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LM5111-1MY/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD
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LM5111-1MYX Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD
LM5111-3MY/NOPB Texas Instruments Dual 5A Compound Gate Driver 8-MSOP-PowerPAD
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sumitomo 6300h mold compound Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
MANUFACTURER AND SUPPLIER LOCATION INFORMATION

Abstract: eme-6300h EME-6300 CY7C199 CY7C198 CY7C197 CY7C196 CY7C195 CY7C194 CY7C192
Text: side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead , side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead , : 28-pin, 300-mil CerDIP Die to Package edge clearance: 18 mils per side Mold Compound Name , Passivation Mold Type Compound Assembly Line Location ESD Volt Rating Process Line ID ID , ) Design Rule (µ) µ Fabrication Passivation Mold Type Compound Assembly Line Location


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PDF CY7C191 CY7C192 CY7C194 CY7C195 CY7C196 CY7C197 CY7C198 CY7C199 CY7C191/192/194/195/196/197/198/199 MANUFACTURER AND SUPPLIER LOCATION INFORMATION eme-6300h EME-6300 CY7C199 CY7C198 CY7C197 CY7C196 CY7C195 CY7C194 CY7C192
EME-6300H

Abstract: sumitomo epoxy eme 6300h cypress fifo cy7c408A CY7C408A CY7C409A 6300H
Text: : 28-pin, 300-mil Plastic DIP Die to Package edge clearance: 76 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition , edge clearance: 96 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder Dipped, 63%Sn, 37%Pb Die Attach , Fabrication Passivation Mold Assembly ESD Volt Type Compound Line Rating Location Availability


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PDF CY7C408A CY7C409A CY7C408A/CY7C409A 7C408/7C409 15psig) 7C408WT-PC 90311-3E1) 200mA EME-6300H sumitomo epoxy eme 6300h cypress fifo cy7c408A CY7C408A CY7C409A 6300H
sumitomo epoxy 6300h

Abstract: sumitomo epoxy wafer LTO CY74FCT16244T EME-6300H hysol sumitomo 6300h mold compound
Text: per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper , Package edge clearance: 97 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder Dipped, 85%Sn, 15%Pb Die Attach , mil x mil Rule (stepping) (µ) µ Fabrication Passivation Mold Assembly Line Type Compound , Fabrication Passivation Mold Assembly Line Type Compound Location ESD Volt Rating Process Line


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PDF 16-Bit CY74FCT16244T 7C7144A March/1995 200mA sumitomo epoxy 6300h sumitomo epoxy wafer LTO CY74FCT16244T EME-6300H hysol sumitomo 6300h mold compound
86171

Abstract: EME-6300H CY7C123 CY7C150 UL-94V0 94v-0 dynamic RAM EME6300H
Text: Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish , Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish , -mil CerDIP Die to Package edge clearance: 92 mils per side Mold Compound Name/Manufacturer: Lead , : 190 mils per side Mold Compound Name/Manufacturer: Lead Frame material: N/A None Lead , Fabrication Passivation Mold Assembly ESD Volt Type Compound Line Rating Location Availability


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PDF CY7C150 7C150A 200mA 86171 EME-6300H CY7C123 CY7C150 UL-94V0 94v-0 dynamic RAM EME6300H
sumitomo epoxy 6300h

Abstract: sumitomo epoxy eme6300h sumitomo 6300h mold compound prime p27 EME-6300H mos die Sumitomo 1000
Text: clearance: 30 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H , -mil Plastic DIP Die to Package edge clearance: 33 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder Dipped, 63 , : 41 mils per side Mold Compound Name/Manufacturer: Lead Frame material: N/A Alloy 42 Lead , (stepping) Design Rule (µ) µ Fabrication Passivation Mold Assembly ESD Volt Type Compound


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PDF 7C258 7C259 CY7C258/259 7C258/9 sumitomo epoxy 6300h sumitomo epoxy eme6300h sumitomo 6300h mold compound prime p27 EME-6300H mos die Sumitomo 1000
EME-6300H

Abstract: CY7C425 CY7C419 sumitomo 6300h mold compound 7c42x sumitomo EME-6300H
Text: /ASSEMBLY DESCRIPTION (7C425) Package Outline, Type, or Name: 28-pin,300-mil PDIP Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder , DESCRIPTION (7C425) Package Outline, Type, or Name: 32-pin PLCC Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder Plate, 85%Sn, 15 , , Type, or Name: 28-pin, 300-mil CerDIP (7C425) Mold Compound Name/Manufacturer: Lead Frame


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PDF CY7C419 CY7C420/CY7C421 CY7C424/CY7C425 CY7C425 7C425) --65C EME-6300H CY7C425 CY7C419 sumitomo 6300h mold compound 7c42x sumitomo EME-6300H
2009 - Not Available

Abstract: No abstract text available
Text: compound /die attach change PCN #: 1134 TITLE Conversion of Sumitomo mold compound EME- 6300H (being discontinued by manufacturer) to Sumitomo equivalent mold compound EME6600CSP and additional die attach , that Diodes is currently in the process of qualifying EME-6300CSP mold compound . The mold compound supplier for the current mold compound is discontinuing manufacturing of EME-63000H. EME-6600CSP will , Print Date: 4/30/09 9:41 AM Mold Compound Part Number Package AP34063N8L-U AP358NL-U AP393NL-U


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PDF DCS/PCN-1134 EME-6300H EME6600CSP 84-1LMISR4. EME-6300CSP EME-63000H. EME-6600CSP EME-6300H. ad33K5L-13 AP1506-33K5L-U
EME-6300H

Abstract: sumitomo epoxy 6300h D284 J28S yc 504
Text: : 148 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H , Die to Package edge clearance: 136 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H Copper Lead Finish, composition: Solder Plated, 85%Sn, 15%Pb Die , Mold Compound Name/Manufacturer: Lead Frame material:q N/A Alloy 42 Lead Finish, composition , mil (stepping) Design Rule (µ) µ Fabrication Process ID Passivation Type Mold


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PDF CY10E484/CY10E484L CY100E484/CY100E484L CY101E484/CY101E484L CY10E484, CY10E484L 10E484A/10EL484A CY10E484L-JC CY10E484L-DC -2200V EME-6300H sumitomo epoxy 6300h D284 J28S yc 504
EME-6300H

Abstract: Omedata CY7C194 CY7C195 CY7C199 28-pin SOJ SRAM
Text: , Type, or Name: 28-pin, 300-mil SOJ Die to Package edge clearance: 112 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish , Package edge clearance: 72 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Die Attach Area Plating: Solder Plated, 85 , . Die Size mil x mil (stepping) Design Rule (µ) µ Fabrication Mold Compound Assembly


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PDF CY7C194 CY7C195 CY7C199 CY7C199-VC -1500V 200mA JESD22-A112 EME-6300H Omedata CY7C194 CY7C195 CY7C199 28-pin SOJ SRAM
solder paste 63sn alpha metal

Abstract: EME-6300H CY7C245A CY7C291A CY7C293A UL-94V0 sumitomo silver epoxy
Text: Die to Package edge clearance: 65 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder Dipped, 63%Sn, 37 , /SOJ Die to Package edge clearance: 65 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder Dipped, 63 , CerDIP Die to Package edge clearance: 62 mils per side Mold Compound Name/Manufacturer: Lead


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PDF CY7C245A CY7C291A CY7C293A 7C245E 7C291E solder paste 63sn alpha metal EME-6300H CY7C245A CY7C291A CY7C293A UL-94V0 sumitomo silver epoxy
sumitomo silver epoxy

Abstract: EME-6300H P2868 0.8um cmos CY7C474 CY7C472 CY7C470 CY7C464 CY7C462 CY7C460
Text: mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R , Leaded Chip Carrier Die to Package edge clearance: 66 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Die Attach , edge clearance: 115 mils per side Mold Compound Name/Manufacturer: Lead Frame material: N/A , -pin Rectangular Leadless Chip Carrier Die to Package edge clearance: 83 mils per side Mold Compound Name


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PDF CY7C46X/47X, CY7C460 CY7C462 CY7C464 CY7C470 CY7C472 CY7C474 CY7C464/CY7C474 CY7C464-PC sumitomo silver epoxy EME-6300H P2868 0.8um cmos CY7C474 CY7C472 CY7C470 CY7C464 CY7C462 CY7C460
sumitomo 6300h mold compound

Abstract: 93191 sumitomo epoxy CY7C199 CY7C198 CY7C197 CY7C196 CY7C195 CY7C194 CY7C192
Text: Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish , ) Die to Package edge clearance: 99 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder Plated, 85%Sn, 15 , : 78 mils per side Mold Compound Name/Manufacturer: Lead Frame material: N/A Alloy 42 Lead , (stepping) Design Rule (µ) µ Fabrication Passivation Mold Type Compound Assembly Line


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PDF CY7C191 CY7C192 CY7C194 CY7C195 CY7C196 CY7C197 CY7C198 CY7C199 15psig) sumitomo 6300h mold compound 93191 sumitomo epoxy CY7C199 CY7C198 CY7C197 CY7C196 CY7C195 CY7C194 CY7C192
data retention eprom Cypress

Abstract: p20d CERPAK 25NS EME-6300H CY7C269 CY7C266 CY7C264 CY7C263 CY7C261
Text: side (32-lead Rectangular PLCC) Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo , clearance: 77 mils per side (300-mil) 217 mils per side (600-mil) Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder Dipped , edge clearance: 75 mils per side (300-mil) 139 mils per side (600-mil) Mold Compound Name , mils per side (28-lead Square) 156 mils per side (32-lead Rectangular) Mold Compound Name


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PDF CY7C261 CY7C263 CY7C264 600-MIL CY7C266 CY7C269 QTP90271 data retention eprom Cypress p20d CERPAK 25NS EME-6300H CY7C269 CY7C266 CY7C264 CY7C263 CY7C261
cmos SRAM 35ns 8k X 8 dip

Abstract: 7C166 7C164 CY7C187 CY7C186 CY7C185 CY7C166 CY7C164 CY7C162 CY7C161
Text: side (600-mil) Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R , clearance: 48 mils per side (300-mil) Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder Plate, 80%Sn, 20%Pb Die Attach Area , ) Design Rule (µ) µ Fabrication Passivation Mold Primary ESD Volt Type Compound Assembly Rating , (PlasticP Alloy 42 (Ceramic) Plastic DIP,SO,PLCC CerDIP,LCC,FPACK Mold Compound : Die Attach Mat


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PDF CY7C161 CY7C162 CY7C164 CY7C166 CY7C185 CY7C186 CY7C187 Cypr507/1 200mA cmos SRAM 35ns 8k X 8 dip 7C166 7C164 CY7C187 CY7C186 CY7C185 CY7C166 CY7C164 CY7C162 CY7C161
PAL16L8

Abstract: Epoxy Sumitomo 1085 cy7b185 EME-6300H CY7B145 PAL20 CY7B185-VC
Text: per side (PAL16L8) 325 mils per side (CY7B145) Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper (Olin 194) Lead Finish, composition: Solder Plated, 85 , Package edge clearance: 95 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper (Olin 194) Lead Finish, composition: Solder Plated, 85%Sn, 15


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PDF CY7B145/CY7B185/PAL16L8 CY7B145) CY7B185) PAL20 PAL16L8) PAL16L8 Epoxy Sumitomo 1085 cy7b185 EME-6300H CY7B145 CY7B185-VC
CDA194

Abstract: 9731
Text: : Qualification Vehicle: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead , CPS (ChipPac, China) 16 PDIP 300 Sumitomo 6300H Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 , : Qualification Vehicle: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead , Range: FAILS 0 0 DS2404 ATK (Amkor, K) 16 SOIC 300x2.3 Sumitomo 6300H Stamped Copper , Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire


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PDF DS2404 MIL-STD-883-2009 J-STD-020 CDA194 9731
LMISR4

Abstract: J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
Text: Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA: Theta JC , 175 Å DS1685 ATEC 24 PDIP 600 Sumitomo 6300H Stamped Alloy 42 SnPb Dip 84-1 LMISR4 Epoxy , Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA: Theta JC , Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Theta JA , SOIC 300x2.3 Sumitomo 6300H Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled


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PDF DS1685, LMISR4 J-STD20A J-STD-20A ablebond copper bond wire copper bond wire amkor ti 9841
CY7B185

Abstract: CY7B922 clock buffer FITS CY7B991 CY7B992 EME-6300H SM23B CY7B991-LMB
Text: Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish , side; y= 195 mils per side Mold Compound Name/Manufacturer: Lead Frame material: N/A N/A , Passivation Mold Assembly Type Compound Line Location ESD Volt Availabilit Rating y (mm/yy , : Mold Compound : Silver Epoxy Cypress Test No. Stress/Test Package Loc: Reference Method BiCMOS Process Loc: Round Rock, TX Sumitomo EME- 6300H (R) Lead Frame: Copper Omedata


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PDF CY7B991 CY7B992 CY7B991 JEDEC22, 30PSIA CY7B185 CY7B922 clock buffer FITS CY7B992 EME-6300H SM23B CY7B991-LMB
CY93L422PC

Abstract: cy9122 cy93l422 sumitomo epoxy am-113 cy7c122 cy7c122 die 22 CDIP DIMENSIONS CY93422 UL-94V0 EME-6300H
Text: -pin, 400 mil Plastic DIP Die to Package edge clearance: 173 mil / side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder , mil Ceramic DIP Die to Package edge clearance: 173 mil / side Mold Compound Name/Manufacturer , Fabrication Passivatio Mold Assembly n Type Compound Line Location ESD Volt Rating Availability , (Plastic) CDIP (Ceramic) CMOS Process Loc: Mold Compound : Silver Epoxy (Plastic) Silver Glass


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PDF CY7C122 7C122A 200mA CY93L422PC cy9122 cy93l422 sumitomo epoxy am-113 cy7c122 cy7c122 die 22 CDIP DIMENSIONS CY93422 UL-94V0 EME-6300H
sumitomo epoxy

Abstract: CY7C276 EME-6300H 20 PIN LEADLESS CHIP CARRIER x-ray
Text: -pins Square PLCC Die to Package edge clearance: 155 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder Dipped, 63 , Windowed Leaded Chip Carrier Die to Package edge clearance: 155 mils per side Mold Compound Name , : Technology: Process Loc: Package: Mold Compound : Lead Frame: Die Attach Mat: Package Loc , Revision Die Size mil x mil (stepping) Design Rule (µ) µ Fabrication Passivation Mold


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PDF CY7C270 CY7C276 7C270A sumitomo epoxy CY7C276 EME-6300H 20 PIN LEADLESS CHIP CARRIER x-ray
Not Available

Abstract: No abstract text available
Text: Vehicle: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh , : Qualification Vehicle: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead , Range: FA# DS80C320 ATEC 40 PDIP 600 Sumitomo 6300H Stamped Copper CDA194 SnPb Plate 84-1 , Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire , (Amkor, PI) 40 PDIP 600 Sumitomo 6300H Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy


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PDF DS80C310, JESD78,
7C453

Abstract: No abstract text available
Text: edge clearance: 125 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Solder Plated, 80%Sn, 20%Pb Die Attach , : 32-pin, 300-mil CERDIP Die to Package edge clearance: 77 mils per side Mold Compound Name , mil (stepping) Design Rule (µ) µ Fabrication Passivation Mold Assembly ESD Volt Type Compound Line Rating Location Availability (mm/yy) Process Line ID ID CY7C453/451 CY7C443/441


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PDF CY7C453 CY7C451 CY7C441 CY7C443 32-pin CY7C453/451 32-pin, 300Mil CY7C443/441 7C453
9721

Abstract: ABLEBONd 84-1 JEDEC hast
Text: Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach: Bond Wire , SOIC 300x2.3 Sumitomo 6300H Stamped Copper CDA194 SnPb Plate 84-1 LMISR4 Epoxy Silverfilled , Total: Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound , J-STD20A) Date Code Range: FAILS 0 ATP (Amkor, PI) 16 SOIC 300x2.3 Sumitomo 6300H Stamped , : Assembly Site: Pin Count: Package Type: Body Size: Mold Compound : Lead Frame: Lead Finsh: Die Attach


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PDF DS1005, reliabilit0037 9721 ABLEBONd 84-1 JEDEC hast
CY7C190

Abstract: cy7c189 sumitomo silver epoxy 7C189 EME-6300H UL-94V0 lc 245a CY27S07 dynamic ram cmos 16pin 7C190
Text: mil / side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R , LCC, Gold Lid Die to Package edge clearance: 136 mils per side Mold Compound Name , , Type, or Name: 16-pin, 300-mil CerDIP Die to Package edge clearance: 113 mils per side Mold Compound Name/Manufacturer: Lead Frame material: N/A Alloy 42 Lead Finish, composition: Solder , Revision /ID Die Size mil x mil Design Rule (µ) µ Fabrication Passivatio Mold Assembly n


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PDF CY7C189 CY7C190 7C189B 200mA 64-bit CY7C190 cy7c189 sumitomo silver epoxy 7C189 EME-6300H UL-94V0 lc 245a CY27S07 dynamic ram cmos 16pin 7C190
EME-6300H

Abstract: 6300H mos die CY7C1399 CY7C197 CY7C199
Text: mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R , -pin, 300-mil PDIP Die to Package edge clearance: 72 mils per side Mold Compound Name/Manufacturer: Lead Frame material: Sumitomo EME- 6300H (R) Copper Lead Finish, composition: Die Attach Area


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PDF CY7C199 7C199C Jan/1995 MeC199 28-pin, 300-mil -1500V EME-6300H 6300H mos die CY7C1399 CY7C197 CY7C199
Supplyframe Tracking Pixel