , Junction-to-Ambient ( PCB Mount) , D Pak jk l Units °C/W 1 IRFB/S/SL3307PbF Static @ TJ = 25 , rising from 0 to 80% VDSS. When mounted on 1" square PCB (FR-4 or G-10 Material). For recom mended footprint and soldering techniques refer to application note #AN-994. R is measured at TJ approximately 90°C. RJC (end of life) for D2Pak and TO-262 = 0.75°C/W. Note: This is the maximum measured value


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PDF 95706C IRFB3307PbF IRFS3307PbF IRFSL3307PbF O-220AB O-262 120efer AN-994 10mhz mosfet WE-270 High Efficiency Synchronous Rectification in SMPS
AN-994

Abstract: 24v 30a smps
Text: mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques , 30V 260A D2 Pak IRL3713SPbF TO-262 IRL3713LPbF Absolute Maximum Ratings Max Units , , Flat, Greased Surface RJA Junction-to-Ambient RJA Junction-to-Ambient ( PCB Mount) fi , (end of life) for D2Pak and TO-262 = 0.50°C/W. This is the maximum measured value after 1000


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PDF 97011B IRL3713PbF IRL3713SPbF IRL3713LPbF O-220AB O-262 O-220A AN-994 24v 30a smps
AN-994

Abstract: power mosfet 80v 150a D2PAK package IRFS4410PBF to262 pcb footprint
Text: " square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application note #AN-994. R is measured at TJ approximately 90°C. RJC (end of life) for D2Pak and TO-262 , S D G S D G D2Pak IRFS4410PbF TO-220AB IRFB4410PbF TO-262 IRFSL4410PbF , -220 ­­­ 62 ­­­ 40 k RJC Junction-to-Case RCS RJA RJA Junction-to-Ambient ( PCB


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PDF 95707E IRFB4410PbF IRFS4410PbF IRFSL4410PbF O-220AB O-262 AN-994. AN-994 power mosfet 80v 150a D2PAK package IRFS4410PBF to262 pcb footprint
Not Available

Abstract: No abstract text available
Text: frequencies 8-40 kHz in hard switching, >200 kHz in resonant mode • Industry standard D2Pak & TO-262 , n-channel D2Pak TO-262 AUIRG4BC30U-S AUIRG4BC30U-SL G Gate C Collector E Emitter , RθJA Junction-to-Case Junction-to-Ambient, ( PCB Mounted,steady-state)* Typ. Max. Units ––– ––– 1.2 40 °C/W * * When mounted on 1" square PCB (FR-4 or G-10 Material ). For recommended footprint and soldering techniques * refer to application note #AN-994.


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PDF AUIRG4BC30U-S AUIRG4BC30U-SL O-262 O-262
2004 - AN-994

Abstract: IRF530S IRG4BC10SD-L IRG4BC10SD-S IRL3103L
Text: on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and soldering techniques refer , anti-parallel diodes for use in bridge configurations · Industry standard D2Pak & TO-262 packages · Lead-Free , losses D2Pak IRG4BC10SD-S TO-262 IRG4BC10SD-L Absolute Maximum Ratings Parameter VCES IC @ , Junction-to-Ambient, typical socket mount ­­­ Junction-to-Ambient ( PCB Mount, steady state) ­­­ Weight ­­­ Typ , typical PCB socket Mount Load Current ( A ) 8.0 60% of rated voltage 6.0 Ideal diodes


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PDF IRG4BC10SD-SPbF IRG4BC10SD-LPbF O-262 AN-994. AN-994 IRF530S IRG4BC10SD-L IRG4BC10SD-S IRL3103L
2004 - AN-994

Abstract: IRF530S IRG4BC15UD-L IRG4BC15UD-S IRL3103L
Text: applies to D2Pak, when mounted on 1" square PCB ( FR-4 or G-10 Material ). For recommended footprint and , Industry standard D2Pak & TO-262 packages · Lead-Free Benefits VCES = 600V VCE(on) typ. = 2.02V , TO-262 IRG4BC15UD-L Absolute Maximum Ratings Parameter VCES IC @ TC = 25°C IC @ TC = 100 , Case-to-Sink, flat, greased surface Junction-to-Ambient, typical socket mount Junction-to-Ambient ( PCB Mount , typical PCB socket Mount Load Current ( A ) 10.00 8.00 60% of rated voltage 6.00 Ideal


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PDF IRG4BC15UD-SPbF IRG4BC15UD-LPbF from10 O-262 AN-994. AN-994 IRF530S IRG4BC15UD-L IRG4BC15UD-S IRL3103L
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