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    SOT132 Search Results

    SOT132 Datasheets (7)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT1322-1 NXP Semiconductors Footprint for reflow soldering SOT1322-1 Original PDF
    SOT1324-1 NXP Semiconductors Plastic fine-pitch ball grid array package; 144 balls Original PDF
    SOT1325-1 NXP Semiconductors Plastic thermal enhanced very thin small outline package; no leads; 10 terminals Original PDF
    SOT1327-1 NXP Semiconductors HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals Original PDF
    SOT1327-1 NXP Semiconductors Footprint for reflow soldering SOT1327-1 Original PDF
    SOT1328-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 80 balls Original PDF
    SOT1329-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 100 balls Original PDF