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    SOT638 Search Results

    SOT638 Datasheets (8)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT638-1 NXP Semiconductors Footprint for reflow soldering SOT638-1 Original PDF
    SOT638-1 NXP Semiconductors Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad Original PDF
    SOT638-2 NXP Semiconductors Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad Original PDF
    SOT638-2 NXP Semiconductors Footprint for reflow soldering SOT638-2 Original PDF
    SOT638-3 NXP Semiconductors Footprint for reflow soldering SOT638-3 Original PDF
    SOT638-3 NXP Semiconductors Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad Original PDF
    SOT638-4 NXP Semiconductors Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad Original PDF
    SOT638-6 NXP Semiconductors Plastic thermal enhanced thin quad flat package; 100 leads; exposed diepad Original PDF