| SOT942-1 |
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NXP Semiconductors
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Plastic thermal enhanced ultra thin quad flat package; no leads; 88 terminals; body 6 x 6 x 0.55 mm |
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Original |
PDF
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| SOT943-1 |
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NXP Semiconductors
|
Plastic thermal enhanced ultra thin quad flat package; no leads; 68 terminals; body 8 x 8 x 0.55 mm |
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Original |
PDF
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| SOT944-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced ultra thin quad flat package; no leads; 68 terminals; body 8 x 8 x 0.55 mm |
|
Original |
PDF
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| SOT945-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 5 x 5 x 0.8 mm |
|
Original |
PDF
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| SOT946-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 296 balls; body 10 x 10 x 1 mm |
|
Original |
PDF
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| SOT947-1 |
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NXP Semiconductors
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Plastic, ball grid array package; 564 balls; body 40 x 40 x 1.75 mm |
|
Original |
PDF
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| SOT948-1 |
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 1092 balls; body 40 x 40 x 1.75 mm; heatsink |
|
Original |
PDF
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| SOT949-1 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 7 x 7 x 0.85 mm |
|
Original |
PDF
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| SOT949-2 |
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NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 7 x 7 x 0.85 mm |
|
Original |
PDF
|
| SOT949-2_518 |
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NXP Semiconductors
|
HVQFN56; Reel dry pack, SMD, 13"Q1/T1 standard orientationOrderable part number ending, 518 or YOrdering code (12NC) ending 518 |
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Original |
PDF
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