Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT-119 Search Results

    SOT-119 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    7UL2T125FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TC75S102F Toshiba Electronic Devices & Storage Corporation Operational Amplifier, 1.5V to 5.5V, I/O Rail to Rail, IDD=0.27μA, SOT-25 Visit Toshiba Electronic Devices & Storage Corporation
    7UL2T126FK Toshiba Electronic Devices & Storage Corporation One-Gate Logic(L-MOS), Buffer, SOT-765 (US8), -40 to 85 degC Visit Toshiba Electronic Devices & Storage Corporation
    TCR2EF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR2LF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR3DF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 300 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation

    SOT-119 Datasheets (16)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT1190-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 144 balls Original PDF
    SOT1190-2 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 144 balls Original PDF
    SOT1191-1 NXP Semiconductors Plastic, extremely thin quad flat package; no leads; 10 terminals Original PDF
    SOT1192-1 NXP Semiconductors Plastic thermal enhanced extremely thin small outline package; no leads; 4 terminals Original PDF
    SOT1192-1 NXP Semiconductors Reflow soldering footprint SOT1192-1 Original PDF
    SOT1193-1 NXP Semiconductors Plastic, extremely thin quad flat package; no leads; 8 terminals Original PDF
    SOT1193-2 NXP Semiconductors Plastic, extremely thin quad flat package; no leads; 8 terminals Original PDF
    SOT1194-1 NXP Semiconductors Footprint for reflow soldering SOT1194-1 Original PDF
    SOT1194-1 NXP Semiconductors Plastic thermal enhanced ultra thin small outline package; no leads; 4 terminals Original PDF
    SOT1196-1 NXP Semiconductors SO12: plastic small outline package; 12 leads; body width 3.9 mm Original PDF
    SOT1197-1 NXP Semiconductors Plastic thermal enhanced extremely thin small outline package; no leads; 10 terminals Original PDF
    SOT1197-1 NXP Semiconductors Footprint for reflow soldering SOT1197-1 Original PDF
    SOT1198-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 54 terminals; resin based Original PDF
    SOT1199-1 NXP Semiconductors Plastic very thin fine-pitch ball grid array package; 24 balls Original PDF
    SOT119a NXP Semiconductors Flanged ceramic package; 2 mounting holes; 6 leads Original PDF
    SOT119A_112 NXP Semiconductors CDFM6; Blister pack Packing method; standard product orientation 12NC ending 112 Original PDF