SOT390A |
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NXP Semiconductors
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Flanged ceramic package; 2 mounting holes; 2 leads |
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Original |
PDF
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SOT391A |
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NXP Semiconductors
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Flanged ceramic package; 2 mounting holes; 2 leads |
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Original |
PDF
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SOT391B |
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NXP Semiconductors
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flangeless ceramic package; 2 leads |
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Original |
PDF
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SOT391C |
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NXP Semiconductors
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Flanged ceramic package; 2 mounting holes; 2 leads |
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Original |
PDF
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SOT393-1 |
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NXP Semiconductors
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Footprint for reflow soldering SOT393-1 |
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Original |
PDF
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SOT398-1 |
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NXP Semiconductors
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Plastic heat-dissipating dual in-line package; 18 leads |
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Original |
PDF
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