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LT1086CT-3.3DWF#MILDWF Linear Technology LT1086 - 1.5A Low Dropout Positive Regulators Adjustable and Fixed 2.85V, 3.3V, 3.6V, 5V, 12V; Pins: 0; Temperature Range: 0°C to 70°C
LT1172HVCT#31PBF Linear Technology LT1172 - 100kHz, 5A, 2.5A and 1.25A High Efficiency Switching Regulators; Package: TO-220; Pins: 5; Temperature Range: 0°C to 70°C
LT1763MPDE-1.5 Linear Technology LT1763 - 500mA, Low Noise, LDO Micropower Regulators; Package: DFN; Pins: 12; Temperature Range: -55°C to 125°C
LT1970ACFE#TRPBF Linear Technology LT1970A - 500mA Power Op Amp with Adjustable Precision Current Limit; Package: TSSOP; Pins: 20; Temperature Range: 0°C to 70°C
LT3015EDD-3.3#PBF Linear Technology LT3015 - 1.5A, Low Noise, Negative Linear Regulator with Precision Current Limit; Package: DFN; Pins: 8; Temperature Range: -40°C to 85°C
LT3015EMSE-2.5#PBF Linear Technology LT3015 - 1.5A, Low Noise, Negative Linear Regulator with Precision Current Limit; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C

senju m705 solder paste content Datasheets Context Search

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2014 - senju m705 solder paste

Abstract: Solder bar of Senju M705 M705-221BM5-42-11
Text: ‘¢ Recommended solder paste Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder : M705 -221BM5-42-11 ( SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705 /ESR-250 Solder / Flux: M705 / ESR 250 ( SENJU METAL INDUSTRY CO., LTD) 11 Solderability ( Solder dip) Pretreatment ①High , for screen-printing. Solderability depends on the reflow conditions, solder paste , and materials of


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PDF LD-E7-5-14-A senju m705 solder paste Solder bar of Senju M705 M705-221BM5-42-11
2014 - Senju ESR-250

Abstract: No abstract text available
Text: ‘¢ Recommended solder paste Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder : M705 -221BM5-42-11 ( SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705 /ESR-250 Solder / Flux: M705 / ESR 250 ( SENJU METAL INDUSTRY CO., LTD) 11 Solderability ( Solder dip) Pretreatment ①High , for screen-printing. Solderability depends on the reflow conditions, solder paste , and materials of


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PDF GM2AA50GV6* LD-E7-9-14-A Senju ESR-250
2014 - QT4c

Abstract: No abstract text available
Text: ‘¢ Recommended solder paste Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder : M705 -221BM5-42-11 ( SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705 /ESR-250 Solder / Flux: M705 / ESR 250 ( SENJU METAL INDUSTRY CO., LTD) 11 Solderability ( Solder dip) Pretreatment ①High , for screen-printing. Solderability depends on the reflow conditions, solder paste , and materials of


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PDF LD-E7-4-14-A QT4c
2014 - Not Available

Abstract: No abstract text available
Text: ‘¢ Recommended solder paste Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder : M705 -221BM5-42-11 ( SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705 /ESR-250 Solder / Flux: M705 / ESR 250 ( SENJU METAL INDUSTRY CO., LTD) 11 Solderability ( Solder dip) Pretreatment ①High , for screen-printing. Solderability depends on the reflow conditions, solder paste , and materials of


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PDF LD-E7-7-14-A
2014 - Not Available

Abstract: No abstract text available
Text: ‘¢ Recommended solder paste Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder : M705 -221BM5-42-11 ( SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705 /ESR-250 Solder / Flux: M705 / ESR 250 ( SENJU METAL INDUSTRY CO., LTD) 11 Solderability ( Solder dip) Pretreatment ①High , for screen-printing. Solderability depends on the reflow conditions, solder paste , and materials of


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PDF LD-E7-6-14-A
2014 - Not Available

Abstract: No abstract text available
Text: -221BM5-42-11 Solder : M705 -221BM5-42-11 ( SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , box after the first reflow is recommended.) ③ Recommended solder paste Solder paste : M705 , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705 /ESR-250 Solder / Flux: M705 / ESR 250 ( SENJU METAL INDUSTRY CO., LTD) 11 Solderability ( Solder dip) Pretreatment ①High , 0.15mm for screen-printing. Solderability depends on the reflow conditions, solder paste , and materials


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PDF LD-E7-8-14-A
2014 - senju m705 solder paste

Abstract: No abstract text available
Text: ‘¢ Recommended solder paste Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder : M705 -221BM5-42-11 ( SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705 /ESR-250 Solder / Flux: M705 / ESR 250 ( SENJU METAL INDUSTRY CO., LTD) 11 Solderability ( Solder dip) Pretreatment ①High , for screen-printing. Solderability depends on the reflow conditions, solder paste , and materials of


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PDF GM2BB50GT1C LD-E7-2-14-A senju m705 solder paste
2014 - Not Available

Abstract: No abstract text available
Text: 0 20 11 0 20 M705 /ESR-250 Solder / Flux: M705 / ESR 250 ( SENJU METAL INDUSTRY CO , humidity. Dipping flux in 3~5s and soldering) M705 -221BM5-42-11 Solder : M705 -221BM5-42-11 ( SENJU , box after the first reflow is recommended.) ③ Recommended solder paste Solder paste : M705 , 0.15mm for screen-printing. Solderability depends on the reflow conditions, solder paste , and materials , seconds (only once). Solder tip temperature: under 350℃ As for the reflow soldering profile, please


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PDF LD-E7-1-14-A
2014 - Not Available

Abstract: No abstract text available
Text: ‘¢ Recommended solder paste Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Temperature [â , -221BM5-42-11 Solder : M705 -221BM5-42-11 ( SENJU METAL INDUSTRY CO., LTD) 12 Solder joint strength under the , mentioned in Page 23. 11 0 20 11 0 20 11 0 20 M705 /ESR-250 Solder / Flux: M705 / ESR 250 ( SENJU METAL INDUSTRY CO., LTD) 11 Solderability ( Solder dip) Pretreatment ①High , for screen-printing. Solderability depends on the reflow conditions, solder paste , and materials of


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PDF LD-E7-3-14-A
2004 - senju m705 solder paste

Abstract: senju M705-221BM5-42-11 M705-221BM5-42-11 RMA9086 senju solder paste M705 SENJU m705 NCP18 90-4-M20 NCP03 NCP15
Text: Chip Type !Caution/Notice Continued from the preceding page. Solder and Flux 1. Solder and Paste (1) Reflow Soldering : NCP03/15/18/21 Series Use RA/RMA type or equivalent type of solder paste . For your reference, we are using the solder paste below for any internal tests of this product. ·RMA9086 , are using the solder paste below. For any internal tests of this product. ·Sn : Pb=63wt%:37wt% ·Sn , product. Printing Conditions of Solder Paste The amount of solder is critical. Standard height of


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PDF R44E8 40kHz. NCP03 NCP15 NCP18/NCP21 senju m705 solder paste senju M705-221BM5-42-11 M705-221BM5-42-11 RMA9086 senju solder paste M705 SENJU m705 NCP18 90-4-M20
2004 - senju m705 solder paste

Abstract: senju solder paste Senju M705 Senju metal solder paste Senju senju M705 solder paste data sheet SENJU 221CM5 M705-221CM5 M705 solder paste stiffener
Text: air Solder composition : Paste , 63%Sn/37%Pb ( Senju Metal Industry, Co., Ltd.'s Part Number: OZ63 , air Solder composition : Paste , 96.5%Sn/3.0%Ag/0.5%Cu Temperature 200 200ç ( Senju Metal , Profile qUsing Typical Solder Paste 5 sec. max. 250 Temperature 240ç 200 200ç 160ç , individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific


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PDF 51pos. 11gramms. senju m705 solder paste senju solder paste Senju M705 Senju metal solder paste Senju senju M705 solder paste data sheet SENJU 221CM5 M705-221CM5 M705 solder paste stiffener
2004 - senju m705 solder wire

Abstract: solder wire senju senju M705-221BM5-42-11 M705-221BM5-42-11 solder paste 63sn alpha metal RMA9086 M705-221BM 903M18
Text: /PRF Series Notice (Soldering and Mounting) Solder and Flux 1. Solder Paste Use solder paste Sn:Pb=63:37wt%. Do not use strong acidic flux (with halide content exceeding 0.2wt%). For your reference, we are using 63Sn/37Pb RMA9086 90-3-M18, manufactured by Alpha Metals Japan Ltd., 96.5Sn/3.0Ag/0.5Cu M705 , soldering. Flow soldering should not be allowed. 1. Printing Conditions of Solder Paste (1) Standard thickness of solder paste printing should be from 0.15 to 0.20 mm. (2) After soldering, the solder fillet


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PDF R90E6 senju m705 solder wire solder wire senju senju M705-221BM5-42-11 M705-221BM5-42-11 solder paste 63sn alpha metal RMA9086 M705-221BM 903M18
2006 - Not Available

Abstract: No abstract text available
Text: reflow is recommended.) Recommended solder paste M705 -221BM5-42-11() Solder paste : M705 , condition mentioned in Page 23. 11 0 20 11 () Solderability ( Solder dip) 150 1 240±5 5±1 s / M705 -221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder / Flux: M705 , thickness 0.15mm for screen-printing. Solderability depends on the reflow conditions, solder paste , and , with the soldering iron (under 60W) within 3 seconds (only once). Solder tip temperature: under 350 As


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PDF GM2BB50QKAC DG-113015 GM2BB50QKAC DG-113015
2006 - Senju flux

Abstract: No abstract text available
Text: .) Recommended solder paste M705 -221BM5-42-11() Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD , 23. 11 0 20 12 () Solderability ( Solder dip) 150 1 240±5 5±1 s / M705 -221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder / Flux: M705 -221BM5/ ESR 250 ( SENJU METAL , screen-printing. Solderability depends on the reflow conditions, solder paste , and materials of the PCBs etc , Solder tip temperature: under 350 As for the reflow soldering profile, please refer to Page 23. Model


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PDF GM2BB35BMAC rDG-104022A GM2BB35BMAC DG-104022A Senju flux
2006 - Not Available

Abstract: No abstract text available
Text: () Solderability ( Solder dip) 150 1 240±5 5±1 s / M705 -221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder / Flux: M705 -221BM5/ ESR 250 ( SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for , dry box after the first reflow is recommended.) Recommended solder paste M705 -221BM5-42-11() Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Recommended Temperature Profile Temperature , conditions, solder paste , and materials of the PCBs etc. Please test and verify the solderability under the


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PDF GM2BB45BMAC rDG-104023A GM2BB45BMAC DG-104023A
2010 - senju m705 solder paste

Abstract: Senju M705-221BM5-42-11 M705 RMA senju RMA9086 NCP03
Text: Flux (1) Solder and Paste (a) Reflow Soldering: NCP03/15/18/21 Series Use RA/RMA type or equivalent type of solder paste . For your reference, we are using the solder paste below for any internal tests of , .) · M705 -221BM5-42-11 (Sn:Ag:Cu=96.5wt%:3.0wt%:0.5wt%) (Manufactured by Senju Metal Industry Co., Ltd.) (b) Flow Soldering: NCP18/21 Series We are using the solder paste below for any internal tests of this product. ·Sn , /Notice Continued from the preceding page. 7. Printing Conditions of Solder Paste The amount of


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PDF NCP03 NCP15 NCP18/NCP21 senju m705 solder paste Senju M705-221BM5-42-11 M705 RMA senju RMA9086
2006 - Not Available

Abstract: No abstract text available
Text: () Solderability ( Solder dip) 150 1 240±5 5±1 s / M705 -221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder / Flux: M705 -221BM5/ ESR 250 ( SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for , dry box after the first reflow is recommended.) Recommended solder paste M705 -221BM5-42-11() Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Recommended Temperature Profile Temperature , conditions, solder paste , and materials of the PCBs etc. Please test and verify the solderability under the


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PDF GM2BB35BM0C DG-103003A GM2BB35BM0C DG-103003A
2006 - Solder bar of Senju M705

Abstract: No abstract text available
Text: () Solderability ( Solder dip) 150 1 240±5 5±1 s / M705 -221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder / Flux: M705 -221BM5/ ESR 250 ( SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for , dry box after the first reflow is recommended.) Recommended solder paste M705 -221BM5-42-11() Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Recommended Temperature Profile Temperature , conditions, solder paste , and materials of the PCBs etc. Please test and verify the solderability under the


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PDF GM2BB57BM0C rDG-09Z031B GM2BB57BM0C DG-09Z031B Solder bar of Senju M705
2006 - Senju M705 safety

Abstract: No abstract text available
Text: () Solderability ( Solder dip) 150 1 240±5 5±1 s / M705 -221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder / Flux: M705 -221BM5/ ESR 250 ( SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for , dry box after the first reflow is recommended.) Recommended solder paste M705 -221BM5-42-11() Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Recommended Temperature Profile Temperature , conditions, solder paste , and materials of the PCBs etc. Please test and verify the solderability under the


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PDF GM2BB57BMAC rDG-104024A GM2BB57BMAC DG-104024A Senju M705 safety
2006 - senju M705-221BM5-42-11

Abstract: Solder bar of Senju M705 senju m705 solder wire Senju M705 solder bar Senju M705 solder paste m705 Senju solder core Senju M705 material safety Senju ESR-250 Senju M705 safety
Text: () Solderability ( Solder dip) 150 1 240±5 5±1 s / M705 -221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder / Flux: M705 -221BM5/ ESR 250 ( SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for , dry box after the first reflow is recommended.) Recommended solder paste M705 -221BM5-42-11() Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Recommended Temperature Profile Temperature , conditions, solder paste , and materials of the PCBs etc. Please test and verify the solderability under the


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PDF GM2BB30BM0C DG-097017D GM2BB30BM0C DG-097017D senju M705-221BM5-42-11 Solder bar of Senju M705 senju m705 solder wire Senju M705 solder bar Senju M705 solder paste m705 Senju solder core Senju M705 material safety Senju ESR-250 Senju M705 safety
2006 - Not Available

Abstract: No abstract text available
Text: () Solderability ( Solder dip) 150 1 240±5 5±1 s / M705 -221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder / Flux: M705 -221BM5/ ESR 250 ( SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for , dry box after the first reflow is recommended.) Recommended solder paste M705 -221BM5-42-11() Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Recommended Temperature Profile Temperature , conditions, solder paste , and materials of the PCBs etc. Please test and verify the solderability under the


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PDF GM2BB30BMAC rDG-101013B GM2BB30BMAC DG-101013B
2006 - Senju flux

Abstract: No abstract text available
Text: ) after opened.(Storage in a dry box after the first reflow is recommended.) Recommended solder paste M705 -221BM5-42-11() Solder paste : M705 -221BM5-42-11( SENJU METAL INDUSTRY CO., LTD) Recommended , 20 11 () Solderability ( Solder dip) 150 1 240±5 5±1 s / M705 -221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder / Flux: M705 -221BM5/ ESR 250 ( SENJU METAL INDUSTRY CO., LTD , . Solderability depends on the reflow conditions, solder paste , and materials of the PCBs etc. Please test and


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PDF GM2BB45QKAC DG-114028A GM2BB45QKAC DG-114028A Senju flux
2006 - ESR-250

Abstract: No abstract text available
Text: reflow is recommended.) Recommended solder paste M705 -221BM5-42-11() Solder paste : M705 , ) 150 1 240±5 5±1 s / M705 -221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder / Flux: M705 -221BM5/ ESR 250 ( SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for 1 hour 11 0 , paste , and materials of the PCBs etc. Please test and verify the solderability under the actual solder , with the soldering iron (under 60W) within 3 seconds (only once). Solder tip temperature: under 350 As


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PDF GM2BB50QK0C DG-113010A GM2BB50QK0C DG-113010A ESR-250
2006 - Not Available

Abstract: No abstract text available
Text: reflow is recommended.) Recommended solder paste M705 -221BM5-42-11() Solder paste : M705 , condition mentioned in Page 23. 11 0 20 11 () Solderability ( Solder dip) 150 1 240±5 5±1 s / M705 -221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder / Flux: M705 , paste , and materials of the PCBs etc. Please test and verify the solderability under the actual solder , with the soldering iron (under 60W) within 3 seconds (only once). Solder tip temperature: under 350 As


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PDF DG-11X007A GM2BB35QK1C GM2BB35QK1C DG-11X007A
2006 - GM2BB65

Abstract: GM2BB65QKAC
Text: reflow is recommended.) Recommended solder paste M705 -221BM5-42-11() Solder paste : M705 , ) 150 1 240±5 5±1 s / M705 -221BM5/ ESR-250 Solder temperature: 240±5 , Soldering time: 5±1 s Solder / Flux: M705 -221BM5/ ESR 250 ( SENJU METAL INDUSTRY CO., LTD) After exposed to 150 for 1 hour 11 0 , thickness 0.15mm for screen-printing. Solderability depends on the reflow conditions, solder paste , and , with the soldering iron (under 60W) within 3 seconds (only once). Solder tip temperature: under 350 As


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PDF GM2BB65QKAC DG-113016 GM2BB65QKAC DG-113016 GM2BB65
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