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Part ECAD Model Manufacturer Description Datasheet Download Buy Part
SCT4045DW7HR SCT4045DW7HR ECAD Model ROHM Semiconductor 750V, 31A, 7-pin SMD, Trench-structure, Silicon-carbide (SiC) MOSFET for Automotive
SCT3040KW7 SCT3040KW7 ECAD Model ROHM Semiconductor 1200V 56A, 7-pin SMD, Trench-structure, Silicon-carbide (SiC) MOSFET
SCT3080AW7 SCT3080AW7 ECAD Model ROHM Semiconductor 650V 29A, 7-pin SMD, Trench-structure, Silicon-carbide (SiC) MOSFET
SCT3120AW7 SCT3120AW7 ECAD Model ROHM Semiconductor 650V 21A, 7-pin SMD, Trench-structure, Silicon-carbide (SiC) MOSFET
SCT3160KW7 SCT3160KW7 ECAD Model ROHM Semiconductor 1200V 17A, 7-pin SMD, Trench-structure, Silicon-carbide (SiC) MOSFET
SCT4062KW7HR SCT4062KW7HR ECAD Model ROHM Semiconductor 1200V, 24A, 7-pin SMD, Trench-structure, Silicon-carbide (SiC) MOSFET for Automotive

smd jsp Datasheets Context Search

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smd jsp

Abstract: SN100C "IPC-9701" IPC-9701 HASL IPC-A-610C J-STD-002B SN63
Text: Reflow Soldering of SMD Products To Printed Wiring Boards (PWBs) Using Lead-Free Solder Jon S. Prokop Vice President, Operations (972) 789-3818 jprokop@rfm.com 1 JSP 111604 Assembly of SMD Products To PWBs Using Pb-Free Solder · Considerations ­ ­ ­ ­ ­ 2 PWB Stencil Type of solder Reflow soldering profile Tests and results JSP 111604 Printed Wiring Board , evaluations 3 JSP 111604 Printed Wiring Board Finish · Standard PWB finishes, such as solder plating


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PDF IPC-A-610C smd jsp SN100C "IPC-9701" IPC-9701 HASL IPC-A-610C J-STD-002B SN63
Not Available

Abstract: No abstract text available
Text: Thyristor SMD Type Triacs BT134W Series SOT-223 Features Unit: mm +0.2 3.50-0.2 , Rth j-sp Thermal resistance junction to ambient Rth j-a full or half cycle 15 K/W , Thyristor SMD Type BT134W Series Electrical Characteristics Ta = 25 Parameter Symbol Min , 10 50 V/ s 2 s Thyristor SMD Type BT134W Series 1.4 BT134W Ptot / W , šC), versus junction temperature Tj. www.kexin.com.cn 3 Thyristor SMD Type BT134W Series 3


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PDF BT134W OT-223 BT134W- BT134W500 BT134W BT134. BT134
1996 - BYV40

Abstract: SC18 SMD footprint design
Text: ultrafast BYV40 series THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-sp Thermal , ; per diode trr / ns 100 1000 BYV40 Zth j-sp / (K/W) 10 IF = 2A 100 1A 1.0 , thermal impedance; per diode; Zth j-sp = f(tp). 3 Rev 1.200 Philips Semiconductors Product , surface mounting package. Notes 1. For further information, refer to Philips publication SC18 " SMD


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PDF BYV40 OT223 SC18 SMD footprint design
1997 - smd jsp

Abstract: 20CT BYV116 PBYR225CT SC18 smd diode A1 1466 diode smd jsp 33
Text: schottky barrier PBYR225CT series THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-sp , j-sp (K/W) PBYR225CT IF / A 100 100 Tj = 25 C Tj = 125 C 1.5 typ max 10 1 , tp (s) 0.1s 10s Fig.5. Transient thermal impedance; per diode; Zth j-sp = f(tp). BYV116 , SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0


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PDF OT223 PBYR225CT smd jsp 20CT BYV116 SC18 smd diode A1 1466 diode smd jsp 33
1998 - BYV40

Abstract: BYV40E SC18
Text: Rth j-sp Thermal resistance junction to solder point Thermal resistance junction to ambient , , Zth j-sp (K/W) Tj=25C 10 Tj=150C 2 1 TYP MAX 1 P D 0.1 0 0 0.5 VF , T t 1s 10s BYV40E Fig.10. Transient thermal impedance; per diode; Zth j-sp = f(tp). 4 , SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0


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PDF BYV40E OT223 OT223 BYV40 SC18
1998 - 20CT

Abstract: BYV116 PBYR225CT SC18 BYV116 25
Text: °C THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-sp one or both diodes , PBYR225CT IF / A 100 100 Transient thermal impedance, Zth j-sp (K/W) Tj = 25 C Tj = 125 C , 1s 10s PBYR225CT Fig.6. Transient thermal impedance; per diode; Zth j-sp = f(tp). BYV116 , , refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397


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PDF PBYR225CT OT223 20CT BYV116 SC18 BYV116 25
1998 - Not Available

Abstract: No abstract text available
Text: RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-sp Thermal resistance junction to solder point , .10. Typical and maximum on-state characteristic. 100 TRIAC 2.5 BT134W Zth j-sp (K/W) 10 , Fig.11. Transient thermal impedance Zth j-sp , versus pulse width tp. Fig.8. Normalised latching , information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code


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PDF BT131W OT223 BT131WRepetitive OT223. OT223
1997 - Not Available

Abstract: No abstract text available
Text: SYMBOL PARAMETER CONDITIONS Rth j-sp Thermal resistance junction to solder point Thermal , Zth j-sp (K/W) 10 unidirectional 2 bidirectional 1 1.5 P D 1 tp 0.1 , 0.1s 1s 10s tp / s Fig.11. Transient thermal impedance Zth j-sp , versus pulse width tp , information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code


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PDF BT134W OT-223 BT134WBT134WBT134WRepetitive OT223. OT223
500D

Abstract: 600D BT134W BT136 BT136D SC18
Text: CONDITIONS Rth j-sp Thermal resistance junction to solder point Thermal resistance junction to , characteristic. 100 TRIAC 2.5 BT134W Zth j-sp (K/W) 10 unidirectional 2 bidirectional , impedance Zth j-sp , versus pulse width tp. Fig.8. Normalised latching current IL(Tj)/ IL(25°C), versus , . Notes 1. For further information, refer to Philips publication SC18 " SMD Footprint Design and


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PDF OT223 BT134W BT134WRepetitive OT223. OT223 500D 600D BT136 BT136D SC18
1997 - Not Available

Abstract: No abstract text available
Text: www.kersemi.com BT148W series THERMAL RESISTANCES SYMBOL PARAMETER Rth j-sp Thermal resistance , on-state characteristic. 100 BT145 2.5 BT148W Zth j-sp (K/W) 10 2 1 1.5 P D , C) 1ms 10ms 0.1s 1s 10s tp / s Fig.11. Transient thermal impedance Zth j-sp , information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code


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PDF BT148W OT223 BT148WRepetitive OT223. OT223
1998 - smd triacs

Abstract: BT131 BT132-D BT131W BT134W BT136 SC18 Triacs logic level
Text: Rth j-sp Thermal resistance junction to solder point Thermal resistance junction to ambient , 2.5 BT134W Zth j-sp (K/W) 10 unidirectional 2 bidirectional 1 1.5 P D 1 , ) 1ms 10ms 0.1s 1s 10s tp / s Fig.11. Transient thermal impedance Zth j-sp , versus , information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code


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PDF OT223 BT131W BT131WRepetitive smd triacs BT131 BT132-D BT134W BT136 SC18 Triacs logic level
1998 - BTA204 smd

Abstract: triac BT134w smd jsp
Text: CONDITIONS Rth j-sp Thermal resistance junction to solder point Thermal resistance junction to , characteristic. 100 TRIAC 2.5 BT134W Zth j-sp (K/W) 10 unidirectional 2 bidirectional , impedance Zth j-sp , versus pulse width tp. Fig.8. Normalised latching current IL(Tj)/ IL(25°C), versus , SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0


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PDF OT223 BTA204W BTA204W- BTA204 smd triac BT134w smd jsp
1997 - 500D

Abstract: 600D BT134W BT136 BT136D SC18 smd jsp smd triacs
Text: CONDITIONS Rth j-sp Thermal resistance junction to solder point Thermal resistance junction to , characteristic. 100 TRIAC 2.5 BT134W Zth j-sp (K/W) 10 unidirectional 2 bidirectional , impedance Zth j-sp , versus pulse width tp. Fig.8. Normalised latching current IL(Tj)/ IL(25°C), versus , . Notes 1. For further information, refer to Philips publication SC18 " SMD Footprint Design and


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PDF OT223 BT134W BT134WRepetitive 500D 600D BT136 BT136D SC18 smd jsp smd triacs
Not Available

Abstract: No abstract text available
Text: 150 150 Tj T stg THERMAL RESISTANCES SYMBOL PARAMETER ^ t h j-sp CONDITIONS one or both , = f(VF ); param eter 7} Fig. 7. Transient therm al impedance; p e r diode; ~th j-sp = f(U . , . Notes 1. For further information, refer to Philips publication SC18 " SMD Footprint Design and


OCR Scan
PDF PBYR245CT OT223 OT223 100ms
2001 - MCR08BT1

Abstract: No abstract text available
Text: Semiconductors Product specification Thyristor logic level THERMAL RESISTANCES SYMBOL Rth j-sp Rth j-a , (Tj) IL(25 C) Fig.10. Typical and maximum on-state characteristic. 100 Zth j-sp (K/W , impedance Zth j-sp , versus pulse width tp. dVD/dt (V/us) 1000 3 2.5 100 2 1.5 1 0.5 0 -50 1 10 , mounting package. Notes 1. For further information, refer to Philips publication SC18 " SMD Footprint


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PDF MCR08BT1 OT223 MCR08BT1
1997 - SENSITIVE GATE TRIACS, sot223

Abstract: 500E 600E BT134W BT136 BT136D SC18
Text: SYMBOL PARAMETER CONDITIONS Rth j-sp Thermal resistance junction to solder point Thermal , .10. Typical and maximum on-state characteristic. 100 TRIAC 2.5 BT134W Zth j-sp (K/W) 10 , Fig.11. Transient thermal impedance Zth j-sp , versus pulse width tp. Fig.8. Normalised latching , , refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397


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PDF OT223 BT134W BT134WRepetitive SENSITIVE GATE TRIACS, sot223 500E 600E BT136 BT136D SC18
1997 - BT148WR

Abstract: BT148W Thyristors application circuits thyristor sot223 500R 600R BT134W BT148 BT151 FR4 epoxy
Text: SYMBOL PARAMETER Rth j-sp Thermal resistance junction to solder point Thermal resistance , on-state characteristic. 100 BT145 2.5 BT148W Zth j-sp (K/W) 10 2 1 1.5 P D , C) 1ms 10ms 0.1s 1s 10s tp / s Fig.11. Transient thermal impedance Zth j-sp , SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0


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PDF OT223 BT148W BT148WRepetitive BT148WR Thyristors application circuits thyristor sot223 500R 600R BT134W BT148 BT151 FR4 epoxy
2004 - BT131W

Abstract: SC18 smd jsp smd triacs
Text: PARAMETER CONDITIONS Rth j-sp Thermal resistance junction to solder point Thermal resistance , °C), versus junction temperature Tj. 3 0.8 0.4 IL(Tj) IL(25 C) Zth j-sp (K/W) 100 2.5 , .11. Transient thermal impedance Zth j-sp , versus pulse width tp. Fig.8. Normalised latching current IL(Tj , package. Notes 1. For further information, refer to Philips publication SC18 " SMD Footprint Design and


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PDF OT223 BT131W BT131WRepetitive SC18 smd jsp smd triacs
2000 - Triacs logic level

Abstract: No abstract text available
Text: Rth j-sp Thermal resistance junction to solder point Thermal resistance junction to ambient , temperature Tj. 3 0 IL(Tj) IL(25 C) 100 2.5 Zth j-sp (K/W) 10 unidirectional 2 , 150 1ms 10ms 0.1s 1s 10s tp / s Fig.11. Transient thermal impedance Zth j-sp , information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code


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PDF OT223 BT131W BT131WRepetitive Triacs logic level
2001 - BT169 equivalent

Abstract: BT169 in rth 13 sp BT134W BT169 BT169W SC18
Text: Thyristor logic level BT169W Series THERMAL RESISTANCES SYMBOL PARAMETER Rth j-sp Thermal , BT169W Zth j-sp (K/W) 10 2 1 1.5 P D 1 tp 0.1 0.5 t 0 -50 0 50 , .11. Transient thermal impedance Zth j-sp , versus pulse width tp. dVD/dt (V/us) IH(Tj) IH(25 C) 10000 , SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2. Epoxy meets UL94 V0


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PDF OT223 BT169W BT169 BT169 equivalent BT169 in rth 13 sp BT134W BT169 SC18
1997 - lighting control by triac BT136

Abstract: triac bt136 BT134W BT136 600G 800G Bt136 application motor control
Text: Triacs BT134W series THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-sp Thermal , on-state characteristic. 100 TRIAC 2.5 BT134W Zth j-sp (K/W) 10 unidirectional 2 , thermal impedance Zth j-sp , versus pulse width tp. Fig.8. Normalised latching current IL(Tj)/ IL(25 , surface mounting package. Notes 1. For further information, refer to Philips publication SC18 " SMD


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PDF BT134W OT223 BT134WBT134WBT134WRepetitive lighting control by triac BT136 triac bt136 BT136 600G 800G Bt136 application motor control
1997 - rgk 13 1 11 005 01

Abstract: BT134W BT151 BT169 BT169W SC18 pin configuration of BT169
Text: Thyristor logic level BT169W Series THERMAL RESISTANCES SYMBOL PARAMETER Rth j-sp Thermal , °C), versus junction temperature Tj. 3 0 100 BT169 2.5 BT169W Zth j-sp (K/W) 10 2 , impedance Zth j-sp , versus pulse width tp. Fig.8. Normalised latching current IL(Tj)/ IL(25°C), versus , to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397 750


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PDF OT223 BT169W BT169 rgk 13 1 11 005 01 BT134W BT151 BT169 SC18 pin configuration of BT169
2001 - introduction to power semiconductors

Abstract: MCR08BT1 APPCHP1
Text: Semiconductors Product specification Thyristor logic level THERMAL RESISTANCES SYMBOL Rth j-sp Rth j-a , . 100 Zth j-sp (K/W) BT169W 3 2.5 2 1.5 1 0.5 10 1 P D tp 0.1 t 0 -50 0 50 , ) Fig.11. Transient thermal impedance Zth j-sp , versus pulse width tp. dVD/dt (V/us) 1000 3 2.5 , Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code: 9397 750 00505. 2 , Pack, SMD Package Device status Buy online Type number North Ordering code American (12NC) type


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PDF MCR08BT1 MCR08BT1 01-Oct-97) introduction to power semiconductors APPCHP1
BT134G

Abstract: 600G 800G BT134W BT136
Text: Triacs BT134W series THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-sp Thermal , on-state characteristic. 100 TRIAC 2.5 BT134W Zth j-sp (K/W) 10 unidirectional 2 , thermal impedance Zth j-sp , versus pulse width tp. Fig.8. Normalised latching current IL(Tj)/ IL(25 , surface mounting package. Notes 1. For further information, refer to Philips publication SC18 " SMD


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PDF BT134W OT223 BT134WBT134WBT134WRepetitive OT223. OT223 BT134G 600G 800G BT136
1997 - PBYR245CT

Abstract: SC18 JSP DIODE
Text: THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS Rth j-sp Thermal resistance junction to , 125 °C. Zth j-sp (K/W) IF / A Tj = 25 C Tj = 150 C 3.0 1 100 typ 10 max , information, refer to Philips publication SC18 " SMD Footprint Design and Soldering Guidelines". Order code


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PDF OT223 PBYR245CT SC18 JSP DIODE
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