| SOT662-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85 mm |
|
Original |
PDF
|
| SOT662-1_118 |
|
NXP Semiconductors
|
HVQFN20; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
|
Original |
PDF
|
| SOT663 |
|
NXP Semiconductors
|
Plastic surface-mounted package; 3 leads |
|
Original |
PDF
|
| SOT663_115 |
|
NXP Semiconductors
|
Tape reel SMD; standard product orientation 12NC ending 115 |
|
Original |
PDF
|
| SOT665 |
|
NXP Semiconductors
|
Plastic surface-mounted package; 5 leads |
|
Original |
PDF
|
| SOT665_115 |
|
NXP Semiconductors
|
Tape reel SMD; standard product orientation 12NC ending 115 |
|
Original |
PDF
|
| SOT666 |
|
NXP Semiconductors
|
Plastic surface-mounted package; 6 leads |
|
Original |
PDF
|
| SOT666 |
|
STMicroelectronics
|
GPS HIGH GAIN LNA ICs |
|
Original |
PDF
|
| SOT666_115 |
|
NXP Semiconductors
|
Tape reel SMD; standard product orientation 12NC ending 115 |
|
Original |
PDF
|
| SOT666_125 |
|
NXP Semiconductors
|
Tape reel SMD; reversed product orientation 12NC ending 125 |
|
Original |
PDF
|
| SOT666_315 |
|
NXP Semiconductors
|
Tape reel SMD; standard product orientation 12NC ending 315 |
|
Original |
PDF
|
| SOT666 BISS loadswitch |
|
NXP Semiconductors
|
Philips BISS loadswitch solutions and the SOT666 BISS loadswitch demo board |
|
Original |
PDF
|
| SOT668-2 |
|
NXP Semiconductors
|
Plastic rectangular-DIL-bent-SIL (reverse bent) power package; 17 leads (row spacing 2.54 mm) |
|
Original |
PDF
|
| SOT669 |
|
NXP Semiconductors
|
Plastic single-ended surface-mounted package (LFPAK56; Power-SO8); 4 leads |
|
Original |
PDF
|
|
|
| SOT669 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT669 |
|
Original |
PDF
|
| SOT669_115 |
|
NXP Semiconductors
|
LFPAK; Tape reel SMD; standard product orientation 12NC ending 115 |
|
Original |
PDF
|
