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Part Manufacturer Description Datasheet Download Buy Part
LTC1156CSW Linear Technology LTC1156 - Quad High Side Micropower MOSFET Driver with Internal Charge Pump; Package: SO; Pins: 16; Temperature Range: 0°C to 70°C
LTC1156CSW#PBF Linear Technology LTC1156 - Quad High Side Micropower MOSFET Driver with Internal Charge Pump; Package: SO; Pins: 16; Temperature Range: 0°C to 70°C
LTC1156CSW#TRPBF Linear Technology LTC1156 - Quad High Side Micropower MOSFET Driver with Internal Charge Pump; Package: SO; Pins: 16; Temperature Range: 0°C to 70°C
LTC1156CN Linear Technology LTC1156 - Quad High Side Micropower MOSFET Driver with Internal Charge Pump; Package: PDIP; Pins: 16; Temperature Range: 0°C to 70°C
LTC1156CNND Linear Technology IC 4 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDIP16, PLASTIC, DIP-16, MOSFET Driver
LTC1156CSW#TR Linear Technology LTC1156 - Quad High Side Micropower MOSFET Driver with Internal Charge Pump; Package: SO; Pins: 16; Temperature Range: 0°C to 70°C

socket lga 1156 pinout Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2009 - lga 1156

Abstract: socket lga 1156 LGA1156 tyco reference Socket gold Intel lga 1156 Intel nor flash
Text: Introducing Sockets and Hardware for LGA 1156 Processors Tyco Electronics' surface mount LGA socket was designed for use with Intel's® CoreTM i7 LGA 1156 processor. The contacts have solder balls , PRODUCT OFFERINGS Part Number Description Plating 2040540-1 LGA 1156 Socket 15 Gold 2040540-2 LGA 1156 Socket Gold Flash 2013882-1 ILM Assembly 2013882-2 ILM Assembly with , . APPLICATIONS Sockets and Hardware for LGA 1156 Processors · Desktop computers · Low end servers


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2011 - socket lga 1156

Abstract: LGA1156 Intel lga 1156 lga 1156 socket 1156
Text: Introducing Sockets and Hardware for LGA 1156 Processors TE Connectivity's surface mount LGA socket was designed for use with Intel's® CoreTM i7 LGA 1156 processor. The contacts have solder balls , 2040540-2 2013882-1 2013882-2 2013883-1 2013883-2 2013884-1 2040979-1 Description LGA 1156 Socket LGA 1156 , . APPLICATIONS Sockets and Hardware for LGA 1156 Processors · Desktop computers · Low end servers , : Steel, zinc or nickel plated · Backplate Insulator: Polypropylene KEY FEATURES · 1156 contacts with a


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foxconn socket 7

Abstract: No abstract text available
Text: AME ( INTENDED 0 .3 0 LGA 0 .2 0 1156 USE) SOCKET PART N O . ( I N T E N D E D , E I , TAIWAN, R . O . C . 04/12 '11 CUSTOMER DRAWING EOR LGA DWG N O . : 1156 SOCKET , WRITTEN CONSENT OF HON HA I PRECISION IND. CO., LTD. Foxconn USE) I L M OF 1156 SOCKET LGA , . N TA IP EI , TAIWAN, R.O.C. T IT LE : C U S TO M E R FOR LGA 1156 DRAWING SOCKET , , L TD. T A I P E I , TAIWAN, R . O . C . TIT L E: CUSTOMER DRAWING FOR LGA 1156 SOCKET H1 DW N


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PDF PT44P15-6401 foxconn socket 7
2012 - LGA PACKAGE thermal resistance

Abstract: No abstract text available
Text: solutions and replacing the LGA 1366, the Intel-approved LGA 2011-0 socket ( Socket R) offers the electrical , €™). Compared with the LGA 1366 socket , the increase in the LGA 2011-0’s contact density of 12 , socket base help establish minimum socket height after solder reflow. The LGA 2011-0 socket assembly , uses a larger backplate than the LGA 1366 or LGA 1156 sockets and is not backward compatible for use with any other processors and their ILM assemblies. The LGA 2011-0 socket is used with two IILM


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PDF 32nm-Sandy 016mm com/link/lga2011 USA/KC/2012 LGA PACKAGE thermal resistance
2012 - Not Available

Abstract: No abstract text available
Text: solutions and replacing the LGA 1366, the Intel-approved LGA 2011-0 socket ( Socket R) offers the electrical , €™). Compared with the LGA 1366 socket , the increase in the LGA 2011-0’s contact density of 12 , socket base help establish minimum socket height after solder reflow. The LGA 2011-0 socket assembly , uses a larger backplate than the LGA 1366 or LGA 1156 sockets and is not backward compatible for use with any other processors and their ILM assemblies. The LGA 2011-0 socket is used with two IILM


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PDF 32nm-Sandy 016mm com/link/lga2011 USA/KC/2012
2012 - LGA 1366

Abstract: socket lga 1156 LGA PACKAGE thermal resistance i7 processor cpu lga LGA resistance LGA 2011 Socket LGA2011-0 LGA socket Intel lga 1156
Text: and replacing the LGA 1366, the Intel-approved LGA 2011-0 socket ( Socket R) offers the electrical , Compared with the LGA 1366 socket , the increase in the LGA 2011-0's contact density of 12% while , establish minimum socket height after solder reflow. The LGA 2011-0 socket assembly retains its 3 , than the LGA 1366 or LGA 1156 sockets and is not backward compatible for use with any other processors and their ILM assemblies. The LGA 2011-0 socket is used with two IILM designs ­ a Standard (Square


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PDF 32nm-Sandy 016mm com/link/lga2011 USA/KC/2012 LGA 1366 socket lga 1156 LGA PACKAGE thermal resistance i7 processor cpu lga LGA resistance LGA 2011 Socket LGA2011-0 LGA socket Intel lga 1156
socket lga 1156

Abstract: socket 1156 LGA115 INTEL nehalem CPU LGA1156
Text: This document was generated on 04/30/2012 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 47596-0132 Active 0.91mm by 0.91mm Pitch LGA 1156 Desktop PC CPU Socket , 0.381µm Gold (Au) Plating, with Pick-and-Place Cover, 1156 Circuits, Lead-Free, Alignment Key , Certificate of Compliance (PDF) Series image - Reference only Processor Sockets 47596 Socket LGA1156 EU RoHS , 1156 Black 20 Copper Alloy Gold High Temperature Thermoplastic Tray 0.91mm 0.381µm -25°C to +100°C


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PDF PS-47596-001 LGA1156 47596Series PS-47596-001 SD-47596-001 socket lga 1156 socket 1156 LGA115 INTEL nehalem CPU
2012 - LGA1156

Abstract: G200E 743-TR 836E1-R800B 1156 pin map
Text: Contact Us Advanced Search Reseller Resource Center X8SIL Products Motherboards Xeon Boards [ X8SIL ] Key Features Links & Resources 1. Intel® Xeon® X3400 / L3400 series, CoreTM i3 & Pentium ® processors with LGA 1156 socket 2. Intel® 3400 Chipset 3. Up to 32GB DDR3 1333/1066/800MHz ECC Registered DIMM / 16GB Unbuffered DIMM 4. Dual Intel ® 82574L Gigabit Ethernet Controllers 5. 4x SATA (3 Gbps , Factor Dimensions Processor/Cache LGA 1156 Socket Intel ® Xeon ® X3400 series Intel ® Xeon ® L3400 series


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PDF X3400 L3400 1333/1066/800MHz 82574L 32-bit LGA1156 G200E 743-TR 836E1-R800B 1156 pin map
2011 - BPN-SAS-815TQ-O-P

Abstract: Supermicro SNK-P0046P socket lga 1156 USB to Micro USB Cable SNK-P0046P PWS-451-1R WPCM450 Motherboard BIOS Change bmc 6332 w83627dhg -ac
Text: Supermicro | Products | SuperServers | 1U | 5016I-URF Contact Us Advanced Search Reseller Resource Center Search SuperServer 5016I-URF Products Systems 1U [ 5016I-URF ] Key Features Integrated Board 1. Intel® Xeon® X3400 / L3400 series, CoreTM i3 & Pentium® processors with LGA 1156 socket 2. Up to 32GB DDR3 1333/1066 , Factor Model Dimensions 1U Rackmount CSE-815TQ-R450UB Super X8SIU-F Processor/Cache LGA 1156 Socket


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PDF 5016I-URF com/products/system/1U/5016/SYS-5016I-UR X3400 L3400 1333/1066/800MHz 82574L CBL-0061L CBL-0341L BPN-SAS-815TQ-O-P Supermicro SNK-P0046P socket lga 1156 USB to Micro USB Cable SNK-P0046P PWS-451-1R WPCM450 Motherboard BIOS Change bmc 6332 w83627dhg -ac
2012 - clock generator of computer motherboard

Abstract: CBL-0341L CSE-815TQ-330UB socket lga 1156 FAN-0086L4 WPCM450 MATROX MOTHERBOARD INTEL 815 FAN-0086L EEPROM 16MB
Text: Contact Us Advanced Search Reseller Resource Center SuperServer 5016I-NTF Products Systems 1U [ 5016I-NTF ] Key Features Integrated Board 1. Intel® Xeon® X3400 / L3400 series, CoreTM i3 & Pentium ® processors with LGA 1156 socket 2. Up to 32GB DDR3 1333/1066/800MHz ECC Registered DIMM or 16GB Unbuffered DIMM 3. Left Slot (Full- height / Full - length): 1 (x16) PCI - E 2.0 or 2 (x8 , 1U Rackmount CSE-815TQ-330UB Super X8SIU-F Processor/Cache LGA 1156 Socket Intel ® Xeon ® X3400


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PDF 5016I-NTF X3400 L3400 1333/1066/800MHz 82574L SYS-5016I-NTF 5016Is SC813 CBL-0061L clock generator of computer motherboard CBL-0341L CSE-815TQ-330UB socket lga 1156 FAN-0086L4 WPCM450 MATROX MOTHERBOARD INTEL 815 FAN-0086L EEPROM 16MB
2011 - socket lga 1156 pinout

Abstract: intel i5 MOTHERBOARD pcb CIRCUIT diagram i3 desktop MOTHERBOARD CIRCUIT diagram 115XLM LGA 1156 PIN OUT diagram LGA 1150 Socket PIN diagram Intel socket 1156 PIN LAYOUT Socket 1156 VID pinout 1155 socket REFLOW profile lga socket 1155
Text: Mechanism (ILM) provides the force needed to seat the 1156-LGA land package onto the socket contacts. The , .37 1156 -land Package and LGA1156 Socket Stackup Height .37 , processor at the IHS surface. Independent Loading Mechanism provides the force needed to seat the 1156-LGA , mates with the system board through this surface mount, 1156 -land socket . The Platform Environment , LGA1156 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the


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PDF i5-600, i3-500 LGA1156 E58389 socket lga 1156 pinout intel i5 MOTHERBOARD pcb CIRCUIT diagram i3 desktop MOTHERBOARD CIRCUIT diagram 115XLM LGA 1156 PIN OUT diagram LGA 1150 Socket PIN diagram Intel socket 1156 PIN LAYOUT Socket 1156 VID pinout 1155 socket REFLOW profile lga socket 1155
pin diagram for core i3 processor

Abstract: pin diagram for core i7 processor core i3 Silicon Motion SM750 INTEL Core i7 860 pin diagram for core i5 processor LGA 1156 Socket diagram pin diagram intel i3 processor 1960047831N001 intel i5 pin diagram
Text: GbE/SATA RAID Features LGA 1156 Intel® CoreTM i7/i5/i3/Pentium®/Xeon® processors Dual Channel (ECC , Intel LGA1156 Core i5/i7/i3 Processors Software APIs: SPI BIOS Flash Mini PCIe Socket DVIPin-Header , Graphics L3 Cache Support Model Socket Chipset BIOS Bus Memory PCI-Express PCI Technology Max. Cap. Socket , Channel USB 2.0 Serial Parallel FDD PS/2 Mini PCI Express Socket Output Interval Audio Output Test , 1 USB 2.0 9 USB Ports Optional PCA-AUDIO-HDA1E Audio Module Mini-PCIe Socket HD Audio


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PDF PCE-5125 LGA1156 SM750 PCA-5612-00A1E PCA-COM232-00A1E COM232 PCA-TPM-00A1E PCE-5125 PCE-5125. pin diagram for core i3 processor pin diagram for core i7 processor core i3 Silicon Motion SM750 INTEL Core i7 860 pin diagram for core i5 processor LGA 1156 Socket diagram pin diagram intel i3 processor 1960047831N001 intel i5 pin diagram
2012 - lga1155 pinout

Abstract: socket lga 1155 pinout socket lga 1156 pinout Intel socket 1156 PIN LAYOUT lga1155 land profile pattern intel LGA 1155 PIN diagram LGA 1150 Socket PIN diagram lga1155 LGA 1155 Socket PIN diagram LGA 1155 PIN diagram
Text: force needed to seat the 1155- LGA land package onto the socket contacts. PCH Platform Controller , Socket 3 LGA1155 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket , Family, Desktop Intel® Celeron® Processor Family, and LGA1155 Socket Thermal Mechanical , LGA1155 socket may contain design defects or errors known as errata which may cause the product to deviate , . 20 3 LGA1155 Socket


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PDF LGA1155 UL1439 lga1155 pinout socket lga 1155 pinout socket lga 1156 pinout Intel socket 1156 PIN LAYOUT lga1155 land profile pattern intel LGA 1155 PIN diagram LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram LGA 1155 PIN diagram
2012 - 83627DHG

Abstract: DDR3-1333 DIMM Spec core i3 free 82578DM ALC889 SMBIOS core i3 motherboard slb9635tt micro switch keyboard G6950
Text: MBD-C7SIM-Q-O MBD-C7SIM-Q-B Physical Stats Form Factor Dimensions Processor/Cache LGA 1156 Socket Intel ® CoreTM , Contact Us Advanced Search Reseller Resource Center C7SIM-Q Products Motherboards CoreTM Boards [ C7SIM-Q ] Key Features 1. Intel® CoreTM i7, i5, i3 and Pentium® processors in LGA1156 socket 2. Intel® Q57 Express Chipset 3. Up to 16GB unbuffered non-ECC DDR3 1333/1066/800 DIMM 4. Intel® 82578DM + 82574L Gigabit Ethernet Controllers 5. Built-in SATA Controller 6x SATA (3Gbps) Drive Support 6


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PDF LGA1156 82578DM 82574L 32-bit -260-00033-0N 83627DHG DDR3-1333 DIMM Spec core i3 free 82578DM ALC889 SMBIOS core i3 motherboard slb9635tt micro switch keyboard G6950
2011 - sata to usb adapter

Abstract: 5016I-MR LGA1156 mini usb 10p G6950
Text: Processor/Cache LGA 1156 Socket Intel ® Xeon® X3400 series Intel ® Xeon® L3400 series Intel ® CoreTM i3


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PDF 5016I-MR X3400 L3400 1333/1066/800MHz 82574L SYS-5016I-MR CSE-512-200B CBL-0061L sata to usb adapter 5016I-MR LGA1156 mini usb 10p G6950
2011 - nuvoton

Abstract: intel i3 motherboard RSC-RR1U
Text: -811TQ-280 Super X8SIL-F Processor/Cache LGA 1156 Socket Intel ® Xeon® X3400 series Intel ® Xeon® L3400 series


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PDF 5016I-TF X3400 L3400 1333/1066/800MHz 82574L SYS-5016I-TF CSE-811TQ-280 SC813, nuvoton intel i3 motherboard RSC-RR1U
2007 - lga 4x4 footprint

Abstract: FCLGA-16 NBSG14MAT1BG Vcc-1000 SG14 QFN-16 NBSG14 lga-16 4x4 LGA-16 JEDEC qfn tray
Text: Q1 Q2 Q1 5 Figure 1. BGA-16 and LGA -16 Pinout (Top View) 6 7 8 VEE Q3 Q3 VCC Figure 2. QFN-16 Pinout (Top View) Table 1. Pin Description Pin BGA QFN Name , LGA package typically terminated with 50 W to VTT = VCC - 1.5 V. http://onsemi.com 2 NBSG14 , °C( LGA )/85°C(QFN)* Min Typ Max Min Typ Max Min Typ Max Unit 45 60 , has been established when mounted in a test socket or printed circuit board with maintained


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PDF NBSG14 NBSG14/D lga 4x4 footprint FCLGA-16 NBSG14MAT1BG Vcc-1000 SG14 QFN-16 NBSG14 lga-16 4x4 LGA-16 JEDEC qfn tray
2007 - lga 4x4 footprint

Abstract: LGA16 L footprint LGA16 footprint FCLGA-16
Text: 5 VEE 6 Q3 7 Q3 8 VCC Figure 1. BGA-16 and LGA -16 Pinout (Top View) Figure 2. QFN-16 Pinout (Top View) Table 1. Pin Description Pin BGA D1 C1 QFN 1 2 Name VTCLK CLK I/O ECL, CML, LVCMOS , susceptible to self-oscillation. *Devices in LGA package typically terminated with 50 W to VTT = VCC - 1.5 V , 1610 405 VCC1000* VCC1400* Max 75 1650 495 VCC VIH150 VCC75 2.5 70°C( LGA )/85°C(QFN)* Min 45 1575 315 , equilibrium has been established when mounted in a test socket or printed circuit board with maintained


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PDF NBSG14 FCBGA-16 NBSG14/D lga 4x4 footprint LGA16 L footprint LGA16 footprint FCLGA-16
2007 - 485G

Abstract: LGA-16 NBSG11 QFN-16 JEDEC qfn tray 526A lga-16 4x4
Text: 9 Q1 Q0 Q0 5 Figure 1. BGA-16 and LGA -16 Pinout (Top View) 6 7 8 VEE NC NC VCC Figure 2. QFN-16 Pinout (Top View) Table 1. PIN DESCRIPTION Pin BGA QFN , = 0 V (Note 7) -40 °C 25°C 70°C( LGA )/85°C(QFN)* Min Typ Max Min Typ Max , when mounted in a test socket or printed circuit board with maintained transverse airflow greater than , °C 70°C( LGA )/85°C(QFN)* Min Typ Max Min Typ Max Min Typ Max Unit IEE


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PDF NBSG11 NBSG11/D 485G LGA-16 NBSG11 QFN-16 JEDEC qfn tray 526A lga-16 4x4
2011 - MATROX

Abstract: CBL-0049L LGA115 PWS-281-1H SNK-P0046P vga 15
Text: -813MTQ-280C Super X8SIE-F Processor/Cache LGA 1156 Socket Intel ® Xeon® X3400 series Intel ® Xeon® L3400 series


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PDF 5016I-MTF X3400 L3400 1333/1066/800MHz 82574L SYS-5016I-MTF CSE-813MTQ-280C MATROX CBL-0049L LGA115 PWS-281-1H SNK-P0046P vga 15
2005 - Not Available

Abstract: No abstract text available
Text: that has been proven with years of customer experience. 3M can provide a socket for most types of BGA or LGA packages, standard or custom, in a variety of pitches. Reference the 3M Textool BGA Socket , by 3M) 3M Textool BGA/ LGA Lidded Sockets, 1.0 mm Socket Type Max. Package Body Size Max , Sockets ™ ™ Table of Contents BGA/ LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . , socket must be soldered with the contacts in the “OPEN” position. 4. Precautions Typical Part


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2011 - bios 465

Abstract: spi flash memory 8gb RSC-RR1U intel 82574L SC813M USB to Micro USB Cable
Text: Factor Model Dimensions 1U Rackmount CSE-113MTQ-560CB Super X8SI6-F Processor/Cache LGA 1156 Socket


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PDF 1016I-M6F X3400 L3400 1333/1066/800MHz 82574L 24PIN 4028mm SC813MF, SC113M bios 465 spi flash memory 8gb RSC-RR1U intel 82574L SC813M USB to Micro USB Cable
2009 - lga 1366

Abstract: LGA1366 1981837-1 1981467-1 1939739-1 1981837-2
Text: Introducing Sockets and Hardware for LGA 1366 Processors Tyco Electronics' surface mount LGA socket was designed for use with Intel's® CoreTM i7 LGA 1366 processor. The contacts have .64mm diameter , LGA 1366 Socket 15 Gold Lead Free 1981837-2 LGA 1366 Socket 30 Gold Lead Free 1-1981837-2 LGA 1366 Socket 30 Gold Leaded 1939738-1 ILM U Lever 1-1939738-2 ILM Straight , Guides. APPLICATIONS Sockets and Hardware for LGA 1366 Processors · Servers · High End


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2006 - EIA-364 65A

Abstract: lga components EIA-364-65A LGA resistance 0.5mm pitch BGA EIA-364-32 EIA-364-31 EIA-364-28 EIA-364-27 LGA PACKAGE thermal resistance
Text: 0.5 mm LGA /BGA Sockets DESCRIPTION Tyco Electronics' polymer interconnect technology optimizes socketing of 0.5 mm pitch LGA or BGA devices. This highly conductive polymer contact provides , contact polymer contact allows for easy socket replacement Light compression load of 25 grams/contact , : 1-508-699-9851 Fax: 1-508-695-8111 E-mail: allison_bobrowski@tycoelectronics.com 0.5mm LGA /BGA Sockets , characteristics are optimized. LGA Contact Compressed LOAD LGA Package LGA Pad Contact Polyimide


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PDF 8-1773444-1-CC LH-PDF-07/06 EIA-364 65A lga components EIA-364-65A LGA resistance 0.5mm pitch BGA EIA-364-32 EIA-364-31 EIA-364-28 EIA-364-27 LGA PACKAGE thermal resistance
QFP lead pitch 0.3mm

Abstract: BGA and QFP Package mounting QFP 0.3mm pitch 0.3mm pitch BGA particle bga socket material for chip resistors qfp 100 SOCKET BGA and QFP Package 0.3mm pitch package bga
Text: Continuous improvement Stamped spring pin socket BGA low force pin LGA high force pin BGA socket , Socket Technologies High Performance IC Sockets And Test Adapters IP, Sep2009 Overview , Designs Engineering ­ Electrical and Mechanical ISO9001:2000 Registration Socket Technology Overview , adapters for sockets 10 Years Continuous improvement Embedded gold plated wire elastomer socket , Small socket footprint Easy to place inductors, capacitors, resistors, etc for tuning and increasing


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PDF Sep2009 ISO9001 50x50mm QFP lead pitch 0.3mm BGA and QFP Package mounting QFP 0.3mm pitch 0.3mm pitch BGA particle bga socket material for chip resistors qfp 100 SOCKET BGA and QFP Package 0.3mm pitch package bga
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