The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
HPA01142PWR Texas Instruments 18.5V, 2A, 650kHz / 1.2MHz Step-Up DC-DC Converter w/ Forced PWM Mode 8-TSSOP -40 to 85
TPS61085DGKT Texas Instruments 18.5V, 2A, 650kHz / 1.2MHz Step-Up DC-DC Converter w/ Forced PWM Mode 8-VSSOP -40 to 85
TPS61085PWG4 Texas Instruments 18.5V, 2A, 650kHz / 1.2MHz Step-Up DC-DC Converter w/ Forced PWM Mode 8-TSSOP -40 to 85
TPS61085DGKTG4 Texas Instruments 18.5V, 2A, 650kHz / 1.2MHz Step-Up DC-DC Converter w/ Forced PWM Mode 8-VSSOP -40 to 85
TPS61085PW Texas Instruments 18.5V, 2A, 650kHz / 1.2MHz Step-Up DC-DC Converter w/ Forced PWM Mode 8-TSSOP -40 to 85
TPS61085DGKR Texas Instruments 18.5V, 2A, 650kHz / 1.2MHz Step-Up DC-DC Converter w/ Forced PWM Mode 8-VSSOP -40 to 85

shear force 0603 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2001 - SMD Transistor W01

Abstract:
Text: 3.1±0.2 1.3±0.1 0.6±0.3 0.7±0.3 0.6±0.3 Thickness varies with frequency and built-in capacitors , Thickness Shear Vibration Thickness Longitudinal Vibration Thickness Longitudinal Vibration(3rd overtone , Design Area Shear Vibration Area Shear Vibration (Closed Type) pp indicates initial frequency , force . Please make sure that you have evaluated by using placementmachines before going into mass , capabilities. The component might be resulted in damage by excessivemechanical force . Please make sure that you


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PDF P16E-12 P16E12 99MHz) TEA2130 LA7687 CSBLA503KEZZF12-B0 TEA2130 100nF SMD Transistor W01 SMD Transistor W03 CSTCV16M0X53J-R0 transistor SMD w01 CSACVX Murata CSTCV LA7687 CIRCUIT LA7687 a W01 transistor
2009 - Not Available

Abstract:
Text: V) Test duration: 2 h Damp heat 5 cycles Tests performed according to IEC 60068-2-30 A shear force , PTC thermistors as limit temperature sensors SMD, EIA case sizes 0402, 0603 and 0805 with ±3 °C , EPCOS' prior express consent is prohibited. Sensors Limit temperature sensors, EIA sizes 0402, 0603 , size 0805) or cardboard tape (case sizes 0402 and 0603 ), 180-mm reel with 8-mm tape, taping to IEC , , 0603 and 0805 Electrical specifications and ordering codes Tsense RR °C RR R (Tsense T) % k R R R


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2008 - shear force 0603

Abstract:
Text: V) Test duration: 2 h Damp heat 5 cycles Tests performed according to IEC 60068-2-30 A shear force , PTC thermistors as limit temperature sensors SMD, EIA case sizes 0402, 0603 and 0805 with ±3 °C , EPCOS' prior express consent is prohibited. Sensors Limit temperature sensors, EIA sizes 0402, 0603 , size 0805) or cardboard tape (case sizes 0402 and 0603 ), 180-mm reel with 8-mm tape, taping to IEC , , 0603 and 0805 Electrical specifications and ordering codes Tsense RR °C RR R (Tsense T) % k R R R


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2009 - shear force 0603

Abstract:
Text: Components reflow-soldered to test board Maximum bending: 2 mm A shear force of 5 N is applied , PTC thermistors for overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and , express consent is prohibited. Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V , ) or cardboard tape (case size 0603 ), 180-mm reel with 8-mm tape, taping to IEC 60286-3 Dimensional drawings in mm EIA case size 0603 Solder pad EIA case size 1210 Solder pad


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2009 - Not Available

Abstract:
Text: Components reflow-soldered to test board Maximum bending: 2 mm A shear force of 5 N is applied perpendicular , PTC thermistors for overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 , express consent is prohibited. Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V , tape (case size 0603 ), 180-mm reel with 8-mm tape, taping to IEC 60286-3 Dimensional drawings in mm EIA case size 0603 Solder pad EIA case size 1210 Solder pad Recommended maximum dimensions


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PDF 180-mm
2008 - Not Available

Abstract:
Text: Components reflow-soldered to test board Maximum bending: 2 mm A shear force of 5 N is applied perpendicular , PTC thermistors for overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V and 230 , express consent is prohibited. Overcurrent protection SMDs, EIA sizes 0603 and 1210, 24 V, 42 V, 63 V , tape (case size 0603 ), 180-mm reel with 8-mm tape, taping to IEC 60286-3 Dimensional drawings in mm EIA case size 0603 Solder pad EIA case size 1210 Solder pad Recommended maximum dimensions


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PDF 180-mm
Accu-Guard Series SMD Thin-Film Fuse

Abstract:
Text: current rating • Fast acting • Small-standard 0402, 0603 , 0805, 1206 and 0612 chip sizes • Taped , Fuse See table for standard sizes A=Accu-Guard® B=Accu-Guard® II C=Accu-Guard® II 0603 D=Accu-Guard® II 0612 E=Accu-Guard® II 0402, 0603 G=Accu-Guard® II Low Current 0402, 0603 Current , 0402 and 0603 Size Thin-Film Fuses The new F0402G and F0603G Accu-Guard® series of fuses is based on , lowest current ratings in compact 0402 and 0603 packages and features LGA terminations. RECOMMENDED


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PDF F0402G F0603G F0402E, F0603E, F0603C, F0805B, F1206B F0612D S-ACCU0M1213-C Accu-Guard Series SMD Thin-Film Fuse Accu-Guard SMD Thin-Film Fuse Circuit Protection Fuses Accu-Guard
2015 - High Voltage

Abstract:
Text: at step c C2: Capacitance at step b or d 4.15 Adhesion a. A force applied for 10 seconds to the line joining the terminations and in a plane parallel to the substrate for size ≥ 0603 : a force of 5N applied No visible damage b. A force applied until broken For size ≥ 0603 : ≥ 5N , applied until broken b. Force size ≥ 0603 : ≥ 5N X capacitor: Applied voltage 1.075K VDC (4.3 Ur , Table 7 SOLDERING METHOD SIZE 0402 0603 0805 1206 ≥ 1210 Reflow ≥ 0.1µF


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2010 - yageo Phycomp NPO capacitor

Abstract:
Text: 4.15 a. A force applied for 10 seconds to the line joining the terminations and in a plane parallel to the substrate for size 0603 : a force of 5N applied b. A force applied until broken For size 0603 : 5N No visible damage www.yageo.com Oct 20, 2010 V.3 Product specification 9 11 , broken b. Force size 0603 : 5N Voltage proof 4.2.1 SC X capacitor: Applied voltage 1.075K , Reflow/Wave SIZE 0402 0.1µF < 0.1µF 0603 1.0 µF < 1.0 µF 0805 2.2 µF < 2.2 µF 1206 4.7


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2013 - SC1808

Abstract:
Text: Adhesion 4.15 a. A force applied for 10 seconds to the line joining the terminations and in a plane parallel to the substrate for size 0603 : a force of 5N applied b. A force applied until broken For size 0603 : 5N No visible damage www.yageo.com Jan. 15, 2013 V.5 Product specification 9 11 , broken b. Force size 0603 : 5N Voltage Proof 4.2.1 SC X capacitor: Applied voltage 1.075K , Table 7 SOLDERING METHOD Reflow Reflow/Wave SIZE 0402 0.1µF < 0.1µF 0603 1.0 µF < 1.0 µF 0805


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2012 - phycomp capacitors npo

Abstract:
Text: 4.15 a. A force applied for 10 seconds to the line joining the terminations and in a plane parallel to the substrate for size 0603 : a force of 5N applied b. A force applied until broken For size 0603 : 5N No visible damage www.yageo.com Apr 06, 2011 V.4 Product specification 9 11 , broken b. Force size 0603 : 5N Voltage Proof 4.2.1 SC X capacitor: Applied voltage 1.075K , Reflow/Wave SIZE 0402 0.1µF < 0.1µF 0603 1.0 µF < 1.0 µF 0805 2.2 µF < 2.2 µF 1206 4.7


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2009 - Not Available

Abstract:
Text: Maximum bending: 2 mm A shear force of 5 N is applied perpendicular to the longitudinal axis of the , PTC thermistors for thermal management in LED driver circuits EIA case size 0603 Series/Type , express consent is prohibited. Thermal management in LED driver circuits EIA case size 0603 , EIA case size 0603 Reliability data Test Electrical endurance, constant at 85 °C Damp heat Standard , 10 Thermal management in LED driver circuits EIA case size 0603 Characteristics (typical) for


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PDF B59602, B59603 180-mm
Y4 series surface mount transistor

Abstract:
Text: for size 0603 : a force of 5N applied b. A force applied until broken For size 0603 : 5N , b. A force applied until broken 4.3 SC b. Force size 0603 : 5N size = 0402: 2.5N size = , 0402 0603 0805 1206 1210 Reflow 0.1µF 1.0 µF 2.2 µF 4.7 µF Reflow , maximum temperature NP0: lC/Cl: 30 ppm/°C X7R: lC/Cl: 15% 4.15 a. A force applied for 10 sec to , EN132400 Perform shear test, substrate bending test, impulse voltage and then endurance test


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2007 - Yageo X7R

Abstract:
Text: for size 0603 : a force of 5N applied b. A force applied until broken For size 0603 : 5N , b. A force applied until broken 4.3 SC b. Force size 0603 : 5N size = 0402: 2.5N size = , 0402 0603 0805 1206 1210 Reflow 0.1µF 1.0 µF 2.2 µF 4.7 µF Reflow , maximum temperature NP0: lC/Cl: 30 ppm/°C X7R: lC/Cl: 15% 4.15 a. A force applied for 10 sec to , EN132400 Perform shear test, substrate bending test, impulse voltage and then endurance test


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2011 - YAGEO CHIP Capacitors MARKING

Abstract:
Text: 4.15 a. A force applied for 10 seconds to the line joining the terminations and in a plane parallel to the substrate for size 0603 : a force of 5N applied b. A force applied until broken For size 0603 : 5N No visible damage www.yageo.com Apr 06, 2011 V.4 Product specification 9 11 , broken b. Force size 0603 : 5N Voltage Proof 4.2.1 SC X capacitor: Applied voltage 1.075K , Reflow/Wave SIZE 0402 0.1µF < 0.1µF 0603 1.0 µF < 1.0 µF 0805 2.2 µF < 2.2 µF 1206 4.7


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2009 - Not Available

Abstract:
Text: heat 5 cycles Tests performed according to IEC 60068-2-30 A shear force of 5 N is applied perpendicular , PTC thermistors for thermal management in LED driver circuits EIA case size 0603 Series/Type , consent is prohibited. Thermal management in LED driver circuits EIA case size 0603 Applications , 0603 Reliability data Test Electrical endurance, constant at 85 °C Damp heat Standard IEC 60738-1 , . Page 3 of 10 Thermal management in LED driver circuits EIA case size 0603 Characteristics


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PDF B59602, B59603 180-mm
2009 - A602

Abstract:
Text: 60068-2-30 Components reflow-soldered to test board Maximum bending: 2 mm A shear force of 5 N is applied , PTC thermistors for thermal management in LED driver circuits EIA case size 0603 Series/Type , express consent is prohibited. Thermal management in LED driver circuits EIA case size 0603 , EIA case size 0603 Reliability data Test Electrical endurance, constant at 85 °C Standard , LED driver circuits EIA case size 0603 Characteristics (typical) for type A602 and A603 PTC


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PDF B59602, B59603 180-mm A602 A603 B59603
1998 - Not Available

Abstract:
Text: MCS 0402 MCT 0603 MCU 0805 Professional Flat Chip Resistor Products Blue Protective , Resistor Products Professional MCS 0402 MCT 0603 MCU 0805 MCS / MCT / MCU Professional · · · · Advanced Thin Film Technology Advanced Dissipation Rating: 100 mW for 0603 Excellent Overall Stability: Class 0,5 Sizes CECC: EIA: 0402 1005 0603 1608 0805 2012 MCS, MCT and MCU Professional Thin Film Flat , 1999 23 MCS 0402 MCT 0603 MCU 0805 Professional Flat Chip Resistor Products Temperature


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1998 - resistor smd 1r0

Abstract:
Text: MCS 0402 MCT 0603 MCU 0805 Professional Flat Chip Resistor Products Blue Protective , Resistor Products Professional MCS 0402 MCT 0603 MCU 0805 MCS / MCT / MCU Professional · · · · Advanced Thin Film Technology Advanced Dissipation Rating: 100 mW for 0603 Excellent Overall Stability: Class 0,5 Sizes CECC: EIA: 0402 1005 0603 1608 0805 2012 MCS, MCT and MCU Professional Thin Film Flat , 1999 23 MCS 0402 MCT 0603 MCU 0805 Professional Flat Chip Resistor Products Temperature


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1998 - bks-131-01-l-v

Abstract:
Text: Research, Inc. LW/js 2 Contech Research SCOPE To perform Shear and Pull Force testing on , . - : 1. The following is a summary of the observed results: PULL FORCE (Pounds) A) SHEAR TEST , unseated with no apparent damage. PULL FORCE (Pounds) SHEAR TEST (Pounds) 55.4 68.3 61.0 52.3 53.0 58.0 , RESULTS : Continued PULL FORCE (Pounds) SHEAR TEST (Pounds) 40.5 44.6 31.9 50.2 38.8 31.7 45.4 28.5 , In all cases the housing became unseated with no apparent damage. PULL FORCE (Pounds) SHEAR TEST


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PDF 10012-l BKT-131 bks-131-01-l-v CLH12
Ablebond 8380

Abstract:
Text: force 100 grams. Code 2: Minimum force 200 grams. Table 2. Die Shear vs. Temperature Cycling (150 , failure by performing die shear test on a sample basis.The force of the shear test equipment on the die , Die Shear Evaluation A die shear evaluation was performed to determine the integrity of the die , before and after each set of 25 total cycles. Die shear tests were performed on groups of five (5) flip , . The conclusion of the 150 cycles showed no degradation in die shear . Sample Number 25 1 100


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PDF APN3001 6/99A Ablebond 8380 Ablestik 8380 Die Attach epoxy stamping FR4 substrate height and thickness FR4 substrate epoxy FR4 substrate height and thickness 1.2 Ablebond APN3001
BLH load cell

Abstract:
Text: force T, normal stress and shear stress when the beam in example (a) is subjected to a force , of the shear force . Even when the load point moves, the bending forces have no practical effect on , variation in the shear force in the web of the beam MOUNTING The standard mounting parts are a bracket , ) Distribution of bending moment M, shear force T, normal stress and shear stress when the beam in example (a , oriented for optimal measurement of the shear force . Even when the load point moves, the bending forces


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PDF VTR-PL0316-0402 BLH load cell Vishay nobel BLH load cell kis nobel SE-691 BLH sr-4 TEDEA load cell to measure load and torque celtron BLH transducer
2005 - bga solder ball shear

Abstract:
Text: following tests performed on selected test vehicles : Ball Shear : shear Force and failure mode Ball pull test: pull force and breaking mode Cross sections of soldered balls showing intermetallics layer Drop test following Jedec standard: JESD22-B111 Thermal cycling on board Ball shear test During shear , pads metallurgy has given a strong improvement in breaking mode while the shear force measured is not showing major change. . Fragile breaking mode seen after balls shear Ductile breaking mode example


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PDF CRP/05/1015 23X23 bga solder ball shear JESD22-B111 JESD22B111 23X23 bga thermal cycling reliability JESD97
2002 - Die Attach epoxy stamping

Abstract:
Text: die shear . Number of Cycles Sample Number Force /Code 25 1 100 g/1 2 150 g/1 , : Minimum force 200 grams. Table 2. Die Shear vs. Temperature Cycling (150 Total Cycles) Skyworks , stressing the attachment joint to failure by performing die shear test on a sample basis. The force of the , to Change Without Notice. · January 29, 2008 1 APPLICATION NOTE · APN3001 Die Shear Evaluation A die shear evaluation was performed to determine the integrity of the die attach process after


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PDF APN3001: Die Attach epoxy stamping Ablebond 8380 APN3001
2011 - fuse smd code Y

Abstract:
Text: . FEATURES · Accurate current rating · Fast acting · Small-standard 0402, 0603 , 0805, 1206 and 0612 chip , See table for standard sizes A=Accu-Guard® B=Accu-Guard® II C=Accu-Guard® II 0603 D=Accu-Guard® II 0612 E=Accu-Guard® II 0402, 0603 G=Accu-Guard® II 0402 Low Current Current expressed in , ENVIRONMENTAL CHARACTERISTICS Test Solderability Leach Resistance Storage Shear Temperature Cycling , stored in "as received" packaging. Components mounted to a substrate. Increasing shearing force applied


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PDF F0402G F0402E, F0603E, F0603C, F0805B, F1206B F0612D fuse smd code Y trapezoidal pulse i2t graph F0402E F0603C F0603E glass fuse color code smd t05
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