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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
TMS320C242PGA Texas Instruments 16-bit, 5V Fixed-Point DSP - ''NRND'' (Not Recommended for New Designs) - Technical Support Limited 64-QFP -40 to 85
TMS320C242PGS Texas Instruments 16-bit, 5V Fixed-Point DSP - ''NRND'' (Not Recommended for New Designs) - Technical Support Limited 64-QFP -40 to 125
TSP53C34NL Texas Instruments TSP50C10 Masked ROM
TSP53C32NL Texas Instruments TSP50C10 Masked ROM
TSP53C36NL Texas Instruments TSP50C11 Masked ROM
74ALVCHG162280GRE4 Texas Instruments 16-To-32 Bit Registered Bus Exchanger With Byte Masks And 3-State Outputs 80-TSSOP -40 to 85

technical of tamura solder mask Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
Not Available

Abstract: No abstract text available
Text: . Soldering PROFILE OF SO LD ERIN G (REFLOW SOLDER ) Tp Tp - Peak Temperature 2 4 0 °C Tn Tn - Melt , POWER COMPONENTS Surface Mounted Switches TYPE QF/QH/PH SERIES « The `stare of the art' range of SMT switches are manufactured from high temperature materials making them all suitable for IR and Vapour phase reflow solder processes. There are also ver sions that are hermetically sealed and suitable , ) Sealed for Washing Reflow and Dip and Wave Solder a tTM J -1.3 1 ± 0.2 G EZ5L PH


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RFP-2405

Abstract: IFS-0505 RCN-0512 IFD-2412 RFP2405 4-20 ma to 0 to 10 V converter ckt ifd 0512 NDP-0515 RCN-1212 IFS0505
Text: /gCjforiyjrtete^ TAMURA COR-P OF AMERI CA 14E j> aam sT? d o o d id s t D T - 5 7 ' , -202 Testing " t a m u r a Technical Bulletin No. 221 Polarity Reversing Non-isolation converters , RP OF A M E R I C A H 0.3 watt Isolation Converters MODEL NO. s* aamsT? ooooigo t , d r-i7 , and RHP models, ±30%. All others ±20% of nominal. 48VDC input range 42 to 60VDC. NOTE: input voltage not to exceed 1.2 times nominal and do not reverse polarity. Output voltage: ±1% of nominal except IDQ


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PDF 48VDC 000mw MIL-STD-202 NAN-0505 NAN-05ed CX-101 CX-102 CX-103 CX-104 SAT-340 RFP-2405 IFS-0505 RCN-0512 IFD-2412 RFP2405 4-20 ma to 0 to 10 V converter ckt ifd 0512 NDP-0515 RCN-1212 IFS0505
2007 - OM338

Abstract: technical of tamura solder paste technical of tamura solder mask luxeon F1 LUXEON Rebel LED 210WP tamura solder paste PROFILE Tamura Of America tamura solder paste E38152
Text: white mask labeled "White Text" is a printed layer consisting of a double printed layer of Tamura USI , finished diameter of 0.25mm. The drill hole for a 35 micron PTH thickness will be 0.32mm. The solder mask , solder mask is designed. The clearance is 0.05mm minimum. The total minimal width of the solder mask around the via is 0.25 mm. Figure 11 shows the resulting solder mask design of the thermal pad. Figure 10. Finished diameter and spacing dimensions. Figure 11. Solder mask design of thermal pad


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Aluminum Electrolytic Capacitors

Abstract: TAMURA NA-200 Tamura NA200 flux NA200 flux Tamura kaken NRSZ101M100V12.5X20F NACE NA-200 Tamura SAT-5000 senju h63a
Text: ] ISO9001: 2000 REGISTERED - Page 1 of 23 - www.niccomp.com | Technical Support: tpmg@niccomp.com , data (Pages 14 & 15) ISO9001: 2000 REGISTERED - Page 2 of 23 - www.niccomp.com | Technical , www.niccomp.com | Technical Support: tpmg@niccomp.com Liquid Type Aluminum Electrolytic Capacitors Change of , www.niccomp.com | Technical Support: tpmg@niccomp.com Liquid Type Aluminum Electrolytic Capacitors Change of , 6 of 23 - www.niccomp.com | Technical Support: tpmg@niccomp.com Liquid Type Aluminum


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PDF NPC221M2D7XATRF 22MPa ISO9001: Aluminum Electrolytic Capacitors TAMURA NA-200 Tamura NA200 flux NA200 flux Tamura kaken NRSZ101M100V12.5X20F NACE NA-200 Tamura SAT-5000 senju h63a
1998 - EVQ-PQ

Abstract: No abstract text available
Text: . Ask factory for technical specifications before purchase and/or use. Whenever a doubt about safety issues arises from this product, please inform us immediately for technical consultation. Panasonic s Recommended Reflow Soldering Conditions Item Preheat Soldering Conditions Set the surface of PWB at 180 ¡C in 2.5±0.3 minutes after put into the preheat or chamber oven. Set the surface of switches , r 1.0±0.5 E 2.0±0.5 s Recommended Shape of Test Pole s Recommended Operating Conditions


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PDF K322V EVQ-PQ
1998 - Not Available

Abstract: No abstract text available
Text: Contact: Steven Chen The Internet Multimedia Company Canada Premier Technical Sales, Inc. 3 , . infoshare.ca Contact: Jerry Benjamin Premier Technical Sales, Inc. 43 Pretty Street Stittsville, Ontario K2S , 81-3-3325-0021 e-Mail: etamura@kscjp.co.jp Contact: Eddie Tamura e-Mail: nimexco@mb.infoweb.or.jp Contact , Internet Multimedia Company U.S.A. Premier Technical Sales Inc. 3235 Kifer Road, Suite 110 Santa Clara , . Our web-site is another resource for up-to-date contact information of our distributors and


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1994 - transistor top200yai

Abstract: TOPSWITCH TOP200YAI TOP200Yai equivalent furukawa TEX-E EN 50065-1 PLT-21 PLT-20 EN50065-1 Z2180U
Text: Rise Data. The prototype power supply required electrostatic shielding on the solder side of the , VAC mains input range of the TOPSwitch allows worldwide operation, from 100 VAC applications in Japan , dictate the use of a very compact, efficient TOPSwitch power supply. The highly efficient TOPSwitch supply delivers 5.4 W at 9.75 V, satisfying the worst case current needs of the PLT-20 transceiver , operating range of the TOPSwitch allows one common power supply design to be used for both indoor and


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PDF PLT-20 DN-13 transistor top200yai TOPSWITCH TOP200YAI TOP200Yai equivalent furukawa TEX-E EN 50065-1 PLT-21 EN50065-1 Z2180U
CF-220V

Abstract: 6 pin TACT SWITCH
Text: direction of X, Y and Z and for 2 hours respectively Cold Environmental test Dry heat Damp heat -30±2° , specifications) Nonetheless, if you order products for technical study only, we can It may not be possible to mount to some in N minimum packaging units accept sampling order for a quantity of 200 units or , be coated with fax Am bient temperature of the soldered surface of PC board. 100 C max. 45s m ax. 2 5 , conditions. 2. Prevent flux penetration from the top side of the TACT switch. 3. Switch terminals and a PC


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PDF SKPDAFD010 50MQmin. 10Hz/min. CF-220V 6 pin TACT SWITCH
2008 - smema

Abstract: STR22 smema wiring technical of tamura solder paste smema control Cu6Sn5 telcon Schloetter 305-311 TND311
Text: : Pure Tin Proc. of the Technical Prog. Surf. Mount Technol., v.2, p. 641 (1996) Ellis, W , Sheng, G. Structure and Kinetics of Sn Whisker Growth on Pb-Free Solder Finish IEEE Electronics , ) that occupies more volume than the amount of tin consumed thus generating a compressive stress in the , relieve residual stress because the preferred method of grain growth is somehow inhibited. Plating , plating. This is done through careful control of residual stress in the plated Sn film through the use of


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PDF TND311 TND311/D smema STR22 smema wiring technical of tamura solder paste smema control Cu6Sn5 telcon Schloetter 305-311 TND311
2005 - smema

Abstract: smema control STR223 smema wiring electronics nasa smema specifications Phoenix contact subcon 9 connector Telcon Schloetter tamura tin lead solder paste
Text: Abys, J. An Alternative Surface Finish for Tin/Lead Solders: Pure Tin Proc. of the Technical , Kinetics of Sn Whisker Growth on Pb-Free Solder Finish IEEE Electronics Comp. and Technol. Conf. (2002 , point matte Sn of 232°C fits well within the 230°C to 260°C heat-tolerance temperature of today , history of reliability and successful manufacturing experience. The industry has always been driven to one standard in an effort to simplify the manufacturing strategy. Based on ease of manufacture and


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PDF TND311 TND311/D smema smema control STR223 smema wiring electronics nasa smema specifications Phoenix contact subcon 9 connector Telcon Schloetter tamura tin lead solder paste
MT7201

Abstract: MT7201-ND MT7204-ND CSE187-L MT7191-ND mt7201nd mt7200 MT7202-ND CST206-3A MT7200-ND
Text: primary and measuring circuit, measurement of DC or AC (kHz) or both · No primary losses · Quick response · High reliability by simple design of circuit Specifications: · Frequency Band Width (-3dB): L01Z , Effect 3.3 -15V GND +15V OUT +IN -IN Bottom View Price Each 10 25 Tamura Part No , sense transformers are used to detect the current passing through a conductor. They are constructed of , to 30 amperes. TECHNICAL NOTES: · Turns ratio: Primary to sense 1:500 · Suggested burden resistor


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PDF CST206-1A CST206-1T* CST206-2A CST206-2T* CST206-3A CST206-3T* CST306-1A CST306-1T* CST306-2A CST306-2T* MT7201 MT7201-ND MT7204-ND CSE187-L MT7191-ND mt7201nd mt7200 MT7202-ND CST206-3A MT7200-ND
2003 - MDA2504

Abstract: diode 1N4004 spice spice TRANSFORMER simulation MDA2504 diode rectifier xfmr spice 1n4004 SPICE 1N4004 bridge rectifier D44H11 Intusoft C320C104K5R5CA
Text: percent of an incandescent lamp's energy is converted directly into heat; a surprisingly large amount of , can be reflected out away from the lamp, but if there is a lens or filter in front of the lamp the , the use of a filter. This is not the case with LEDs. LEDs produce a rather narrow spectrum of light , hours and 2000 hours of life. A fluorescent lamp including like the compact incandescent type can offer between 8000 and 12,000 hours of life. All of these lamps have filaments. The greater number of


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PDF AND8137/D MDA2504 diode 1N4004 spice spice TRANSFORMER simulation MDA2504 diode rectifier xfmr spice 1n4004 SPICE 1N4004 bridge rectifier D44H11 Intusoft C320C104K5R5CA
2005 - ipc-cm-770

Abstract: WLCSP stencil design WLCSP smt X-RAY INSPECTION wlcsp inspection WLCSP chip mount intersil standard part marking WLCSP key pad 3x4 WLCSP chip attach
Text: pitch of 0.5mm or 0.4mm allows assembly with standard SMT equipment SOLDER JOINT SOLDER MASK · , 4. Alignment of solder mask opening with mounting pad 0.100mm to 0.125mm Stencil Apertures , of Intersil's WLCSP. Figure 3 shows Intersil WLCSP mounted on PCB. SOLDER BALL: Sn/Ag/Cu TOP , 4x4 20 4x5 25 5x5 30 5x6 36 The purpose of this technical brief is to outline , devices to the board which subsequently becomes part of the solder joint, must be defined and controlled


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PDF 05mmx1 TB451 ipc-cm-770 WLCSP stencil design WLCSP smt X-RAY INSPECTION wlcsp inspection WLCSP chip mount intersil standard part marking WLCSP key pad 3x4 WLCSP chip attach
pcb warpage in ipc standard

Abstract: JEDEC J-STD-033A J-STD-033A LGA rework AN1028 reflow profile FOR LGA COMPONENTS JSTD033A SN96 AN-1029 LGA-24 land pattern
Text: lands, instead of NSMD (Non Solder Mask Defined) pads. The use of SMD pads will provide the best , 2 of 6 Application Note AN-1028 1.2 Solder Mask Opening Design The land pads on the , (8) of this device has dimensions of 5mm X 2mm. On the user's PCB, the solder mask opening of this , .1 Solder Mask Opening PCB , mounted should be considered. Large copper land for heat transfer improvement Solder mask opening


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PDF AN-1028 AN-1029. pcb warpage in ipc standard JEDEC J-STD-033A J-STD-033A LGA rework AN1028 reflow profile FOR LGA COMPONENTS JSTD033A SN96 AN-1029 LGA-24 land pattern
2008 - UBX-G5000

Abstract: smd 5H transistor transistor SMD making code 3f DATASHEET OF IC 741 technical data sheet of tamura solder paste tig welding machine Diode smd 5H mobile MOTHERBOARD CIRCUIT diagram tamura solder paste TIM-5H
Text: Mask Status / Comments This document and the use of any information contained therein, is , Technical Documentation As part of our commitment to customer support, u-blox maintains an extensive volume of technical documentation for our products. In addition to our product-specific , 4 Technical Support Worldwide Web Our website (www.u-blox.com) is a rich pool of , documents, contact the nearest of the Technical Support offices by email. Use our service pool email


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PDF G5-MS5-07015-A-1 UBX-G5000 smd 5H transistor transistor SMD making code 3f DATASHEET OF IC 741 technical data sheet of tamura solder paste tig welding machine Diode smd 5H mobile MOTHERBOARD CIRCUIT diagram tamura solder paste TIM-5H
2014 - TB499

Abstract: No abstract text available
Text: .0 December 2, 2014 Technical Brief 499 Solder Masking of I/O Lands For NSMD lands, the solder mask , Two types of land patterns are used for surface mount packages: • Solder Mask Defined (SMD): Solder , solder mask opening with a web of solder mask between adjacent pads. The lead pitch of ceramic/metal , package) with no solder mask in between them. Solder Masking of the Thermal Land (for the case of , diameter. The vias can be plugged or tented with solder mask , either from the bottom or top surface of


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PDF TB499
2011 - TB488

Abstract: No abstract text available
Text: Two types of land patterns are used for surface mount packages: 1. Solder Mask Defined (SMD): Solder , copper pad and solder mask . Rounded portions of package pads should have a matching rounded solder , . 2 Typically each pad on the PCB should have its own solder mask opening with a web of solder , instance all the pads on one side of a package) with no solder mask in between the pads. For package , routing, and allows visual inspection of solder joints. Also, the exposed copper die-pad technology


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PDF TB488
2004 - qfn 10mm land pattern

Abstract: J-STD-005 nozzle heater paste profile MARK RAY QFN TB389 MO-220 IPC-SM-782 solder joint J-STD-001C
Text: . Technical Brief 389 Typically each pad on the PCB should have its own solder mask opening with a web of solder mask between adjacent pads. However for 0.4mm pitch parts with an I/O land width of about 0.25mm , Two types of land patterns are used for surface mount packages: 1. Solder Mask Defined (SMD): Solder , copper pad and solder mask . Rounded portions of package pads should have a matching rounded solder , have fully reflowed. FIGURE 9. EXAMPLE OF "BOARD LAND LIFT" 5 Technical Brief 389 SOLDER


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PDF TB389 qfn 10mm land pattern J-STD-005 nozzle heater paste profile MARK RAY QFN MO-220 IPC-SM-782 solder joint J-STD-001C
2004 - TB389

Abstract: No abstract text available
Text: rules. Solder Mask Design Two types of land patterns are used for surface mount packages: 1 , (NSMD): Solder mask openings larger than metal pads. Better control of the copper etching process as , 75m design clearance between the copper pad and solder mask . Rounded portions of package pads , own solder mask opening with a web of solder mask between adjacent pads. However for 0.4mm pitch parts with an I/O land width of about 0.25mm, space may not be available for solder mask web in


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PDF TB389
2005 - TB451

Abstract: intersil standard part marking wlcsp inspection
Text: opening REFLOW STEP 3 FINAL/X-RAY INSPECTION STEP 4 4. Alignment of solder mask opening , allows assembly with standard SMT equipment SOLDER JOINT SOLDER MASK INTERSIL WLCSP • No , sizes, since they control the final dimensions of the solder joint between board and package. â , part of the solder joint, must be defined and controlled. • Solder reflow process that forms the , ) and Solder Mask (in NSMD) (25µm) Stencil Fabrication Laser cut stainless steel followed by


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PDF TB451 intersil standard part marking wlcsp inspection
2004 - qfn Substrate design guidelines

Abstract: j-std-001d IPC-SM-782 MO-220 TB389
Text: Mask Design Two types of land patterns are used for surface mount packages: 1. Solder Mask Defined , copper pad and solder mask . Rounded portions of package pads should have a matching rounded solder , solder mask opening with a web of solder mask between adjacent pads. However for 0.4mm pitch parts with an I/O land width of about 0.25mm, space may not be available for solder mask web in between the , pads on one side of a package) with no solder mask in between the pads. Stencil Type and Thickness


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PDF TB389 qfn Substrate design guidelines j-std-001d IPC-SM-782 MO-220
2004 - J-STD-005

Abstract: nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 TB389 XQFN
Text: board design ground rules. Solder Mask Design Two types of land patterns are used for surface mount , Defined (NSMD): Solder mask openings larger than metal pads. Better control of the copper etching , design clearance between the copper pad and solder mask . Rounded portions of package pads should have a , opening with a web of solder mask between adjacent pads. However for 0.4mm pitch parts with an I/O land width of about 0.25mm, space may not be available for solder mask web in between the pads. In that


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PDF TB389 J-STD-005 nozzle heater Soldering guidelines and SMD footprint design Technical Brief TB389 IPC-SM-782 MO-220 XQFN
2004 - J-STD-005

Abstract: land pattern for DFN qfn 10mm land pattern qfn Substrate design guidelines two tinned touch pads nozzle heater PIC16F877A circuit diagram Technical Brief TB389 MO-220 TB389
Text: board design ground rules. Solder Mask Design Two types of land patterns are used for surface mount , Defined (NSMD): Solder mask openings larger than metal pads. Better control of the copper etching , design clearance between the copper pad and solder mask . Rounded portions of package pads should have a , opening with a web of solder mask between adjacent pads. However for 0.4mm pitch parts with an I/O land width of about 0.25mm, space may not be available for solder mask web in between the pads. In that


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PDF TB389 J-STD-005 land pattern for DFN qfn 10mm land pattern qfn Substrate design guidelines two tinned touch pads nozzle heater PIC16F877A circuit diagram Technical Brief TB389 MO-220
SENJU 221CM5

Abstract: Senju 2062-221CM5-32-11 senju printing speed Senju oz-2062 PC10 senju-metal panasert 2535M
Text: FREQUENCY & OPTICAL SEMICONDUCTOR DIV. 7 Technical Note 5 Evaluation of Solder Printing (1) Solder shape of MGF495*A Xs1 Metal Mask Size & Solder shape after printing Ys1 Xs1 Xg1 , OPTICAL SEMICONDUCTOR DIV. 2 Technical Note 1-b Recommended Metal Mask pattern for MGF495*A Unit : mm Tolerance : ±0.05 1.20 0.20 0.60 0.50 Terminal of PKG Metal Mask Thickness = 0.15mm Point 3 : Each quantity of solder have to be same Point 3 Each quantity of solder have


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PDF MGF495 NM-PC10 2062-221CM5-32-11 QL-1105E SENJU 221CM5 Senju 2062-221CM5-32-11 senju printing speed Senju oz-2062 PC10 senju-metal panasert 2535M
2014 - Not Available

Abstract: No abstract text available
Text: rules. Solder Mask Design Two types of land patterns are used for surface mount packages: 1. Solder , ): Solder mask openings larger than metal pads. Better control of the copper etching process as compared , 75µm design clearance between the copper pad and solder mask . Rounded portions of package pads should , solder mask web in between the pads. In that case, use one big opening designed around a whole strip of pads (for instance all the pads on one side of a package) with no solder mask in between the pads


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PDF ele00x TB498
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