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Part Manufacturer Description Datasheet Download Buy Part
LTC4054ES5-4.2#TR Linear Technology LTC4054-4.2 - Standalone Linear Li-Ion Battery Charger with Thermal Regulation in ThinSOT; Package: SOT; Pins: 5; Temperature Range: -40°C to 85°C
LTC4058EDD-4.2 Linear Technology LTC4058-4.2 - Standalone Linear Li-Ion Battery Chargers with Thermal Regulation in DFN; Package: DFN; Pins: 8; Temperature Range: -40°C to 85°C
LTC4059AEDC#TRMPBF Linear Technology LTC4059/LTC4059A - 900mA Linear Li-Ion Battery Chargers with Thermal Regulation in 2 x 2 DFN; Package: DFN; Pins: 6; Temperature Range: -40°C to 85°C
LTC4053EDD-4.2#TRPBF Linear Technology LTC4053-4.2 - USB Compatible Lithium-Ion Battery Charger with Thermal Regulation; Package: DFN; Pins: 10; Temperature Range: -40°C to 85°C
LTC4059EDC#PBF Linear Technology LTC4059/LTC4059A - 900mA Linear Li-Ion Battery Chargers with Thermal Regulation in 2 x 2 DFN; Package: DFN; Pins: 6; Temperature Range: -40°C to 85°C
LTC4053EMSE-4.2#TR Linear Technology LTC4053-4.2 - USB Compatible Lithium-Ion Battery Charger with Thermal Regulation; Package: MSOP; Pins: 10; Temperature Range: -40°C to 85°C

sot23-8 thermal resistance Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2001 - mark EA SOT23-5

Abstract: rca sot23-5 thermal resistance standards G38-87 MARK RCA SOT23-5 sot23-8 thermal resistance TC1186 MSOP-10 TC105 DX SOT23-5
Text: -10 113.1 SOIC- 8 163.0 SOT223 57.3 DPAK-3 59.2 Table 2 shows the thermal resistance , ) 152.0 DATA SUMMARY The thermal resistance data is summarized in Table 8 . Data for the 2 , Thermal Conductivity Standard. The MSOP- 8 thermal resistance for this particular application is lower by , -Layer data, the SOT23-5 has a lower thermal resistance than the MSOP- 8 by approximately 15%. For this case , higher than the MSOP- 8 . The thermal resistance for Junction-to-Case shown in the right hand column is a


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PDF AN792 SC70s, D-81739 D-82152 DS00792A-page mark EA SOT23-5 rca sot23-5 thermal resistance standards G38-87 MARK RCA SOT23-5 sot23-8 thermal resistance TC1186 MSOP-10 TC105 DX SOT23-5
2003 - TPS73618-EP

Abstract: TPS73615-EP TPS73630-EP TPS73632-EP
Text: 180 64 35 N/A N/A N/A UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 ) (9) For more information about traditional and new thermal metrics, see the IC , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS736xx SBVS038T 400mA 30mVRMS 100kHz) TPS73618-EP TPS73615-EP TPS73630-EP TPS73632-EP
2003 - JEDEC JESD51-8

Abstract: TPS73618-EP SBVS038T tps73615drb TPS73630-EP TPS73615-EP TPS73625-EP TPS73633 TPS73601 JESD51-7
Text: characterization parameter ( 8 ) 17.8 30.1 N/A qJCbot Junction-to-case (bottom) thermal resistance (9 , TPS736xx (3) THERMAL METRIC (1) (2) DRB Junction-to-ambient thermal resistance (4) qJA (5 , ) thermal resistance 83 70 qJB Junction-to-board thermal resistance (6) N/A N/A 35 , , see the Power Dissipation section of this data sheet. The junction-to-ambient thermal resistance , JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is


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PDF TPS736xx SBVS038T 400mA 30mVRMS 100kHz) JEDEC JESD51-8 TPS73618-EP SBVS038T tps73615drb TPS73630-EP TPS73615-EP TPS73625-EP TPS73633 TPS73601 JESD51-7
2003 - DR-B 2003

Abstract: TPS73618-EP TPS73615-EP TPS73630-EP TPS73632-EP TPS73625-EP
Text: 180 64 35 N/A N/A N/A UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 ) (9) For more information about traditional and new thermal metrics, see the IC , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS736xx SBVS038T 400mA 30mVRMS 100kHz) DR-B 2003 TPS73618-EP TPS73615-EP TPS73630-EP TPS73632-EP TPS73625-EP
2003 - TPS73618-EP

Abstract: TPS73615-EP TPS73630-EP TPS73632-EP TPS73625-EP
Text: DRB Junction-to-ambient thermal resistance (4) DCQ DBV 8 PINS 6 PINS 5 PINS 47.8 70.4 180 64 qJCtop Junction-to-case (top) thermal resistance 83 70 qJB Junction-to-board thermal resistance (6) N/A N/A 35 yJT Junction-to-top characterization parameter (7 , qJCbot Junction-to-case (bottom) thermal resistance (9) 12.1 6.3 UNITS N/A (1) (2) (3 , Power Dissipation section of this data sheet. The junction-to-ambient thermal resistance under natural


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PDF TPS736xx SBVS038T 400mA 30mVRMS 100kHz) TPS73618-EP TPS73615-EP TPS73630-EP TPS73632-EP TPS73625-EP
eup7907

Abstract: sot23-5 mosfet driver OCT SOT23-5 DS7907 sot23-5 thermal resistance EUP7907-12VIR1 sot23-5 Marking 1h EUP7907 marking
Text: -260 Thermal Resistance JA (SOT23-5) -220/W 60/W Thermal Resistance JA (TDFN- 8 , standard thermal test board. For TDFN- 8 package, the thermal resistance JA is 60°C/W on the standard , protection, thermal shutdown. The device can be available in the TDFN- 8 package or SOT23-5 package. 2.5V , maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of


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PDF EUP7907 600mA EUP7907 OT23-5 DS7907 sot23-5 mosfet driver OCT SOT23-5 DS7907 sot23-5 thermal resistance EUP7907-12VIR1 sot23-5 Marking 1h EUP7907 marking
2003 - DR-B 2003

Abstract: drb 2003 TPS73618-EP DR-B 2003 POWER SUPPLY TPS73615-EP TPS73630-EP TPS73632-EP TPS73625-EP
Text: 180 64 35 N/A N/A N/A UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 ) (9) For more information about traditional and new thermal metrics, see the IC , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS736xx SBVS038T 400mA 30mVRMS 100kHz) DR-B 2003 drb 2003 TPS73618-EP DR-B 2003 POWER SUPPLY TPS73615-EP TPS73630-EP TPS73632-EP TPS73625-EP
2003 - G30-88

Abstract: TPS73225-EP TPS73201-EP TPS73218-EP TPS73215-EP TPS73250-EP TPS73233-EP TPS73233 TPS73201 JESD51-7
Text: characterization parameter ( 8 ) 17.8 30.1 N/A qJCbot Junction-to-case (bottom) thermal resistance (9 , TPS732xx (3) THERMAL METRIC (1) (2) DRB Junction-to-ambient thermal resistance (4) qJA (5 , ) thermal resistance 83 70 qJB Junction-to-board thermal resistance (6) N/A N/A 35 , , see the Power Dissipation section of this data sheet. The junction-to-ambient thermal resistance , JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is


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PDF TPS732xx SBVS037O 250mA TPS732xx G30-88 TPS73225-EP TPS73201-EP TPS73218-EP TPS73215-EP TPS73250-EP TPS73233-EP TPS73233 TPS73201 JESD51-7
2003 - DR-B 2003

Abstract: drb 2003 TPS73618-EP voltage regulator 78 series TPS73615-EP TPS73630-EP TPS73632-EP TPS73625-EP
Text: 180 64 35 N/A N/A N/A UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 ) (9) For more information about traditional and new thermal metrics, see the IC , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS736xx SBVS038T 400mA 30mVRMS 100kHz) DR-B 2003 drb 2003 TPS73618-EP voltage regulator 78 series TPS73615-EP TPS73630-EP TPS73632-EP TPS73625-EP
2003 - TPS73201-EP

Abstract: TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73225-EP TPS73230-EP
Text: UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 , INFORMATION TPS732xx (3) THERMAL METRIC qJA qJCtop qJB yJT yJB qJCbot (1) (2) (3) (1) (2) DRB 8 PINS 47.8 , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS732xx SBVS037O 250mA 30mVRMS 10kHz 100kHz) TPS73201-EP TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73225-EP TPS73230-EP
2003 - TPS73201-EP

Abstract: TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73225-EP TPS73230-EP
Text: UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 , INFORMATION TPS732xx (3) THERMAL METRIC qJA qJCtop qJB yJT yJB qJCbot (1) (2) (3) (1) (2) DRB 8 PINS 47.8 , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS732xx SBVS037O 250mA 30mVRMS 10kHz 100kHz) TPS73201-EP TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73225-EP TPS73230-EP
2003 - TPS73233-EP

Abstract: TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73201-EP TPS73225-EP TPS73230-EP
Text: UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 , INFORMATION TPS732xx (3) THERMAL METRIC qJA qJCtop qJB yJT yJB qJCbot (1) (2) (3) (1) (2) DRB 8 PINS 47.8 , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS732xx SBVS037O 250mA 30mVRMS 10kHz 100kHz) TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73201-EP TPS73225-EP TPS73230-EP
2003 - PS73201

Abstract: Marking PJEQ SOT23-5 TPS73201-EP TPS73225-EP TPS73218-EP TPS73216-EP TPS73215-EP TPS73250-EP TPS73233-EP TPS73230-EP
Text: ) thermal resistance (9) 12.1 6.3 UNITS N/A (1) (2) (3) (4) (5) (6) (7) ( 8 ) (9 , resistance (4) qJA (5) DCQ DBV 8 PINS 6 PINS 5 PINS 47.8 70.4 180 64 qJCtop Junction-to-case (top) thermal resistance 83 70 qJB Junction-to-board thermal resistance (6) N/A , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard , (top) thermal resistance is obtained by simulating a cold plate test on the top of the package. No


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PDF TPS732xx SBVS037O 250mA TPS732xx PS73201 Marking PJEQ SOT23-5 TPS73201-EP TPS73225-EP TPS73218-EP TPS73216-EP TPS73215-EP TPS73250-EP TPS73233-EP TPS73230-EP
2003 - TPS73201-EP

Abstract: TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73225-EP TPS73230-EP
Text: UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 , INFORMATION TPS732xx (3) THERMAL METRIC qJA qJCtop qJB yJT yJB qJCbot (1) (2) (3) (1) (2) DRB 8 PINS 47.8 , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS732xx SBVS037O 250mA 30mVRMS 10kHz 100kHz) TPS73201-EP TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73225-EP TPS73230-EP
2003 - DR-B 2003

Abstract: TPS73630-EP
Text: 180 64 35 N/A N/A N/A UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 ) (9) For more information about traditional and new thermal metrics, see the IC , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS736xx SBVS038T 400mA 30mVRMS 100kHz) DR-B 2003 TPS73630-EP
2003 - TPS73233-EP

Abstract: TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73201-EP TPS73225-EP TPS73230-EP
Text: UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 , INFORMATION TPS732xx (3) THERMAL METRIC qJA qJCtop qJB yJT yJB qJCbot (1) (2) (3) (1) (2) DRB 8 PINS 47.8 , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS732xx SBVS037O 250mA 30mVRMS 10kHz 100kHz) TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73201-EP TPS73225-EP TPS73230-EP
2003 - DR-B 2003

Abstract: TPS73619DRBRG4 TPS73615-EP TPS73630-EP TPS73618-EP TPS73632-EP TPS73625-EP
Text: 180 64 35 N/A N/A N/A UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 ) (9) For more information about traditional and new thermal metrics, see the IC , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS736xx SBVS038T 400mA 30mVRMS 100kHz) DR-B 2003 TPS73619DRBRG4 TPS73615-EP TPS73630-EP TPS73618-EP TPS73632-EP TPS73625-EP
2003 - TPS73618-EP

Abstract: TPS73615-EP TPS73630-EP TPS73632-EP TPS73625-EP
Text: 180 64 35 N/A N/A N/A UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 ) (9) For more information about traditional and new thermal metrics, see the IC , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS736xx SBVS038T 400mA 30mVRMS 100kHz) TPS73618-EP TPS73615-EP TPS73630-EP TPS73632-EP TPS73625-EP
2003 - TPS73201-EP

Abstract: TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73225-EP TPS73230-EP
Text: UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 , INFORMATION TPS732xx (3) THERMAL METRIC qJA qJCtop qJB yJT yJB qJCbot (1) (2) (3) (1) (2) DRB 8 PINS 47.8 , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS732xx SBVS037O 250mA 30mVRMS 10kHz 100kHz) TPS73201-EP TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73225-EP TPS73230-EP
2003 - pjfq

Abstract: marking PJFQ TPS73618-EP PS73633 TPS73615-EP TPS73630-EP TPS73632-EP
Text: Junction-to-ambient thermal resistance (4) qJA (5) DCQ DBV 8 PINS 6 PINS 5 PINS 47.8 70.4 180 64 qJCtop Junction-to-case (top) thermal resistance 83 70 qJB Junction-to-board thermal resistance (6) N/A N/A 35 yJT Junction-to-top characterization parameter (7) 2.1 , Junction-to-case (bottom) thermal resistance (9) 12.1 6.3 UNITS N/A (1) (2) (3) (4) (5) (6) (7) ( 8 ) (9) °C/W For more information about traditional and new thermal metrics, see the IC


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PDF TPS736xx SBVS038T 400mA 30mVRMS 100kHz) pjfq marking PJFQ TPS73618-EP PS73633 TPS73615-EP TPS73630-EP TPS73632-EP
2003 - TPS73201-EP

Abstract: TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73225-EP TPS73230-EP
Text: Junction-to-ambient thermal resistance (4) DCQ DBV 8 PINS 6 PINS 5 PINS 47.8 70.4 180 64 qJCtop Junction-to-case (top) thermal resistance 83 70 qJB Junction-to-board thermal , Junction-to-case (bottom) thermal resistance (9) 12.1 6.3 UNITS N/A (1) (2) (3) (4) (5) (6) (7) ( 8 ) (9) (5) ° C/W For more information about traditional and new thermal metrics , Dissipation section of this data sheet. The junction-to-ambient thermal resistance under natural convection


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PDF TPS732xx SBVS037O 250mA TPS732xx TPS73201-EP TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73225-EP TPS73230-EP
2007 - ADT6501

Abstract: ADT6502 ADT6503 ADT6504
Text: . Trip Threshold Accuracy Figure 8 . Output Sink Resistance vs. Temperature 45 120 40 5V , of as thermal resistance . It is commonly specified in units of degrees per watt of power , in amplitude due to wiring resistance and inductance. 06096-010 THERMAL RESPONSE TIME , . Therefore, to monitor the temperature of a heat source, it is recommended that the thermal resistance , . Pin-selectable temperature hysteresis of 2°C or 10°C. 8 . Temperature resolution of 0.0625°C. Rev. PrB


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PDF ADT6501/ADT6503) ADT6502/ADT6504) OT-23 ADT6501 ADT6501/ADT6502/ADT6503/ADT6504 PR06096-0-3/07 ADT6501 ADT6502 ADT6503 ADT6504
2005 - Marking L2 Packaging SOT23-5

Abstract: DFN PACKAGE thermal resistance sot23-5 mosfet driver SP6203 jedec MO229 dfn-8 SIPEX Marking
Text: ).-40°C to +125°C Thermal Resistance , SOT-23-5 ( 1 Thermal Resistance , SOT-23-6 ( 1 Remark: The device is , 25 0.4 %/W µs µs µs V V Thermal Regulation, Note 7 Wake-Up Time (TWU), Note 8 (from shutdown mode , junction-to-ambient thermal resistance . JC is 6°C/W for this package. Exceeding the maximum allowable power , junction-to-ambient thermal resistance for the regulator and is layout dependent. The SOT-23-5 package has a JA of


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PDF SP6203/6205 300mA 500mA SP6205 OT-23-5 SP6203/6205 Marking L2 Packaging SOT23-5 DFN PACKAGE thermal resistance sot23-5 mosfet driver SP6203 jedec MO229 dfn-8 SIPEX Marking
2007 - ADT6501

Abstract: 6c sot-23 ADT6502SRJZP115RL7 BRANDING
Text: . ADT6502 Output Source Resistance vs. Temperature 120 Figure 8 . Output Sink Resistance vs. Temperature , commonly specified using the symbol Q and can be thought of as thermal resistance . It is commonly specified , recommended that the thermal resistance between the ADT6501/ADT6502 GND pins and the GND of the heat source be , temperature. PRODUCT HIGHLIGHTS 1. 2. 3. 4. 5. 6. 7. 8 . 9. - based temperature measurement gives high , . 8 Circuit Information. 8


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PDF OT-23 ADT6501/ADT6502 ADT6501) ADT6502) ADT6501 ADT6501 6c sot-23 ADT6502SRJZP115RL7 BRANDING
2003 - TPS73233-EP

Abstract: TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73201-EP TPS73225-EP TPS73230-EP
Text: UNITS Junction-to-ambient thermal resistance (4) Junction-to-case (top) thermal resistance Junction-to-board thermal resistance (6) Junction-to-top characterization parameter (7) Junction-to-board characterization parameter ( 8 ) Junction-to-case (bottom) thermal resistance (9) (5) °C/W (4) (5) (6) (7) ( 8 , INFORMATION TPS732xx (3) THERMAL METRIC qJA qJCtop qJB yJT yJB qJCbot (1) (2) (3) (1) (2) DRB 8 PINS 47.8 , junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard


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PDF TPS732xx SBVS037O 250mA 30mVRMS 10kHz 100kHz) TPS73233-EP TPS73250-EP TPS73215-EP TPS73216-EP TPS73218-EP TPS73201-EP TPS73225-EP TPS73230-EP
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