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    SOT556 Search Results

    SOT556 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT556-1 NXP Semiconductors Footprint for reflow soldering Original PDF
    SOT556-1 NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 mm Original PDF