SOT638-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT638-1 |
|
Original |
PDF
|
SOT638-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad |
|
Original |
PDF
|
SOT638-2 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad |
|
Original |
PDF
|
SOT638-2 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT638-2 |
|
Original |
PDF
|
SOT638-3 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT638-3 |
|
Original |
PDF
|
SOT638-3 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad |
|
Original |
PDF
|
SOT638-4 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad |
|
Original |
PDF
|
SOT638-6 |
|
NXP Semiconductors
|
Plastic thermal enhanced thin quad flat package; 100 leads; exposed diepad |
|
Original |
PDF
|