The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LT5568EUF Linear Technology RF/Microwave Modulator/Demodulator, 700 MHz - 1050 MHz RF/MICROWAVE I/Q MODULATOR, 4 X 4 MM, PLASTIC, MO-220WGGC, QFN-16
LT5568EUF#TR Linear Technology RF/Microwave Modulator/Demodulator, 700 MHz - 1050 MHz RF/MICROWAVE I/Q MODULATOR, 4 X 4 MM, PLASTIC, MO-220WGGC, QFN-16
LT5534ESC6PBF Linear Technology RF/Microwave Detector, 50 MHz - 3000 MHz RF/MICROWAVE LINEAR DETECTOR, LEAD FREE, PLASTIC, SC-70, MO-203AB, 6 PIN
LTC5508ESC6-#PBF Linear Technology RF/Microwave Detector, 300 MHz - 7000 MHz RF/MICROWAVE LINEAR DETECTOR, 12 dBm INPUT POWER-MAX, PLASTIC, SC6, SC-70, 6 PIN
LT5534ESC6TRPBF Linear Technology RF/Microwave Detector, 50 MHz - 3000 MHz RF/MICROWAVE LINEAR DETECTOR, LEAD FREE, PLASTIC, SC-70, MO-203AB, 6 PIN
LTC1643AHCGN#TR Linear Technology LTC1643A - PCI-Bus Hot Swap Controller; Package: SSOP; Pins: 16; Temperature Range: 0°C to 70°C

rf-microwave components Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
Not Available

Abstract: No abstract text available
Text: Components Low Inductance Chip Arrays “Z” Chips Capacitor Arrays Dual Resonance Chips Insulation


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2000 - Not Available

Abstract: No abstract text available
Text: No file text available


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2004 - Not Available

Abstract: No abstract text available
Text: No file text available


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high speed TTL in fet

Abstract: ic switch ttl RF Switches AK002M2-12 alpha Resistors
Text: No file text available


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PDF 3/99A high speed TTL in fet ic switch ttl RF Switches AK002M2-12 alpha Resistors
2010 - SMD fuse 4A

Abstract: MMC 103 ceramic capacitor diode on mobo rf-microwave components F1206B F0603E F0603C F0402E diode smd ED 56a 1601 lcd appl
Text: Vibration Load Life 24 Conditions Components completely immersed in a solder bath at 235 ±5°C for , components stored in "as received" packaging. Components mounted to a substrate. A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Components , tipped tweezers or vacuum pick-ups is strongly recommended for individual components . Bulk handling , Integrated Passive Components Low Inductance Chip Arrays Capacitor Arrays Dual Resonance Chips Custom


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PDF F0402E, F02402G, F0603E, F0805B, F1206B) SMD fuse 4A MMC 103 ceramic capacitor diode on mobo rf-microwave components F1206B F0603E F0603C F0402E diode smd ED 56a 1601 lcd appl
2SC5743

Abstract: 2SC5600 2SC5533 2SC5693 2SC5678 2sc5744 2SC5937 2SC4091 2sc5747 2SC5599
Text: No file text available


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PDF PC8190/8191KRX-IF PC8194/8195KRX-IF PG2124TH 10TSSOP 10-pin FAX044435-9608 2SC5743 2SC5600 2SC5533 2SC5693 2SC5678 2sc5744 2SC5937 2SC4091 2sc5747 2SC5599
Not Available

Abstract: No abstract text available
Text: Leadership As a world-class supplier of RF microwave components for today’s wireless communication systems , reliability of commercial semiconductor components . Six Sigma •  onsistent processes and products C , Designer Kits feature samples of a variety of leading-edge BUY NOW components , with data sheets and , recommended: ESD-sensitive components are classified according to their Personnel ESD withstand voltage using the test procedure described in this standard. The HBM ESDS components classification


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PDF BRO383-11B
1999 - 8016 90 pins connector

Abstract: SZ 7023 347N SMPS MALE CONNECTOR 229N A 229-N 5a5k 345N 28 pin zif socket 1.27mm pitch wt 8075
Text: Mount - European Version CH 41-94 RH31-RH61 Integrated Passive Components 023-N/A 024 025 026 027


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PDF MIL-PRF-55681 CDR01-CDR06 CDR31-CDR35 MIL-PRF-39014/01/02/20/23 MIL-PRF-39014/22, MIL-PRF-39014/05, 8016 90 pins connector SZ 7023 347N SMPS MALE CONNECTOR 229N A 229-N 5a5k 345N 28 pin zif socket 1.27mm pitch wt 8075
2010 - SMD fuse 4A

Abstract: smd fuse p smd fuse d MMC 103 ceramic capacitor smd fuse FUSE SMD 0603 FUSE SMD diode on mobo smd fuse x F0402E
Text: individual components . Bulk handling should ensure that abrasion and mechanical shock are minimized. For , Components Low Inductance Chip Arrays Capacitor Arrays Dual Resonance Chips Custom IPCs Voltage


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PDF F0402E, F02402G, F0603E, F0805B, F1206B) SMD fuse 4A smd fuse p smd fuse d MMC 103 ceramic capacitor smd fuse FUSE SMD 0603 FUSE SMD diode on mobo smd fuse x F0402E
smd fuse p

Abstract: FUSE SMD 0603 FUSE SMD smd fuse d SMD fuse 4A Fuse 0.5A smd fuse rfµwave product rf-microwave components FUSE 2A SMT
Text: Vibration Load Life Conditions Components completely immersed in a solder bath at 235 ±5°C for 2 , components stored in "as received" packaging. Components mounted to a substrate. A force of 5N applied normal to the line joining the terminations and in a line parallel to the substrate. Components , Conditions Components completely immersed in a solder bath at 235 ±5°C for 2 secs. Completely immersed in a solder bath at 260 ±5°C for 60 secs. 12 months minimum with components stored in "as received


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PDF F0402E, F0603E, F0603C, F0805B, F1206B F0612D S-ACCU5M804-C smd fuse p FUSE SMD 0603 FUSE SMD smd fuse d SMD fuse 4A Fuse 0.5A smd fuse rf&microwave product rf-microwave components FUSE 2A SMT
1997 - HSMP-3892

Abstract: HT2 material making ht2 velocity of propagation of FR4 Optotek MTT-18 FR4 dielectric constant 4.3 loss tangent of FR4 HSMP-4890 HSMP-3890
Text: No file text available


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PDF MTT-18, MTT-35, HSMP-3892 HT2 material making ht2 velocity of propagation of FR4 Optotek MTT-18 FR4 dielectric constant 4.3 loss tangent of FR4 HSMP-4890 HSMP-3890
2006 - in5411

Abstract: MTT-18 loss tangent of FR4 HSMP-3892 HSMP-4890 HT2 material qsmp Optotek fr-4 laminate properties anadigics
Text: No file text available


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PDF MTT-35, 5962-8450E 5966-0164E in5411 MTT-18 loss tangent of FR4 HSMP-3892 HSMP-4890 HT2 material qsmp Optotek fr-4 laminate properties anadigics
Accu-Guard SMD Thin-Film Fuse

Abstract: Accu-Guard Series SMD Thin-Film Fuse Fuses Circuit Protection Accu-Guard
Text: Bend Conditions Components completely immersed in a solder bath at 245 ±5°C for 3 secs. Components completely immersed in a solder bath at 255 ±5°C for 60 secs. 12 months minimum with components stored in “as received” packaging. Components mounted to a substrate. Increasing shearing force applied paralled to the sufstrate till destruction. Components mounted to a flexible substrate , Components completely immersed in a solder bath at 235 ±5°C for 2 secs. Completely immersed in a solder


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PDF F0402G F0603G F0402E, F0603E, F0603C, F0805B, F1206B F0612D S-ACCU0M1213-C Accu-Guard SMD Thin-Film Fuse Accu-Guard Series SMD Thin-Film Fuse Fuses Circuit Protection Accu-Guard
2010 - fuse smd code Y

Abstract: 4560 pre amp fuse smd code x FUSE SMD 0603 fuse smd color code fuse smd code D F0603C F1206B fuse smd code t F0402G
Text: Resistance Storage Shear Temperature Cycling Bend Conditions Components completely immersed in a solder bath at 245 ±5°C for 3 secs. Components completely immersed in a solder bath at 255 ±5°C for 60 secs. 12 months minimum with components stored in "as received" packaging. Components mounted to a substrate. Increasing shearing force applied paralled to the sufstrate till destruction. Components , Conditions Components completely immersed in a solder bath at 235 ±5°C for 2 secs. Completely immersed in


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PDF F0402G F0402E, F0603E, F0603C, F0805B, F1206B F0612D fuse smd code Y 4560 pre amp fuse smd code x FUSE SMD 0603 fuse smd color code fuse smd code D F0603C fuse smd code t
2011 - electronic passive components catalog

Abstract: suface 0603 fuse smd code L fuse smd code Y
Text: Conditions Components completely immersed in a solder bath at 245 ±5°C for 3 secs. Components completely immersed in a solder bath at 255 ±5°C for 60 secs. 12 months minimum with components stored in "as received" packaging. Components mounted to a substrate. Increasing shearing force applied paralled to the sufstrate till destruction. Components mounted to a flexible substrate (e.g. FR ­ 4). 1000 cycles -55ºC to , Solderability Leach Resistance Conditions Components completely immersed in a solder bath at 235 ±5°C for 2 secs


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PDF F0402G F0402E, F0603E, F0603C, F0805B, F1206B F0612D S-ACCU5M612-C electronic passive components catalog suface 0603 fuse smd code L fuse smd code Y
2011 - fuse smd code Y

Abstract: trapezoidal pulse i2t graph F0402E F0603C F0603E F1206B glass fuse color code smd t05
Text: Bend Conditions Components completely immersed in a solder bath at 245 ±5°C for 3 secs. Components completely immersed in a solder bath at 255 ±5°C for 60 secs. 12 months minimum with components stored in "as received" packaging. Components mounted to a substrate. Increasing shearing force applied paralled to the sufstrate till destruction. Components mounted to a flexible substrate (e.g. FR ­ 4). , Storage Shear Rapid Change of Temperature Vibration Bend Conditions Components completely


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PDF F0402G F0402E, F0603E, F0603C, F0805B, F1206B F0612D fuse smd code Y trapezoidal pulse i2t graph F0402E F0603C F0603E glass fuse color code smd t05
142-0701-801

Abstract: HSMP-3892 Optotek 511np FR4 substrate antenna
Text: No file text available


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PDF MTT-18, MTT-35, 142-0701-801 HSMP-3892 Optotek 511np FR4 substrate antenna
2001 - rf-microwave components

Abstract: elco power supply ELCO Edge Connectors 20-5069-068-003-871 ELCO 5025 PCMCIA connector cd 5411 ELCO connector 56 PIN ELCO Connector Straddle-Mount header pcb mounted 120 position
Text: design engineer to compact more electronics components onto the PCB board. Assembly tooling can be , compact more electronic components onto the PCB. The kit can be modified for specific applications such , ) Diameter 8=5.0mm (0.197) Diameter FRAMELESS KIT GUIDE BY OPTIONAL COMPONENTS 68 Position Standard , Elco end customers. Several other components such as antennas, LED's, light pipes and I/O connectors , , standoff type (H=0/H=2.0) can also be offered, which enables the components to be mounted on the back


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PDF Assembl496 5M1001-C rf-microwave components elco power supply ELCO Edge Connectors 20-5069-068-003-871 ELCO 5025 PCMCIA connector cd 5411 ELCO connector 56 PIN ELCO Connector Straddle-Mount header pcb mounted 120 position
2000 - MAX2654

Abstract: MAX2654EXT-T MAX2655 MAX2655EXT-T MAX2656 MAX2656EXT-T sc70 topmark
Text: for external matching components . A shutdown feature in the MAX2654/MAX2655 reduces the operating , and external matching components . 4 4 VCC Supply Voltage. Bypass to ground with an , need for external matching components . (For MAX2655, a shunt inductor is recommended for best output , matching networks at the input ports. The values of these matching components are recommended in the


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PDF 1575MHz/1900MHz MAX2654: 1575MHz MAX2655: MAX2656: 1960MHz MAX2654 1575MHz MAX2655 MAX2654EXT-T MAX2655EXT-T MAX2656 MAX2656EXT-T sc70 topmark
2000 - max2654

Abstract: No abstract text available
Text: for external matching components . A shutdown feature in the MAX2654/MAX2655 reduces operating , and external matching components . 4 4 VCC Supply Voltage. Bypass to ground with an , need for external matching components . (For MAX2655, a shunt inductor is recommended for best output , matching networks at the input ports. The values of these matching components are recommended in the


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PDF 1575MHz/1900MHz MAX2654/MAX2655/MAX2656 MAX2654/MAX2655/MAX2656 MAX2654/MAX2655 MAX2654 1575MHz MAX2655
1998 - 10 micro farad 16V capacitor

Abstract: capacitor 100nf 100v 0603 x7r capacitor 220nf 50v 0805 datasheet by avx Silver mica capacitor 68pf 100V lt 6249 capacitor 10nf surface mount 1812 3 pf Silver Dipped Mica Capacitor ceramic capacitor 100nF 104 CAP 100nF 50V 0603 2.2nf 2000v
Text: /34/35) European Version CECC 32 101-801 Chips Packaging of Chip Components Automatic Insertion


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PDF MIL-C-55681/Chips S-MCC35M298-C 10 micro farad 16V capacitor capacitor 100nf 100v 0603 x7r capacitor 220nf 50v 0805 datasheet by avx Silver mica capacitor 68pf 100V lt 6249 capacitor 10nf surface mount 1812 3 pf Silver Dipped Mica Capacitor ceramic capacitor 100nF 104 CAP 100nF 50V 0603 2.2nf 2000v
Practical statistical simulation for efficient circuit design

Abstract: kopin
Text: dominates the system behavior, or when all the components vary independently (as if the parts were all independent discrete components ). The possible statistical system responses, in those cases, can be obtained , ), the assumption that circuit components vary independently or that one device changes while other


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PDF 247mm 174mm CUUK1544-09 CUUK1544/Fager 653mm 871mm 7033268A-GEN, com/display/ads2009/Using 28DOE Practical statistical simulation for efficient circuit design kopin
1998 - CECC32101

Abstract: MIL-PRF-55681 27NF 500V elco 330 u CDR31 CDR02 08055A101JAT2A Silver mica capacitor 68pf 100V CAPACITOR .1 ceramic MICRO FARAD 50 VOLT capacitor 50v 4700 uF datasheet elco
Text: 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . .


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PDF S-MCC20M299-C CECC32101 MIL-PRF-55681 27NF 500V elco 330 u CDR31 CDR02 08055A101JAT2A Silver mica capacitor 68pf 100V CAPACITOR .1 ceramic MICRO FARAD 50 VOLT capacitor 50v 4700 uF datasheet elco
Silver mica capacitor 68pf 100V

Abstract: CECC32101 capacitor 1nf 500v 1812 x7r CDR35 CDR32 CDR31 CDR02 08055A101JAT2A MIL-PRF-55681 elco 330 u
Text: 31 Packaging of Chip Components Automatic Insertion Packaging . . . . . . . . . . . . . . . . . . .


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PDF S-MCC20M299-C Silver mica capacitor 68pf 100V CECC32101 capacitor 1nf 500v 1812 x7r CDR35 CDR32 CDR31 CDR02 08055A101JAT2A MIL-PRF-55681 elco 330 u
elco power supply

Abstract: elco smt 100 rf-microwave catalog 24 5602 040 000 829 H rf-microwave components Battery angle Connector, Pitch 2.5mm, 4 pin ELCO Edge Connectors ELCO 120 elco 5046 diode on mobo
Text: , components , and software for implementing the PCI standard were already in wide use by the personal


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PDF S-FP00M802-C elco power supply elco smt 100 rf-microwave catalog 24 5602 040 000 829 H rf-microwave components Battery angle Connector, Pitch 2.5mm, 4 pin ELCO Edge Connectors ELCO 120 elco 5046 diode on mobo
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