The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTC3854IDDB#TRMPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854EMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IMSE#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C

qfn 48 PACKAGE footprint Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2006 - jedec footprint MO-220 VHHD-2

Abstract: qfn 44 PACKAGE footprint QFN 64 9x9 footprint 32 pins qfn 5x5 footprint jedec package MO-220 64 9x9 WAN_0118 WAN0118 QFN footprint IPC-A-610D QFN 56 7x7 footprint
Text: to the design of a PCB footprint for the QFN package and then goes on to describe practical , creating a QFN footprint is the package drawing for the device. Wolfson uses a number of different QFN , FL: 48 PIN QFN PLASTIC PACKAGE 7 X 7 X 0.9 mm BODY, 0.50 mm LEAD PITCH D2 SEE DETAIL 1 D D2 , SOLDERING. Figure 9 48 pin 7x7 QFN Package Wolfson Type C w January 2006, Rev 2.1 8 WAN , _0118 Figure 14 40 Pin 6x6 QFN Footprint Figure 15 48 Pin 7x7 QFN Footprint Figure 16 64 Pin 9x9 QFN


Original
PDF
2003 - JEDEC Drawing MO-220 qfn

Abstract: 32 pins qfn 5x5 footprint QFN footprint WAN_0118 QFN 20 5x5 "recommended PCB Layout" qfn 48 7x7 stencil QFN 56 7x7 footprint MO-220 7x7 0.4 pitch 32-pin QFN PCB Layout guide qfn 44 PACKAGE footprint 7x7 DIe Size
Text: to the design of a PCB footprint for the QFN package and then goes on to describe practical , creating a QFN footprint is the package drawing for the device. Wolfson uses a number of different QFN , 5MM×5MM 32 A AND C 7MM×7MM 48 C Figure 1 QFN Package Range The Wolfson QFN package , , Rev 1.7 5 WAN_0118 DM029.B FL: 48 PIN QFN PLASTIC PACKAGE 7 X 7 X 0.9 mm BODY, 0.50 mm LEAD , DIMENSIONS Figure 8 28 Pin 5x5 QFN Footprint Figure 9 32 Pin 5x5 QFN Footprint Figure 10 48 Pin 7x7


Original
PDF
2010 - RF5765

Abstract: RF3688 wifi bluetooth combo Module RF5385 RF5755 RF5516 RF5686 HIGH POWER AMPLIFIER 5 W FOR 2.4 GHz wifi bluetooth SP3T
Text: MHz and harmonic filtering in a small QFN package . APPLICATIONS · Mobile devices · Consumer , 3.0 to 4.8 3.0 to 4.8 170 190 QFN 3.0 x 3.0 QFN 3.0 x 3.0 Y Y RF5755* RF5565 RF5686 , reduced footprint and minimized component count, outside the core chipset. The RF3482 and RF5225 FEMs , count and minimized footprint and assembly cost. By integrateing a 5 GHz PA with integrated input and , RF3688 FEM significantly minimizes external component count, reducing the footprint and assembly costs


Original
PDF RF3482, RF5225, RF5325, RF5345, RF5725, RF5745, RF5755, RF5365 11b/g/n RF3482 RF5765 RF3688 wifi bluetooth combo Module RF5385 RF5755 RF5516 RF5686 HIGH POWER AMPLIFIER 5 W FOR 2.4 GHz wifi bluetooth SP3T
2004 - qfn 44 PACKAGE footprint

Abstract: qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH LPCC44 ML6652 eco solder paste
Text: Ethernet Media Converter was introduced. The ML6652CM/EM is the QFN /LPCC44 package version of the ML6652 , schematic symbol and PCB footprint will have a total of 96 pins. TQFP44 QFN /LPCC44 GND/THERMAL Pins , LinearCorporation 2050 Concourse Drive, San Jose, CA 95131 Page 1 ML6652 QFN /LPCC Package 408 , TQFP package is being used. Since the QFN /LPCC44 requires a copper area underneath the package for , shown in Figure 2 and 3. This connection indicates the QFN /LPCC44 package will be used in the design


Original
PDF AN-002 ML6652 AN-002 ML6652CM/EM QFN/LPCC44 ML6652. ML6652CH/EH qfn 44 PACKAGE footprint qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH LPCC44 eco solder paste
2009 - wifi bluetooth combo Module

Abstract: RF5506 RF5516 RF5686 QFN-48 footprint qfn 48 PACKAGE footprint WIFI switch RF5725 RF5345 RF5325
Text: 2.4 - 2.7 GHz, LNA/SW (SP3T) 2.4 - 2.7 12 - 3.0 2.7 - 4.8 7 QFN 2 x 2 Y RF5686 5 GHz FEM, PA, SW, and LPF 4.9 - 5.85 27 16 3.0 3.0 - 4.8 150 QFN 3 x 3 , 4.8 150 QFN 3 x 3 Y Dual-band 2.5/5 GHz, PAs, Switches, LPF, Baluns, and PDET 2.4 - 2.5 , reduced footprint and minimized component count, outside the core chipset. The RF3482 and RF5225 FEMs , component count, minimized footprint and RF5745 · PA, LNA, SP3T · No PDET coupler · 17 dBm at 3.3% ·


Original
PDF RF3482, RF5501, RF5225, RF5325, RF5345, RF5725, RF5745 11b/g RF3482 RF5225 wifi bluetooth combo Module RF5506 RF5516 RF5686 QFN-48 footprint qfn 48 PACKAGE footprint WIFI switch RF5725 RF5345 RF5325
2005 - AN3111

Abstract: qfn 48 PACKAGE footprint qfn 44 PACKAGE footprint
Text: Footprint for 16-Lead QFN , 6 x 6 mm for Automotive, Non-wettable Flank AN3111 2 Sensors Freescale Semiconductor Figure 4. PCB Footprint for 16-Lead QFN , 6 x 6 mm for Automotive, Wettable Flank Figure 5. PCB Footprint for 16-Lead QFN , 6 x 6 mm for Consumer Grade Products and Applications GENERAL PCB , PCB landing pad -0.025 mm = 0.525 x 0.475 mm Package footprint Figure 7. Stencil Design for , components, the solder joints of QFN are formed primarily underneath the package . Optical inspection and


Original
PDF AN3111 16-Lead, AN3111 qfn 48 PACKAGE footprint qfn 44 PACKAGE footprint
2012 - TOSHIBA 8879

Abstract: QFN-20 footprint
Text: compatible w/ 1.8V host processor n Ultra small footprint • 3.0mm x 3.0mm 20- QFN Sensor Inputs , I2C serial interface n Ultra small footprint • 4.0mm x 4.0mm 20- QFN • 4.4mm x 6.5mm , n Small footprint • 5.0mm x 5.0mm 32- QFN >5mm ü Lin./Log. ü ü ü 5x5mm , small footprint • 4.0mm x 4.0mm 28- QFN Button Min. Scan Time Power @ 195ms Overlay , components per input n Ultra small footprint • 4.0mm x 4.0mm 28- QFN • 5.0mm x 5.0mm 32- QFN Min


Original
PDF SX9300* SX9300 Wireles879* TouchSG-0612 TOSHIBA 8879 QFN-20 footprint
2005 - AN3111

Abstract: AN-311-1 etch amkor exposed pad qfn 44 PACKAGE footprint sensor x-ray QFN footprint
Text: manufacturing facilities before qualification. Figure 3. PCB Footprint for 16-Lead QFN , 6 x 6 mm for , 16-Lead QFN , 6 x 6 mm for Automotive, Wettable Flank Figure 5. PCB Footprint for 16-Lead QFN , 6 x , following are the general recommended guidelines for mounting QFN sensors: 1. Use PCB land pad ( footprint , -0.025 mm = 0.525 x 0.475 mm Package footprint Figure 7. Stencil Design for Consumer Applications , QFN are formed primarily underneath the package . Optical inspection and x-ray inspection are


Original
PDF AN3111 16-Lead, AN3111 AN-311-1 etch amkor exposed pad qfn 44 PACKAGE footprint sensor x-ray QFN footprint
2012 - QFN-36 footprint

Abstract: No abstract text available
Text: compatible w/ 1.8V host processor n Ultra small footprint • 3.0mm x 3.0mm 20- QFN Sensor Inputs , footprint • 5.0mm x 5.0mm 32- QFN >5mm ü Lin./Log. ü ü ü 5x5mm - 7 - , small footprint • 4.0mm x 4.0mm 28- QFN Button Min. Scan Time Power @ 195ms Overlay , small footprint • 2.07mm x 2.07mm 19-WLCSP • 4.0mm x 4.0mm 20- QFN Digital Filter Resolution , Protection Small Footprint Proximity SAR Engine IR Analog Haptic Driver LED Driver


Original
PDF SX9300* SX9300 TouchSG-AG-0612 QFN-36 footprint
SOT23W-3

Abstract: transistor crossreference footprint soic 16 soic pcb footprint DFN 10 socket SOT23 MARK EW qsop 16 pcb footprint qfn 44 PACKAGE footprint MS-018AC EK QFN
Text: (4) populated sides and exposed thermal pad (MLPQ/ QFN ); square body, 5 x 5 mm maximum footprint , thermal pad (MLPQ/ QFN ); square body, 6 x 6 mm minimum footprint ; 0.90 mm nominal (1.00 maximum) height , mount, 0.50 mm contact pitch MS-026ABC 48 ­ 4 K (none) Package Type (Common Package , (Common Package Designator) Pictorial View/ Representative Footprint UA (TI,TN, TJ) Continued , MSOP LY, LZ PLCC EA EB ED EP EQ QFN ES ET EU EV QSOP Package Designator K


Original
PDF PUB26013 SOT23W-3 transistor crossreference footprint soic 16 soic pcb footprint DFN 10 socket SOT23 MARK EW qsop 16 pcb footprint qfn 44 PACKAGE footprint MS-018AC EK QFN
2005 - QFN-48 LAND PATTERN

Abstract: QFN PACKAGE thermal resistance QFN-48 footprint qfn 48 7x7 footprint ipc-SM-782 thermal analysis on pcb SMD transistor Mo FOOTPRINT PCB qfn 48 7x7 stencil AN5060
Text: LS/LR 48 Pin QFN Package Outline Cypress Semiconductor Corporation · 3901 North First Street , X 5.3 Figure 2. WirelessUSB LS/LR 48 Pin QFN Package Outline including EPAD to optimize the , a 48 -pin exposed paddle QFN package shown in Figure 1 and Figure 2. In order to achieve peak , GEmin ZEmax AEmax Table 1. QFN Package Dimensions TYPICAL PAD FOOTPRINT Size 7X7 Y I/O 48 Q FN Package Leads/Side 12 Lead Pitch 0.50 m m X ADmax GDmin QFN Package


Original
PDF
2005 - qfn 6x6 foot print

Abstract: QFN-6x6 0.5mm AN3111 QFN-6x6 48 nozzle heater QFN footprint QFN-6x6 package sensors-free qfn stencil QFN-48 LAND PATTERN
Text: Figure 2. PCB Footprint for 16-Lead QFN , 6x6 mm for Automotive Grade Products and Application For , Footprint for 16-Lead QFN , 6x6 mm for Consumer Grade Products and Applications PCB DESIGN GUIDELINES , removed during PCB rework are not recommended to be reused for final assemblies. Figure 9. QFN Package , Freescale Semiconductor Application Note AN3111 Rev 2, 06/2007 Soldering the QFN Stacked , purpose of this application note is to describe suggested methods of soldering sensor QFN devices to a


Original
PDF AN3111 qfn 6x6 foot print QFN-6x6 0.5mm AN3111 QFN-6x6 48 nozzle heater QFN footprint QFN-6x6 package sensors-free qfn stencil QFN-48 LAND PATTERN
SOT23W-3

Abstract: MO-220WGGC PLCC 44 pin through hole tssop 38 footprint MS-018-AC MO-153-AB transistor crossreference DUAL ROW QFN leadframe MS-018AC GTS2000
Text: leadless package with quad (4) populated sides and exposed thermal pad (MLPQ/ QFN ); square body, 0.75 mm , Plastic leadless package with quad (4) populated sides and exposed thermal pad (MLPQ/ QFN ); square body , ) populated sides and exposed thermal pad (MLPQ/ QFN ); square body, 6 x 6 mm minimum footprint ; 0.90 mm , Gull wing surface mount, 0.50 mm contact pitch Pictorial View/ Representative Footprint 48 MS , 28 L Package Type (Common Package Designator) Pictorial View/ Representative Footprint


Original
PDF PUB26013 SOT23W-3 MO-220WGGC PLCC 44 pin through hole tssop 38 footprint MS-018-AC MO-153-AB transistor crossreference DUAL ROW QFN leadframe MS-018AC GTS2000
2005 - QFN-6x6 0.5mm

Abstract: QFN-6x6 48 qfn 6x6 foot print qfn 44 PACKAGE footprint qfn stencil AN3111
Text: mm. Figure 3. PCB Footprint for 16-Lead QFN , 6x6 mm for Consumer Grade Products and Applications , further guidance. Figure 11. QFN Package Removal Process AN3111 4 Sensors Freescale , AN3111 Rev 3, 07/2008 Freescale Semiconductor Application Note Soldering the QFN Stacked , purpose of this application note is to describe suggested methods of soldering sensor QFN devices to a , practices. Figure 1 shows the bottom view of QFN 16 lead, 6x6, individual sensor packaged device


Original
PDF AN3111 QFN-6x6 0.5mm QFN-6x6 48 qfn 6x6 foot print qfn 44 PACKAGE footprint qfn stencil AN3111
2011 - MEC1609

Abstract: MEC1310 MEC1619 smsc MEC1310 USB HSIC ECE1099 from SMSC MEC1618 usb to rj45 converter schematic diagram UFX6000 ECE1099
Text: supports variable External MII Mixed Endian Checksum Offload Engine Pin & Package 56-pin QFN , LAN8710 Interface Ethernet Pin & Package MII/RMII 10/100 32-pin QFN SMSC's highest performing Ethernet , -pin QFN (8x8mm) lead-free RoHS-compliant package Hi-Speed USB 2.0 Switch ­ USB3740 Hi-Speed USB 2.0 switch for portable applications Small-footprint, 10-pin QFN package Provides a high-bandwidth switch , LAN9500A Ethernet Downstream Ports Pin & Package 56-pin QFN 10/100 LAN9512 10/100 2 64-pin QFN


Original
PDF
2009 - qfn 48 PACKAGE footprint

Abstract: 5610 intersil KAD5512P qfn 48 x2210 48LD KAD5514P-25 KAD5514P-21 KAD5514P-17 KAD5514P-12
Text: 411 60.8 Package 72 Ld QFN KAD5512P-25 12 250 234/267 66.1 48 Ld QFN , 72 Ld , 250 390/429 69.5 48 Ld QFN , 72 Ld QFN KAD5610P-25 KAD5514P-21 14 210 363/402 70.2 48 Ld QFN , 72 Ld QFN KAD2710C-21 10 210 222 56.4 68 Ld QFN KAD5514P-17 14 170 339/378 70.6 48 Ld QFN , 72 Ld QFN KAD2710L-21 10 210 240 56.4 68 Ld QFN KAD5514P-12 14 125 309/345 70.9 48 Ld QFN , 72 Ld QFN KAD5610P-21 10 x


Original
PDF 390mW) 432mW) 275mW) 12-bit 1-888-INTERSIL LC-074 qfn 48 PACKAGE footprint 5610 intersil KAD5512P qfn 48 x2210 48LD KAD5514P-25 KAD5514P-21 KAD5514P-17 KAD5514P-12
2010 - qfn 48 PACKAGE footprint

Abstract: ISLA112P50 QFN-48 footprint KAD5512P 7 segment display 5612 qfn 48 ISLA110P50 ISLA118P50 KAD2708C
Text: 69.5 48 Ld QFN , 72 Ld QFN KAD5612P-12 12 x 2 125 342 67.2 72 Ld QFN KAD5514P-21 14 210 363/402 70.2 48 Ld QFN , 72 Ld QFN ISLA110P50* 10 500 441 60.7 , /378 70.6 48 Ld QFN , 72 Ld QFN KAD2710C-27 10 275 261 55.7 68 Ld QFN KAD2710L-27 10 275 278 55.7 68 Ld QFN KAD5514P-12 14 125 309/345 70.9 48 , KAD5512HP-25 12 250 390/429 68.3 48 Ld QFN , 72 Ld QFN KAD5610P-21 10 x 2 210 387


Original
PDF 390mW) 432mW) 428mW) KAD2708C-17 KAD5512P-12 KAD2708L-17 KAD2708C-10 KAD2708L-10 ISLA1XXP50 KAD55XX qfn 48 PACKAGE footprint ISLA112P50 QFN-48 footprint KAD5512P 7 segment display 5612 qfn 48 ISLA110P50 ISLA118P50 KAD2708C
2015 - GS12141

Abstract: No abstract text available
Text: compact 6x6 48 pin QFN package . A smaller package variant, the GS6151 is also available. The GS6151 with its 4x4 32 pin QFN package is ideal for high channel density designs or other applications where the , with integrated retiming features a 4x6 QFN package . This manufacturing friendly, asymmetric package , QFN -40 to +85 EQs 195 4x4 16 QFN Footprint Compat. with Temp Size Range , 130 6x6 48 QFN 2:1 YES -40 to +85 130 4x4 32 QFN 4:1 YES -40 to +85


Original
PDF Broadcast-SG15 GS12141
2007 - EMC4001

Abstract: No abstract text available
Text: Controller ORDER NUMBERS: USB2514-AEZG FOR 36 PIN, QFN LEAD-FREE ROHS COMPLIANT PACKAGE USB2514-HZH FOR 48 PIN, QFN LEAD-FREE ROHS COMPLIANT PACKAGE 80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000 , PACKAGE OUTLINE 48 TERMINAL QFN , 7x7mm BODY, 0.5mm PITCH SCALE 7/16/04 1:1 STD COMPLIANCE , through either a single serial i2C EEPROM, or SMBus Slave Port 36-pin (6x6mm) and 48 -Pin (7x7mm) QFN lead-free, RoHS compliant packages Footprint compatible with USB2513 and USB2512 (36-pin QFN ) to provide


Original
PDF USB2514 48-Pin MO-48QFN-7x7 MO-220 EMC4001
2011 - LE9540

Abstract: Broadcom fxs ve950
Text: Package Ringing Voltage Le9540C 40 QFN -100 V Le9540D 40 QFN -145 V Le9530C 48 eTQFP or 48 QFN -100 V Le9530D 48 eTQFP or 48 QFN -145 V Dual Channel Le9520C 64 eTQFP -100 V Le9520D 64 eTQFP -145 V Le9531C 48 eTQFP or 28 QFN -100 V Le9531D 48 eTQFP or 28 QFN -145 V Le9520SD 64 eTQFP -145 V Le9500A 28 PLCC -75 V , footprint compatible package options as well as voltage-grade options. This enables the designer to develop


Original
PDF VE950 Le9540 11ZS052 LE9540 Broadcom fxs
2008 - Si8420

Abstract: Si8233 Si8234 SI-8501
Text: ºC. Current-sensing terminals are isolated from the other package pins to a maximum voltage of 1,000 , Isolators · Small footprint : 1/3 the size of opto-coupler solutions · Fastest throughput: 150 Mbps max · , , 10, 150 Mbps 1, 10, 150 Mbps 1, 10, 150 Mbps 5.8 mm 4.8 mm Temperature ­40 to 125 ºC ­40 to 125 , ­40 to 125 ºC 10.3 mm 10.3 mm Package Wide Body SOIC8 Wide Body SOIC8 Wide Body SOIC8 Wide Body , SOIC16 ISOdrivers (Isolated Gate Drivers) · Smallest footprint : isolator and driver integrated into


Original
PDF 12-Pin Si8420 Si8233 Si8234 SI-8501
2007 - atheros

Abstract: AR8021 Atheros ar8021 atheros wlan AR7100 atheros 802.11n Gigabit Ethernet PHY Atheros Communications RGMII delay 802.11n transceiver
Text: Small package footprint : 48 pin QFN (6 mm x 6 mm) The Atheros AR8021 is the industry's most , package size compared to competing solutions and features the industry's smallest footprint in a 48 -pin QFN package (6mm x 6mm). This industry-leading GbE PHY footprint results in the lowest , 's Smallest Single Port Gigabit Ethernet PHY Footprint The Atheros AR8021 GbE PHY serves a growing number


Original
PDF AR8021 48-pin atheros Atheros ar8021 atheros wlan AR7100 atheros 802.11n Gigabit Ethernet PHY Atheros Communications RGMII delay 802.11n transceiver
2010 - N681622

Abstract: GR909 DTMF to FSK CONVERTER N681386DG caller id converter fsk to dtmf LQFP-48 footprint n681622yg N6813
Text: including 1MHz / 2MHz Sampling Rate: 8 kHz Small Footprint Packages: LQFP- 48 , QFN-48 and QFN -20 (SLFC , support VDD N681386 SINGLE PROGRAMMABLE QFN /LQFP 48 -Pin 32 31 30 VDD2 TIN RIN Package LQFP- 48 QFN-48 QFN -20 10 6 7 8 9 Notes Green/RoHS Green/RoHS Green/RoHS N681386DG , 17 48 47 46 45 44 43 42 41 40 39 38 37 RIP 16 RING , DSY Metal Paddle (VBAT) N681622 QFN 20-Pin 13 14 15 16 17 18 19 20 21


Original
PDF N681386/N681622 90VPK N681386 48-Pin LQFP-48 QFN-48 QFN-20 N681386DG N681386YG N681622YG N681622 GR909 DTMF to FSK CONVERTER caller id converter fsk to dtmf LQFP-48 footprint n681622yg N6813
2006 - CP2200

Abstract: C8051F340TB C8051F020-TB "embedded systems" ethernet protocol C8051F120 Target Board flash interface C8051F340 c8051f340-tb C8051F120 voip ethernet single chip C8051F34
Text: Inventory management - Lead free 48 -pin TQFP (9 x 9 mm footprint ) - Lead free 28-pin QFN (5 x 5 mm , 10 BASE-T Physical Layer (PHY), and 8 kB of Non-Volatile Flash Memory available in a 28-pin QFN (5x5 mm) or 48 -pin TQFP package . The CP2200/1 can add Ethernet connectivity to any microcontroller or , Motorola bus formats in multiplexed and non-multiplexed mode. The 28-pin QFN device supports multiplexed , non-volatile memory. The Flash is factory preprogrammed with a unique 48 -bit MAC address stored in the last


Original
PDF CP2200/1 CP2200/1 28-pin 48-pin 28-pin C8051F120 CP2200 C8051F020TB C8051F340TB C8051F020-TB "embedded systems" ethernet protocol C8051F120 Target Board flash interface C8051F340 c8051f340-tb voip ethernet single chip C8051F34
2008 - QFN-48 footprint

Abstract: caller id converter dtmf to fsk caller id converter fsk to dtmf footprint qfn48 W681388 fsk to dtmf CONVERTER caller id LQFP-48 footprint fxs interface integrated circuit QFN-48 fiber optic fsk
Text: supported On-chip PLL for flexible clocking options including 1MHz / 2MHz 3.3V operation Small Footprint Packages: LQFP- 48 , QFN-48 Signaling Z matching Z matching & TransHybrid Tone Generation , 48 -Lead QFN /LQFP 6 7 31 30 8 29 9 28 10 27 11 26 12 25 CR , ORDERING INFORMATION DCL DCH RESET Part Number Package Notes GND2 W681388DG LQFP- 48 Pb-Free W681388YG QFN-48 Pb-Free NC4 PCMR FS BCLK VDD3 PCMT VDDL GND3


Original
PDF W681388 W681388 16-bit W681388DG LQFP-48 W681388YG QFN-48 W681388, QFN-48 footprint caller id converter dtmf to fsk caller id converter fsk to dtmf footprint qfn48 fsk to dtmf CONVERTER caller id LQFP-48 footprint fxs interface integrated circuit QFN-48 fiber optic fsk
Supplyframe Tracking Pixel