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Part Manufacturer Description Datasheet Download Buy Part
SOT89-3EV-VREG Microchip Technology Inc BOARD EVAL SOT89-3 VOLTAGE REG
MCP1703RT-5002E/MB Microchip Technology Inc IC REG LDO 5V 0.25A SOT89-3
IPC0074-S Chip Quik Inc DFN-16 STENCIL
PA0181-S Chip Quik Inc SUPERSOT-8 STENCIL
PA0076-S Chip Quik Inc TVSOP-16 STENCIL
IPC0091-S Chip Quik Inc POWERSSOP-28 STENCIL

sot89 stencil Datasheets Context Search

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2007 - sot89 stencil

Abstract:
Text: SOT89 Package Application Note 5051 Introduction PCB Land Pattern and Stencil Design Avago Technologies SOT89 is a 3 I/O pins (Figure 1) package platform designed to offer excellent heat dissipation and wide RF frequency response. The SOT89 package itself is lead free with a dimension of 4.1 mm , designers with general guidelines to layout suitable PCB land pattern and stencil for SOT89 package to , the vias. Stencil Design Guidelines 1.50 3.00 Figure 1. SOT89 package outline drawing


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PDF 5989-0810EN sot89 stencil sot89 land pattern Loctite 218 RG200 substrate LOCTITE-96sc Getek Soldering guidelines pin in paste laser gun LOCTITE PASTE
1996 - Soldering guidelines and SMD footprint design

Abstract:
Text: solder lands by one of either three methods: dispensing, screen or stencil printing. Dispensing is , only suitable for solder paste deposits of 300 µm and wider. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil is usually made , stencil to force solder paste through the apertures in the stencil and onto the solder lands on the PCB , stencil solder land , , , board , , , filling The amount


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PDF OD106, OT223. MSB958 Soldering guidelines and SMD footprint design SOD87 footprint SMD footprint design Soldering guidelines "msb900" sod110 land SOD110 footprint SOD106 land pattern SC59 sot89 stencil
1998 - SOD80 footprint

Abstract:
Text: solder lands by one of either three methods: dispensing, screen or stencil printing. With screen , ), this method is only suitable for solder paste deposits of 300 µm and wider. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil is usually made of stainless steel or bronze and should be 150 to 200 µm thick. A squeegee is passed across the stencil to force solder paste through the apertures in the stencil and onto the


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PDF MSB461 OT163-1) MLC745 SOD80 footprint SOD87 footprint land pattern sot346 SOD110 footprint SOD106 land pattern sod110 land MSA435 do-41 footprint DO-35 land pattern wave footprint
1998 - SOD80 footprint

Abstract:
Text: PCBs solder lands by one of either three methods: dispensing, screen or stencil printing. Dispensing , method is only suitable for solder paste deposits of 300 µm and wider. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil is , the stencil to force solder paste through the apertures in the stencil and onto the solder lands on , solder paste stencil solder land , , , board , , , filling


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PDF MGK391 MSC422 OT457 SC-74) MSC423 SOD80 footprint SOD87 footprint Soldering guidelines and SMD footprint design SMD footprint design SOD106 land pattern land pattern sot346 SOD110 footprint MLC745 SOD87 footprint pcb smd footprint
sot89 stencil

Abstract:
Text: -88 (SOT363) SOT23 SOT89 SOT223 S08 (SOT96-1) SSOP16 (SOT338-1) reflow soldering SSOP24 (SOT340-1) reflow , one of either three methods: dispensing, screen or stencil printing. Dispensing is flexible but is , solder paste deposits of 300 |im and wider. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil is usually made of stainless steel or bronze and should be 150 to 200 |j.m thick. A squeegee is passed across the stencil to force solder paste


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PDF OT186A; OT263; 220AB T0220 SSOP16 SSOP24 OT338-1 OT34Q-1 sot89 stencil
qfp 32 land pattern

Abstract:
Text: SC-70 (SOT323) SC-88 (SOT363) SOT23 SOT89 SOT223 SO8 (SOT96-1) SSOP16 (SOT338-1) reflow , : dispensing, screen or stencil printing. Although reflow soldering is recommended for SMDs, many , µm and wider. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil is usually made of stainless steel or bronze and should be 150 to 200 µm thick. A squeegee is passed across the stencil to force solder paste through the


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PDF OT186A; OT263; 220AB components24 MLC747 SSOP16 OT338-1) SSOP24 OT340-1) qfp 32 land pattern SSOP16 SSOP24
1998 - ssop24 footprint

Abstract:
Text: -70 (SOT323) SC-88 (SOT363) SOT23 SOT89 SOT223 SO8 (SOT96-1) SSOP16 (SOT338-1) reflow soldering SSOP24 , applied to the PCBs solder lands by one of either three methods: dispensing, screen or stencil printing , other, wave soldering is usually applied. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil is usually made of stainless steel or bronze and should be 150 to 200 µm thick. A squeegee is passed across the stencil to force


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PDF OT186A; OT263; 220AB MLC747 SSOP16 OT338-1) SSOP24 OT340-1) OT338-1 ssop24 footprint PowerMos transistors TO220 package sot89 stencil SSOP16 SSOP24 SSOP24 300 1 footprint
1999 - SOD87 footprint

Abstract:
Text: stencil printing. Dispensing is flexible but is slow, and only suitable for pitches of 0.65 mm and above , resolution), this method is only suitable for solder paste deposits of 300 µm and wider. Stencil printing is similar to screen printing, except that a metal stencil is used instead of a fine-mesh screen. The stencil , across the stencil to force solder paste through the apertures in the stencil and onto the solder lands , used must be sufficient to give reliable soldered joints. This amount is controlled by the stencil


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PDF MSD060 OT428. MSC422 OT457 SC-74) MSC423 SOD87 footprint Soldering guidelines and SMD footprint design MSA439 MSA460 SOT-34 sot3391h SOT343R footprint
2006 - ADA-4789

Abstract:
Text: this package in greater detail. Figure 3. Multi-purpose Evaluation Board for SOT-89 package Figure 2. Combined PCB and stencil layout for SOT-89 (dimensions in mm) This layout provides ample , ADA-4789 High P1dB Silicon Darlington Amplifier in SOT-89 package for broadband application , silicon gain block RFIC amplifier housed in a SOT-89 surface mount plastic package with thermal , with Bias Connections PCB Layout A recommended PCB pad layout for the SOT-89 package that is used


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PDF ADA-4789 OT-89 52oC/W 17dBm 900MHz, AN-S003: AN-5051: ADA-4789 an5051 Agilent RF amplifier SOT-89 0805CS-681XGLC AN-S003 ADA4789 sot89 stencil common base amplifier circuit ferrite core binocular GRM1885C1H390JA01D
2010 - XM0830SJ

Abstract:
Text: SOT143 SOT343 SOT143 SOT343 SOT89 SOT23 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 SOT23 SOT323 , 2.0 x 2.1 x 0.9 3:1 TSLP-4-4 ( ­ ) 1.2 x 0.6 x 0.4 4 SOT89 (SC-62) 2.9 x 2.4 x <1.1 , SOT89 (SC-62) Package Outline 4.5 ±0.1 45° B 1.5 ±0.1 0.2 MAX. 2 2.75 +0.1 -0.15 , Copper 0.19 0.27 0.14 0.32 0.24 Foot Print Solder mask Stencil apertures TSLP , 0.35 1 0.3 0.35 0.45 0.275 Foot Print Stencil apertures Bottom view 0.39


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PDF 24GHz BF517 BF770A BF771 BF775 BF799 BF799W BFP181 BFP181R BFP182 XM0830SJ smd code marking 162 sot23-5 MARKING V14 SOT23-5 RF Transistor Selection smd code marking rf ft sot23 smd code marking NEC rf transistor XM0860SH sot-363 inf smd marking D3 SOT363 BFP410
Not Available

Abstract:
Text: method a stencil with etched holes to pass the paste is used. The thickness of the stencil determines , General Wave soldering F l u x in g This soldering technique is not recommended for SOT89 . The , Transistors SOT89 FOOTPRINTS Dimensions in mm. Placement accuracy: ±0.25 mm. Fig.22 Reflow soldering footprint for SOT89 ; typical dimensions. 1995 Apr 27 44 Philips Semiconductors , not recommend SOT89 for wave soldering, SOT223 is preferred. Dimensions in mm. Placement accuracy: Â


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2009 - 2sc3052ef

Abstract:
Text: SOT223 SOT143 SOT143R SOT143 SOT143R SOT343 SOT143 SOT343 SOT143 SOT343 SOT143 SOT343 SOT89 , 700 700 700 1.4 0.5 1.4 3 3 3 no yes no no yes no SOT343 SOT89 SC74 SOT89 SC74 SOT89 BDP947 BDP947 BDP947 18 700 27 700 40 700 2000 2000 2000 1.4 0.5 1.4


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PDF 24GHz BF517 B132-H8248-G5-X-7600 2sc3052ef 2n2222a SOT23 TRANSISTOR SMD MARKING CODE s2a 1N4148 SMD LL-34 TRANSISTOR SMD CODE PACKAGE SOT23 2n2222 sot23 1N4148 SOD323 TRANSISTOR S1A 64 smd toshiba smd marking code transistor semiconductor cross reference
bc 339

Abstract:
Text: is usually between 150 and 200 urn. Stencilling In this method a stencil with etched holes to pass the paste is used. The thickness of the stencil determines the amount of amount of solder paste , RF Wideband Transistors Wave soldering This soldering technique is not recommended tor SOT89 . A d h , ; typical dimensions. 1997 Nov 26 57 Philips Semiconductors RF Wideband Transistors SOT89 , mm. Placement accuracy: ±0.25 mm. Fig.24 Reflow soldering footprint for SOT89 ; typical dimensions


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PDF
sot59

Abstract:
Text: is usually between 150 and 200 jim . Stencilling In this method a stencil with etched holes to pass the paste is used. The thickness of the stencil determ ines the am ount of am ount of solder paste , technique is not recom m ended for SOT89 . A d h e s iv e a p p l ic a t io n General suited to low , iconductors Small-signal Transistors SOT89 General F O O T P R IN T S s o ld er land pattern s , so ld e r re sist cu t o ul of the footprint. Fig.25 Reflow soldering footprint for SOT89 ; typical


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PDF OT323. OT223. sot59
2012 - TGF2021-04-SD

Abstract:
Text: a low cost SOT89 surface mount package. The device's ideal operating point for low noise operation , (1/) 4.6 mm Ø SOLDERMASK KEEPOUT FOR LOCKWASHER (4/) SOT-89 PACKAGE OUTLINE 1 2 3 , stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and , C/sec Ordering Information Part TGF2021-04-SD TGF2021-04-SD-T/R Package Style SOT-89 , BULK SOT-89


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PDF TGF2021-04-SD TGF2021-04-SD TGF2021-04-SD-T/R OT-89,
2009 - 08052U270GAT2A

Abstract:
Text: Transistor (pHEMT) housed in a low cost SOT89 surface mount package. The device's ideal operating point for , OF VIAS (1/) 4.6 mm Ø SOLDERMASK SOT-89 PACKAGE OUTLINE KEEPOUT FOR LOCKWASHER (4/) 1 , paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on , Information Part Package Style TGF2021-04-SD SOT-89 , BULK TGF2021-04-SD-T/R SOT-89 , TAPE AND


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PDF TGF2021-04-SD 26dBm TGF2021-04-SD OT-89, TGF2021-04-SD-T/R 08052U270GAT2A 08052U2R7BAT2A 08052U3R3BAT2A 08052U4R7CAT2A
2010 - TGF2021-04-SD

Abstract:
Text: Transistor (pHEMT) housed in a low cost SOT89 surface mount package. The device's ideal operating point for , OF VIAS (1/) 4.6 mm Ø SOLDERMASK SOT-89 PACKAGE OUTLINE KEEPOUT FOR LOCKWASHER (4/) 1 , paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on , Information Part Package Style TGF2021-04-SD SOT-89 , BULK TGF2021-04-SD-T/R SOT-89 , TAPE AND


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PDF TGF2021-04-SD TGF2021-04-SD OT-89, TGF2021-04-SD-T/R 51923 SD 1083 31669 TriQuint SOT-89 TAPE AND REEL 08052U270GAT2A 08052U4R7CAT2A 08052U3R3BAT2A 08052U2R7BAT2A L0805220JESTR
2012 - Not Available

Abstract:
Text: Electron Mobility GaAs Transistor (pHEMT) housed in a low cost SOT89 surface mount package. The deviceâ , ˜ SOLDERMASK SOT-89 PACKAGE OUTLINE KEEPOUT FOR LOCKWASHER (4/) 1 2 3 Assembly Notes 1/ The , be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and , Ordering Information Part Package Style TGF2021-04-SD SOT-89 , BULK TGF2021-04-SD-T/R SOT-89


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PDF TGF2021-04-SD TGF2021-04-SD OT-89, TGF2021-04-SD-T/R
2007 - TGF2961-SD

Abstract:
Text: Transistor (HFET) housed in a low cost SOT89 surface mount package. The device's ideal operating point is , /) 4.6 mm Ø SOLDERMASK SOT-89 PACKAGE OUTLINE KEEPOUT FOR 2-56 LOCKWASHER (4/) 1 2 3 , using a stencil printer or dot placement. The volume of solder paste depends on PCB and component , , TAPE AND REEL SOT-89 , TAPE AND REEL 20 TriQuint Semiconductor: www. triquint.com (972)994-8465


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PDF TGF2961-SD TGF2961-o TGF2961-SD, OT-89, TGF2961-SD e/TriQuint SOT-89 TAPE AND REEL
2007 - Not Available

Abstract:
Text: -watt Heterojunction GaAs Field Effect Transistor (HFET) housed in a low cost SOT89 surface mount package. The device , 7.6 mm COPPER AREA (3/) ARRAY OF VIAS (1/) 4.6 mm Ø SOLDERMASK KEEPOUT FOR 2-56 LOCKWASHER (4/) SOT-89 , . Solder paste can be applied using a stencil printer or dot placement. The volume of solder paste depends , Style SOT-89 TAPE AND REEL 19 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972


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PDF TGF2961-SD TGF2961-SD TGF2961-SD, OT-89
2012 - Not Available

Abstract:
Text: Effect Transistor (HFET) housed in a low cost SOT89 surface mount package. The device’s ideal , ˜ SOLDERMASK SOT-89 PACKAGE OUTLINE KEEPOUT FOR 2-56 LOCKWASHER (4/) 1 2 3 Assembly Notes 1 , using a stencil printer or dot placement. The volume of solder paste depends on PCB and component , Information Part Package Style TGF2960-SD, TAPE AND REEL SOT-89 , TAPE AND REEL 21 TriQuint


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PDF TGF2960-SD TGF2960-SD TGF2960-SD, OT-89,
2012 - TGF2961-SD

Abstract:
Text: performance 1-watt Heterojunction GaAs Field Effect Transistor (HFET) housed in a low cost SOT89 surface mount , SOLDERMASK KEEPOUT FOR 2-56 LOCKWASHER (4/) SOT-89 PACKAGE OUTLINE 1 2 3 Assembly Notes 1/ The , soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The , Package Style SOT-89 , TAPE AND REEL 21 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972


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PDF TGF2961-SD TGF2961-SD TGF2961-SD, OT-89, 2-56 socket head cap screw
2010 - 2-56 socket head cap screw

Abstract:
Text: Transistor (HFET) housed in a low cost SOT89 surface mount package. The device's ideal operating point is , /) 4.6 mm Ø SOLDERMASK SOT-89 PACKAGE OUTLINE KEEPOUT FOR 2-56 LOCKWASHER (4/) 1 2 3 , using a stencil printer or dot placement. The volume of solder paste depends on PCB and component , , TAPE AND REEL SOT-89 , TAPE AND REEL 21 TriQuint Semiconductor: www. triquint.com (972)994-8465


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PDF TGF2961-SD TGF2961-ensure TGF2961-SD, OT-89, 2-56 socket head cap screw TGF2961-SD
Not Available

Abstract:
Text: 10 000 SOT23 3000 10 000 SOT89 1000 4000 SOT143 3000 10 000 SOT143R , . Fig.6 Specification for 12 mm tape ( SOT89 ). October 1993 74 ru Philips Semiconductors , SOD80 SOT89 SOD80C SOT223 SOD87 SOD110 SOD123 SOD323 SOT23 SOT143(R) SOT323 October , In this method a stencil with etched holes to pass the paste is used. The thickness of the stencil , in Fig.11. Wave soldering This soldering technique is not recommended for SOT89 . A dhesive


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PDF MBB439
2012 - sot89 stencil

Abstract:
Text: performance 1/2-watt Heterojunction GaAs Field Effect Transistor (HFET) housed in a low cost SOT89 surface , KEEPOUT FOR 2-56 LOCKWASHER (4/) SOT-89 PACKAGE OUTLINE 1 2 3 Assembly Notes 1/ The lowest , soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement. The , Package Style SOT-89 , TAPE AND REEL 21 TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972


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PDF TGF2960-SD TGF2960-SD TGF2960-SD, OT-89, sot89 stencil 2-56 socket head cap screw 4 SOT-89 mmic SOT-89 07 TriQuint SOT-89 TAPE AND REEL TriQuint SOT-89 TAPE AND REEL INFORMATION
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