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PCN0602

Abstract: sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg sumitomo g700 mold compound sumitomo epoxy G700 G700
Text: Change Description: Altera is adopting the Sumitomo G700 series mold compound as the standard mold , . Reason for Change: Altera is standardizing on the Sumitomo G700 series mold compound for all of its , Aug 2006 timeframe. Beginning with the top-mark date code of 0631, products molded with Sumitomo G700 , Qualification Data for the Sumitomo G700 Series Mold Compound Representative Package Read Out Results , for the Sumitomo G700 Series Mold Compound Material Properties Epoxy Hardener Filler Type Filler


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PDF PCN0602 E730SJ Sumitomo-G700 EME-E730SJ x10-5/ x102N/mm2 UL-94 PCN0602 sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg sumitomo g700 mold compound sumitomo epoxy G700 G700
CRM1064

Abstract: SUMITOMO G700 ablestik 2288a CRM-1064 CRM1064B Ablestik G700A G700 mold compound Sumitomo G700 sumitomo g700 mold compound
Text: materials will be changed as follows: Mold compound : from Sumitomo green G700 to Sumitomo green G700A Die attach material: from Sumitomo CRM1064B to Ablestik 2288A REASON FOR CHANGE: Supplier's decision to


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PDF XRT72L52IQ-F XRT72L52IQTR-F G0006-6 CRM1064 SUMITOMO G700 ablestik 2288a CRM-1064 CRM1064B Ablestik G700A G700 mold compound Sumitomo G700 sumitomo g700 mold compound
2009 - PCN0903

Abstract: Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 EPC16UI88AA ablestik 2288a Ablestik 2025D sumitomo g700 type
Text: Compound Die Attach Epoxy Au Bondwire Diameter PQFP 100 Sumitomo G700 Ablestik 2288A 1.2 mils Altera Corporation Additional Source ATK (Korea) 3 Sumitomo G700 Ablestik 3230 1.0 mils 11


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PDF PCN0903 PCN0903 Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 EPC16UI88AA ablestik 2288a Ablestik 2025D sumitomo g700 type
92HD80B1X5

Abstract: SUMITOMO G631 92HD79B1a5 92hd80 92hd80b1x5nlg 92HD80B1 92HD80B 92HD80B1X5NLGXTA48 hitachi en4900 EN-4900
Text: Hitachi EN4900 Mold Compound: Sumitomo G700 Lead Frame: Copper Alloy Plating: Matte 100% Sn Page 2 of 4 Sumitomo G631 Copper Alloy Matte 100% Sn Integrated Device Technology, Inc. 6024


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PDF A1007-01 VFQFPN-48) 92HD81B1X5NLGXTAX8 92HD81B1X5NLGXUAX 92HD81B1X5NLGXUAX8 92HD81B1X5NLGXYDX 92HD81B1X5NLGXYDX8 92HD83C1C5NLGXUAX 92HD83C1C5NLGXUAX8 92HD83C1C5NLGXYDX 92HD80B1X5 SUMITOMO G631 92HD79B1a5 92hd80 92hd80b1x5nlg 92HD80B1 92HD80B 92HD80B1X5NLGXTA48 hitachi en4900 EN-4900
JESD22-A118

Abstract: SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly
Text: Compound: Sumitomo G770HC, G770HCD, Sumitomo G700LY G770 series, CEL9220, G700 series, G631H Lead


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PDF A1004-01 2-Apr-2010 VFQFP-N-32 2-Jul-2010 S395CKLF 9LVRS395CKLFT 9LVRS395ENGKLF 9LVRS395ENGKLFT 9LVRS396AKLF 9LVRS396AKLFT JESD22-A118 SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly
SUMITOMO CRM1076

Abstract: JESD22-A113 sumitomo g770hcd SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H
Text: 0.9 mil, 0.8 mil Assembly Materials Mold Compound: Sumitomo G770HC, G770HCD, Sumitomo G700LY G770 series, CEL9220, G700 series, G631H Lead Frame: Copper Alloy Copper Alloy Plating: Sn/Pb


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PDF A1004-01R1 4-Jun-2010 VFQFP-N-32 2-Jul-2010 S395CKLF 9LVRS395CKLFT 9LVRS395ENGKLF 9LVRS395ENGKLFT 9LVRS396AKLF 9LVRS396AKLFT SUMITOMO CRM1076 JESD22-A113 sumitomo g770hcd SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H
sumitomo G700

Abstract: sumitomo epoxy 1076 0038 tsop Sumitomo 1076 8361J ablebond Die Attach epoxy stamping Compound c7025 sumitomo g700 type g700 mold compound
Text: Sensitivity (JEDEC J-STD20A) Date Code Range: ASE 28 TSOP 8x13.4x0.965 Sumitomo G700 Stamped Alloy 42 Sn Plate 100% Matte Sumitomo 1076 DS Au / 1.0 mil UL 94-V0 Level 3 0429 to 0429 , ) 28 TSOP 8x13.4x0.965 Sumitomo 7351T Stamped Copper C7025 SnPb Plate 8361J Epoxy Silverfilled , ATK (Amkor, K) 32 TSOP 8x20x1.0 Sumitomo 7351T Stamped Copper C7025 SnPb Plate 8361J Epoxy , Range: ATP (Amkor, PI) 28 TSOP 8x13.4x0.965 Sumitomo 7351T Stamped Copper C7025 SnPb Plate


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2012 - HMC916LP3

Abstract: SUMITOMO EME G700 hmc424lp3e SUMITOMO G700 HMC905LP3
Text: using 1 mil gold ball bonds. The part is encapsulated using Sumitomo EME G700 or equivalent epoxy


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PDF HMC424LP3E HMC536LP2 HMC546LP2 HMC646LP2 HMC652LP2 HMC653LP2 HMC654LP2 HMC655LP2 HMC656LP2 HMC657LP2 HMC916LP3 SUMITOMO EME G700 hmc424lp3e SUMITOMO G700 HMC905LP3
2004 - STMicroelectronics marking code date

Abstract: CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING
Text: bonding Mold Compound Type KE 3300 D G700 Toshiba Sumitomo Lead Finish Sn/Pb, 85/15


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PDF MPG-EEP/04/578 M50FW, M50LPW, M50FLW TSOP40 MPG/EE/0086 MPG/EEP/04/450. STMicroelectronics marking code date CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING
PCN0515

Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Text: : Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera , material will transition to the Sumitomo G770 series mold compound. This mold material had been fully , : Altera is standardizing the mold compound of its products in all FPBGA packages to the Sumitomo G770 , packaged with the Sumitomo G770 series mold compound beginning with FBGA packages carrying a top mark date , for SUMITOMO G770 series Material Properties Spiral Flow Gel Time Koka's Viscosity CTE-1 CTE


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PDF PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
PCN0712

Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Text: ASE Taiwan Nitto GE-100LFCS series Sumitomo G770 series Amkor Korea Amkor Philippines , levels (per JEDEC J-STD-020C). Reason for Change Sumitomo has announced the discontinuance of the , Appendix 3 Material Properties for the Sumitomo EME-G770 series Mold Compound Material Properties Epoxy , . -2 Tg Flexural Strength (RT) Flexural Modulus (RT) Specific Gravity Water Absorption (boil 24h , Sumitomo EME-G770 series MAR/Low vis. MAR/Tough 88.5 100/0 55 13 Modified Modified Type B


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PDF PCN0712 CEL-9750ZHF10AKL GE-100LFCS GE-100LFCS PCN0712 GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
PCN0516

Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
Text: : Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic , molded with Plaskon SMT-B-1 series material will transition to the Sumitomo G770 series mold compound , products in all PBGA packages to this Sumitomo G770 series mold compound. Products Affected: Package , molded with Sumitomo G770 series mold compound will begin shipping to customers. Date Code Marking , 12/23/05 PCN0516 Appendix 2 ­ Material Properties for SUMITOMO G770 series Material Properties


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PDF PCN0516 x10-5/C x102N/mm2 UL-94 1X10E12 PCN0516 G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
JEDEC JESD22-B116 free

Abstract: SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
Text: Material ( Sumitomo ) and die attach material 3230 manufactured by (Ablestik). This notification is Testing , , 84-1LMISR4 Ablestik 3230 Mold compound material Shinetsu KMC 184 Sumitomo 6300 series 7351LP and 7320CR Sumitomo EME-G700 series The list of the products effected are as follows: 71016S12PH , 3 of 8 EME-G700 SUMITOMO BAKELITE SUMIKON MULTI-AROMATIC RESIN Br/Sb FREE FOR Pb , FLOW GEL TIME (at 175°C) THERMAL EXPANSION 1 THERMAL EXPANSION 2 Tg THERMAL CONDUCTIVITY FLEXURAL


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PDF SR-0212-02 EME-G700 JEDEC JESD22-B116 free SUMIKON EME-G700 EME-G700 ablebond 3230 SUMItomo EME-G700 Sumitomo EME-G700 material Ablebond 84-1*SR4 Ablebond 8390 sumitomo G700 Tg ablebond 8390 cure time
2001 - JEDEC JESD22-B116

Abstract: SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 SB-U-00-004 MIL-STD-883 SB-U-02-002 mold compound
Text: compound materials from Sumitomo . Material Once qualified, IDT will add these mold compound materials as , Sheet Change Mold compound materials, Sumitomo EME-7351LP and EME-S351LP. No Detail of Change , 184VA, Sumitomo 6300, Sumitomo 7320 series Add Sumitomo 7351, Sumitomo S351 series Package Package , -1795 SUMITOMO BAKELITE EME-7351LP BI-PHENYL RESIN JEDEC LEVEL 1 LOW CTE LONG SPIRAL FLOW SUMIKON , EXPANSION 2 Tg THERMAL CONDUCTIVITY FLEXURAL STRENGTH (at 25°C) (at 240°C) FLEXURAL MODULUS (at 25°c) (at


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PDF G-0110-06 EME-7351LP EME-S351LP 4-10h JEDEC JESD22-B116 SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 SB-U-00-004 MIL-STD-883 SB-U-02-002 mold compound
sumitomo epoxy

Abstract: EME 7320 7320 8361H CY7C375-AC JESD22
Text: to160 Lead Thin Quad Flat Pack Sumitomo EME 7320 Mold Compound ASE Taiwan CYPRESS TECHNICAL CONTACT , Package: Up to 160 Lead Thin Quad Flat Pack Sumitomo , EME 7320 Mold Compound Assembly: ASE, Taiwan , , Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Tg , oC: Up to 160 Lead Thin Quad Flat Pack (TQFP) EME 7320 Sumitomo 145 Deg C Lead Frame material: Lead Finish, composition: Die , packages availability. Cypress Semiconductor Package: Up to 160 Lead Thin Quad Flat Pack Sumitomo


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PDF to160 CY7C375-AC sumitomo epoxy EME 7320 7320 8361H CY7C375-AC JESD22
PCN0708

Abstract: hysol BGA sumitomo cte table bga CB0260AT marking HB diode CBO260AT CRP-3900 EPF10K50V EPF10K100E
Text: ) Pb-free Sumitomo CRP-3300NH Hysol CB0260AT Encapsulant Dam Sumitomo CRP-3900 Hysol CB062 , sensitivity rating levels (per JEDEC J-STD-020C). Reason for Change Sumitomo , the current supplier, has , Data 3 10/22/2007 PCN0708 Appendix 1: Material Properties Comparison for Sumitomo and Hysol , content Filler type(s) Filler average size Specific gravity Tg CTE (a1) CTE (a2) Flexural , Pa.S min wt% Current Sumitomo CRP3300NH 32 10 75 Spherical silica Encapsulant Dam


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PDF PCN0708 PCN0708, CRP-3300NH CB0260AT CRP-3900 CB062 PCN0708 hysol BGA sumitomo cte table bga CB0260AT marking HB diode CBO260AT CRP-3900 EPF10K50V EPF10K100E
C7025

Abstract: sumitomo epoxy SUMITOMO 7351 4851025 Compound c7025 heraeus 8361H JESD22 140C CF-2071 sumitomo
Text: Thin Small Outline Package Sumitomo 7351 Molding Compound Cypress Philippines CYPRESS TECHNICAL , Semiconductor Assembly: Cypress Philippines Sumitomo 7351 Molding Compound QTP# 99302, V. 1.0 Page 2 of 5 , (with die size of 183.9 X 207.1 mils or less) Mold Compound Name/Manufacturer: Sumitomo 7351LS 14.3 x 4.5 GMS Mold Compound Tg , oC: 125 Deg C D/C Material if used: No Lead Frame material: Copper , . 8361H Ablestik Au 1.3 mil Wire Cypress Semiconductor Assembly: Cypress Philippines Sumitomo 7351


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PDF 7351LS C7025 85C/85% CY62128V-ZAIB C7025 sumitomo epoxy SUMITOMO 7351 4851025 Compound c7025 heraeus 8361H JESD22 140C CF-2071 sumitomo
sumitomo 6600

Abstract: sumitomo epoxy 6600 4835 sumitomo EME 6600 8361H sumitomo epoxy CY74FCT2646ATQC CY7C199-12VC JESD22 May 1999
Text: Name/Manufacturer: Sumitomo EME 6600CR Mold Compound Tg , oC: 150 Deg C D/C Material if used: Lead , Cypress Semiconductor Qualification Report QTP# 99101 VERSION 1.0 May, 1999 Sumitomo EME , Philippines Sumitomo 6600 Molding Compound QTP# 99101, V. 1.0 Page 2 of 5 May, 1999 PLASTIC PACKAGE , Wire Cypress Semiconductor Assembly: Cypress Philippines Sumitomo 6600 Molding Compound QTP , Sumitomo 6600 Molding Compound QTP# 99101, V. 1.0 Page 4 of 5 May, 1999 RELIABILITY TEST DATA QTP


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PDF 6600CR 6600CR 85C/85% CY7C63101A-OC CY74FCT2646ATQC CY74FCT2245ATQC 619903565M1 CY7C1399-VC CY62256V-VC sumitomo 6600 sumitomo epoxy 6600 4835 sumitomo EME 6600 8361H sumitomo epoxy CY74FCT2646ATQC CY7C199-12VC JESD22 May 1999
sumitomo epoxy eme6300h

Abstract: eme6300h OP-128 130C JESD22 CY2292SC
Text: Lead Plastic Small Outline ICs Sumitomo , EME 66300 Mold Compound Assembly: OSE Philippines QTP , Name: Mold Compound Name/Manufacturer: Mold Compound Tg , oC: Lead Frame material: Lead Finish , Plastic Small Outline IC (SOIC) in 150mil package body with die size 79 x 82 mils. Sumitomo EME6300H , Package: 16 Lead Plastic Small Outline ICs Sumitomo , EME 66300 Mold Compound Assembly: OSE Philippines , Sumitomo , EME 66300 Mold Compound Assembly: OSE Philippines QTP# 000101, V. 1.1 Page4 of 5 June, 2000


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PDF CY2292SC 85C/85 sumitomo epoxy eme6300h eme6300h OP-128 130C JESD22 CY2292SC
2005 - Sumitomo TOSA

Abstract: No abstract text available
Text: SXP3101 Series Sumitomo Electric Industries, Ltd. Page 1 TS-S05D034C July, 2005 1. General , modules on the same 2-wire interface bus. SXP3101 Series Sumitomo Electric Industries, Ltd. Page , . Package Dimensions Unit : mm SXP3101 Series Sumitomo Electric Industries, Ltd. Page 3 , Pinout SXP3101 Series Sumitomo Electric Industries, Ltd. Page 4 TS-S05D034C July, 2005 , pulled to host_Vcc on the host board. 2 15 GND Module Ground SXP3101 Series Sumitomo


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PDF TS-S05D034C 10Gb/s SXP3101SV IR-2/S-64 10GBASE-ER/EW, 1550nm OC-192/SDH STM-64 Sumitomo TOSA
Sumitomo EME-G600 material

Abstract: Ablestik 8290 Ablecube EME-G600 thermal conductivity ablebond 8290 ablestik 8390 Ablebond 84-1*SR4 EME-G600 Ablebond 8390 Ablebond 84-1LMISR4
Text: compound material Sumitomo EME-G600 series and a new die attach material Ablestik 8290. This Manufacturing , Material Sumitomo EME-6300 series Sumitomo EME-G600 series Die Attach Material Ablestik 8390 , Potassium Glass Transition Temperature Coefficient of Thermal Expansion Below Tg Above Tg Dynamic


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2003 - CRM1076E

Abstract: STMicroelectronics TRACEABILITY code XC18V02VQ44C part marking SUMITOMO G700 stmicroelectronics traceability sumitomo g700 type soic marking code stmicroelectronics datecode format stmicroelectronics XC18V04VQ44C0901 XC18V01SO20C
Text: Sensitivity Level 3 as defined in JEDEC standard J-STD-020A. UMC Die Attach Mold Compound Sumitomo 8361J Nitto MP8000 Sumitomo 8361J Nitto MP8000 Sumitomo 84-1MIS Nitto MP8000 Ablestik 8361J Sumitomo 7320 STMicroelectronics Die Attach Mold Compound Sumitomo CRM1076E Sumitomo G-600 Sumitomo CRM1076E Sumitomo G-600 Sumitomo CRM1076E Sumitomo G-600 Ablestik 3230 AA Sumitomo G-700 Package PC20 PC44 SO20 VQ44 Products


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PDF XC18V00 DS026 5PM5A0233 5BM5A0233 SCD0901. PCN2003-04A PCN2003-04 CRM1076E STMicroelectronics TRACEABILITY code XC18V02VQ44C part marking SUMITOMO G700 stmicroelectronics traceability sumitomo g700 type soic marking code stmicroelectronics datecode format stmicroelectronics XC18V04VQ44C0901 XC18V01SO20C
EME-7351

Abstract: Compound sumitomo epoxy
Text: Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Tg , oC: Lead Finish, composition , JA °C/W: Name/Location of All Assembly Facilities by Pkg.: 32Lead (400mil) SOJ Package. Sumitomo


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PDF 400mil) 32Lead EME7351 CY7C109-VC CY7C109-VIB 85C/60 EME-7351 Compound sumitomo epoxy
1999 - SB-U-02-002

Abstract: SB-U-03-003 79RV4640-XXXDU SB-U-02-004 79RV4650-XXXDP SB-U-03-002 79RC64V474 SB-U-01-001 79RC64V475-XXXDP EME-6730UC
Text: Testing Sumitomo (EME-6730) and Shinetsu (KMC184-9). Manufacturing Site Please see attached data sheets , VALUES SPIRAL FLOW GEL TIME (at 175°C) THERMAL EXPANSION 1 THERMAL EXPANSION 2 Tg THERMAL


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PDF M9911-03 79RC64V475-XXXDP; 79RC64V474-XXXDZ 79RV4640-XXXDU; 79RV4650-XXXDP SB-U-04-043 SB-U-02-002 SB-U-03-003 79RV4640-XXXDU SB-U-02-004 79RV4650-XXXDP SB-U-03-002 79RC64V474 SB-U-01-001 79RC64V475-XXXDP EME-6730UC
J-STD-020A

Abstract: Compound 60RH Ablestik 2000 J-STD-020-A
Text: Compound Tg , C: Lead Frame material: Lead Finish, composition: Die Attach Area Plating: Die Attach Method: Wire Bond Method: 100pin TQFP (14 x 14 x 1mm) Sumitomo 7320 (Qual Vehicle) All qualified


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PDF 100-pin 100L-TQFP 100pin CY7C4205V-ASC CY7C4271-AC CY7C0251-AC J-STD-020A Compound 60RH Ablestik 2000 J-STD-020-A
Supplyframe Tracking Pixel