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LT1030CS#TR Linear Technology IC LINE DRIVER QUAD LP 14SOIC
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LT1236AILS8-5#PBF Linear Technology LT1236LS8 - Precision, Low Noise, Low Profile Hermetic Voltage Reference; Package: LCC; Pins: 8; Temperature Range: -40°C to 85°C
LTC2246HLX#PBF Linear Technology LTC2246H - 14-Bit, 25Msps 125°C ADC In LQFP; Package: LQFP; Pins: 48; Temperature Range: -40°C to 125°C
LTC2226HLX#PBF Linear Technology LTC2226H - 12-Bit, 25Msps 125°C ADC in LQFP; Package: LQFP; Pins: 48; Temperature Range: -40°C to 125°C
LTC2752BCLX#PBF Linear Technology LTC2752 - Dual 16-Bit SoftSpan IOUT DACs; Package: LQFP; Pins: 48; Temperature Range: 0°C to 70°C

pure tin recommended reflow profile Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2003 - Not Available

Abstract: No abstract text available
Text: or pure tin plating (Note 3) FH19S Series Recommended Thickness: = 0.3 ± 0.03mm tinned copper or pure tin plating (Note 3) Item Specification Conditions 1. Insulation resistance , Series) UL94V-0 Contacts Phosphor bronze Pure tin plating (Note 3) - Metal fittings Phosphor bronze Pure tin reflow plating - Insulator Remarks sOrdering , soldering heat No deformation of components affecting performance. Reflow : At the recommended


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PDF FH19S 30pos. FH19S
2003 - Not Available

Abstract: No abstract text available
Text: or pure tin plating (Note 3) FH19S Series Recommended Thickness: = 0.3 ± 0.03mm tinned copper or pure tin plating (Note 3) Item Specification Conditions 1. Insulation resistance , Series) UL94V-0 Contacts Phosphor bronze Pure tin plating (Note 3) - Metal fittings Phosphor bronze Pure tin reflow plating - Insulator Remarks sOrdering , soldering heat No deformation of components affecting performance. Reflow : At the recommended


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PDF FH19S 30pos. FH19S
2002 - Not Available

Abstract: No abstract text available
Text: Relative humidity 90% max. Thickness: = 0.2 ± 0.03mm tinned copper or pure tin plating (Note 3) Thickness: = 0.3 ± 0.03mm tinned copper or pure tin plating (Note 3) Item 1. Insulation resistance 2 , / +85ç / +15ç to +35ç Time: 30 / 2 to 3 / 30 / 2 to 3(Minutes) 5 cycles Reflow : At the recommended , : Beige Color: Dark brown (FH19 Series) Color: Black (FH19S Series) Pure tin plating (Note 3) Pure tin , type 7 Plating specifications : 4 No. of contacts Blank: Pure tin plating (05): Gold plating


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PDF FH19S 30pos.
2003 - FPC-40 LCD connector

Abstract: FPC-40
Text: Series) Color: Black (FH19S Series) Pure tin plating (Note 3) Pure tin reflow plating UL94V , humidity 90% max. Thickness: = 0.2 ± 0.03mm tinned copper or pure tin plating (Note 3) Thickness: = 0.3 ± 0.03mm tinned copper or pure tin plating (Note 3) Item 1. Insulation resistance 2. Withstanding , +35ç / +85ç / +15ç to +35ç Time: 30 / 2 to 3 / 30 / 2 to 3(Minutes) 5 cycles Reflow : At the recommended , Plating specifications : Blank: Pure tin plating (05): Gold plating 39 BConnector Operation


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PDF FH19S 30pos. FH19S FPC-40 LCD connector FPC-40
2003 - FPC-40 LCD connector

Abstract: FH12
Text: % max. FH19 Series FPC, FFC Thickness: = 0.2 ± 0.03mm tinned copper or pure tin plating (Note 3) FH19S Series Recommended Thickness: = 0.3 ± 0.03mm tinned copper or pure tin plating (Note 3 , ) Color: Black (FH19S Series) UL94V-0 Contacts Phosphor bronze Pure tin plating (Note 3) - Metal fittings Phosphor bronze Pure tin reflow plating - Insulator Remarks , : At the recommended temperature profile Manual soldering: 350ç±5ç for 5 seconds Note 1: Includes


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PDF FH19S 30pos. FH19S FPC-40 LCD connector FH12
2002 - fpc 0,5 mm pitch

Abstract: FH1940S05SH
Text: 3 / 30 / 2 to 3 (Minutes) 5 cycles Reflow : At the recommended temperature profile Manual soldering , :Beige Color: Dark brown Pure tin plating (Note 3) Pure tin reflow plating UL94V , copper or pure tin plating (Note 3) Specification Conditions Measured at 100 V DC 150 V AC applied for , /2oz Polyamide 1 mil thick Tinned copper plating or pure tin plating Cu Cu 1/2oz Polyamide Material 1 , devices has created increased demand for a low profile , high density, and high reliability connectors. The


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2012 - MPTS1812L150-24R

Abstract: MPTS1812L010R MPTS1812L125R MPTS1812L110-16R
Text: : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile , devices may not meet the , reflow temperatures exceed the recommended profile , devices may not meet the performance requirements , . Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile , . Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile , seconds. Termination pad characteristics Termination pad materials: Pure Tin Product Dimensions


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PDF E223037 MPTS0805 MPTS0805L010R MPTS0805L020R MPTS0805L035R MPTS0805L050R MPTS0805L075R MPTS0805L100R MPTS1812L150-24R MPTS1812L010R MPTS1812L125R MPTS1812L110-16R
2011 - PTC 090

Abstract: MPTS1206L012
Text: reflow temperatures exceed the recommended profile , devices may not meet the performance requirements. · , reflow temperatures exceed the recommended profile , devices may not meet the performance requirements. · , pad characteristics Termination pad materials: Pure Tin Product Dimensions (Millimeters) MPTS0805 , 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Rev , temperatures exceed the recommended profile , devices may not meet the performance requirements. · Devices are


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PDF E223037 MPTS0805 MPTS0805L010 MPTS0805L020 MPTS0805L035 MPTS0805L050R MPTS0805L075R MPTS0805L100R PTC 090 MPTS1206L012
2011 - Not Available

Abstract: No abstract text available
Text: reflow temperatures exceed the recommended profile , devices may not meet the performance requirements. · , reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure , temperatures exceed the recommended profile , devices may not meet the performance requirements. · Devices are , 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Rev , temperatures exceed the recommended profile , devices may not meet the performance requirements. · Devices are


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PDF E223037 MPTS0805 MPTS0805L010R MPTS0805L020R MPTS0805L035R MPTS0805L050R MPTS0805L075R MPTS0805L100R
2004 - SOLDERABILITY TEST

Abstract: No abstract text available
Text: qualify pure matte tin plating as a replacement for tin /lead plating currently used on Grayhill DIP , solderability of pure matte tin plated terminals and process temperature testing to ensure device compatibility , . Solderability testing was performed to ensure process compatibility of pure matte tin plated switch terminals , : Switch Part Number and Terminal Plating Number of Samples 76SB08 with 100% pure matte tin plating on the terminals, (lead-free) 40 94HAB08W with 100% pure matte tin plating on the terminals


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PDF MIL-STD-202, SOLDERABILITY TEST
2014 - MPTS1206L012

Abstract: No abstract text available
Text: %RH Caution:  If reflow temperatures exceed the recommended profile , devices may not meet the , %RH Caution:  If reflow temperatures exceed the recommended profile , devices may not meet the , ‚· If reflow temperatures exceed the recommended profile , devices may not meet the performance , : < 30ºC / 60%RH Caution:  If reflow temperatures exceed the recommended profile , devices may not , Termination pad materials: Pure Tin Product Dimensions (Millimeters) MPTS0603 Part Number A B


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2013 - Not Available

Abstract: No abstract text available
Text: %RH Caution:  If reflow temperatures exceed the recommended profile , devices may not meet the , : < 30ºC / 60%RH Caution:  If reflow temperatures exceed the recommended profile , devices may not , : < 30ºC / 60%RH Caution:  If reflow temperatures exceed the recommended profile , devices may not , : < 30ºC / 60%RH Caution:  If reflow temperatures exceed the recommended profile , devices may not , : < 30ºC / 60%RH Caution:  If reflow temperatures exceed the recommended profile , devices may not


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Sn60Pb40

Abstract: SMD 5AG SnBiAg nortel capacitor nokia 1325 nokia reflow Hypertension pure tin recommended reflow profile SMT roadmap smd 100mF 6.3V
Text: thermal stress inside the component. The reflow profile below is recommended and tested by AVX for eutectic SnAgCu and SnAgBiCu based lead-free pastes in combination with pure tin finish tantalum , / 60-90 s 2.5ºC/s 240 ± 5ºC 40s max -5ºC/s 160 - 200s Figure 4. Recommended reflow profile , current tin-lead soldering processes. Sn ( pure tin ), Sn / Ag and Sn / Cu are the leading candidates to , mass production. Based on this, pure tin remains the only readily available solution for a termination


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PDF 96Sn-2 5M1002-N Sn60Pb40 SMD 5AG SnBiAg nortel capacitor nokia 1325 nokia reflow Hypertension pure tin recommended reflow profile SMT roadmap smd 100mF 6.3V
2002 - Not Available

Abstract: No abstract text available
Text: . (insertion/ withdrawal) 5. Vibration Thickness: = 0.2±0.03mm tinned copper or pure tin plating (Note 3 , /+85ç/+15ç to +35ç Time: 30/ 2 to 3 / 30 / 2 to 3 (Minutes) 5 cycles Reflow : At the recommended , Color:Beige Color:Black Pure tin plating (Note 3) UL94V-0 -Finish Remarks sOrdering , Recommended temperature profile . The temperature may be slightly changed according to the solder paste type , Temperature Recommended Conditions Reflow system 150 150ç :IR reflow :Paste type Sn/0.3 Ag/0.5 Cu (Flux


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PDF conn1908
2003 - FPC CONNECTOR Front lock

Abstract: No abstract text available
Text: affecting performance. Reflow : At the recommended temperature profile Manual soldering: 350 ç±5 ç for 5 , pure tin plating (Note 3) Item Specification Conditions 1. Insulation resistance 50 M ohms , Phosphor bronze Contacts Remarks Color:Beige UL94V-0 Pure tin plating (Note 3) sOrdering , 200 200ç Recommended Conditions Reflow system 150ç :IR reflow Solder 160ç 150 , Metal mask thickness 100 : 0.1 mm Recommended temperature profile . The temperature may be


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2002 - SEC E 13007 - 2

Abstract: sec 13007 sec E 13007 E 13007 0
Text: . (insertion/ withdrawal) 5. Vibration Thickness: = 0.2±0.03mm tinned copper or pure tin plating (Note 3 , /+85ç/+15ç to +35ç Time: 30/ 2 to 3 / 30 / 2 to 3 (Minutes) 5 cycles Reflow : At the recommended , Color:Beige Color:Black Pure tin plating (Note 3) UL94V-0 -Finish Remarks sOrdering , Recommended temperature profile . The temperature may be slightly changed according to the solder paste type , Temperature Recommended Conditions Reflow system 150 150ç :IR reflow :Paste type Sn/0.3 Ag/0.5 Cu (Flux


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HI-8586PSIF

Abstract: J-STD-020C TL 949
Text: Reflow Profile Holt selected matte tin to provide forward and backward compatibility with both the , Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average Ramp-Up Rate (Tsmax , testing has shown that matte tin is backward compatible to standard 215ºC to 225ºC tin /lead (SnPb) reflow processes and compatible with up to 260ºC Pb-free reflow processes. Tin Whisker Mitigation Because of , tin-lead (SnPb) to pure tin (Sn) lead finishes. Pure tin and high-tin content alloys are subject to tin


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PDF 2002/95/EC, HI-8586PSIF J-STD-020C TL 949
FSMD110-16

Abstract: F11016 fsmd110 FSMD014 E211981 FSMD050 FSMD020 FSMD035 307 smd marking SMD fuse 014
Text: : < 30 / 60%RH Caution: 1. If reflow temperatures exceed the recommended profile , devices may not meet , post trip. Termination pad characteristics Termination pad materials: Pure Tin NOTE , material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 , Reflow and Rework Recommendations The dimension in the table below provide the recommended pad layout , to of the package, measured on the package body surface. Reflow Profile NOTE : Specification


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PDF PQ04-01E 100mA E211981 R50004084 FSMD010 FSMD010 FSMD014 FSMD020 FSMD035 FSMD110-16 F11016 fsmd110 FSMD014 E211981 FSMD050 FSMD020 FSMD035 307 smd marking SMD fuse 014
F020 fuse

Abstract: pure tin recommended reflow profile FSMD020 FSMD1812 A 03e F020 smd fuse marking 20 PQ04 E211981 SMD Devices
Text: . If reflow temperatures exceed the recommended profile , devices may not meet the performance , pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std , LayoutsSolder Reflow and Rework Recommendations The dimension in the table below provide the recommended pad , Reflow Profile Warning: -Operation beyond the specified maximum ratings or improper use may result in , resistance at 23 measured 1 hour post trip. Termination pad characteristics Termination pad materials: Pure


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PDF PQ04-03E 200mA E211981 R50004084 FSMD020 F020 fuse pure tin recommended reflow profile FSMD020 FSMD1812 A 03e F020 smd fuse marking 20 PQ04 E211981 SMD Devices
2003 - Vapor Phase Soldering tantalum capacitors

Abstract: No abstract text available
Text: solder pastes / systems in use today. The recommended IR reflow profile is shown below. 186° Solder , CAPACITORS So there is an order improvement in the capacitors steadystate reliability. Reflow profile , Allowable Range with Care Dangerous Range For vapor phase or infra-red reflow soldering the profile below shows allowable and dangerous time/temperature combinations. The profile refers to the peak reflow , overplated with pure tin (Lead-Free). A barrier nickel and gold termination suitable for conductive epoxy is


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PDF C-260 Vapor Phase Soldering tantalum capacitors
DIODE

Abstract: Automotive Device Sn63pB37 temp profile Sn90-Pb10 Sn90Pb10 Sn63pB37 SN63 PB37 KEC SOT89
Text: Specifications Pure Tin Plating Sn-Pb Dipping Ni, Au Plating Sn-Pb Plating Pure Tin Plating Sn-Pb , specification Same as conventional specification Lead-Free Soldering Temperature Profile Reflow , Material THD Conventional Sn90-Pb10/Sn63-Pb37 Sn63-Pb37 Lead-free Pure Tin (Sn 100 , Lead-free ( Pure Tin Plating) Lead-Free Reliability Test Results 2. Solderability Test Results : THD , , Plating) Lead-free ( Pure Tin Plating) 35 Joint Strength (N) Sn63-Pb37 40 35 Joint


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PDF OT-23. DIODE Automotive Device Sn63pB37 temp profile Sn90-Pb10 Sn90Pb10 Sn63pB37 SN63 PB37 KEC SOT89
FSMD005-1210

Abstract: PQ19 smd led 1210 FSMD110-1210R FSMD050-1210 FSMD035-1210 FSMD020-1210 FSMD200-1210R fsmd110 FSMD010-1210
Text: 23 prior to tripping. R1MAX=Maximum device resistance at 23 measured 1 hour after tripping or reflow soldering of 260 for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin , : Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3 8 , recommended profile , devices may not meet the performance requirements. 2. Devices are not designed to be , Specification and Approval Sheet Version A9 Page 4/4 9. Pad LayoutsSolder Reflow and Rework


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PDF PQ19-01E FSMD1210 E211981 R50090556 FSMD110-1210R, FSMD150-1210R, FSMD175-1210R, FSMD200-1210R FSMD005-1210 PQ19 smd led 1210 FSMD110-1210R FSMD050-1210 FSMD035-1210 FSMD020-1210 FSMD200-1210R fsmd110 FSMD010-1210
FSMD050-2920

Abstract: fuzetec fsmd100-2920 F200L FSMD185-2920 smd fuse F200L FSMD030-2920 FSMD200-2920 FSMD075-2920 FSMD300-2920 FSMD150-2920
Text: after tripping or reflow soldering of 260 for 20 seconds. Termination pad characteristics Termination pad materials : Pure Tin NOTE : Specification subject to change without notice. NO. FUZETEC , 1 10 100 Fault current (A) 7. Material Specification Terminal pad material : Pure Tin , recommended profile , devices may not meet the performance requirements. 2. Devices are not designed to be , Sheet Version 23 Page 4/4 9. Pad LayoutsSolder Reflow and Rework Recommendations The dimension


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PDF PQ11-01E FSMD2920 300mA E211981 R50090556 FSMD030-2920 FSMD050-2920 FSMD075-2920 FSMD100-2920 FSMD050-2920 fuzetec fsmd100-2920 F200L FSMD185-2920 smd fuse F200L FSMD030-2920 FSMD200-2920 FSMD075-2920 FSMD300-2920 FSMD150-2920
1206 fuse FD

Abstract: FSMD200-1206R 1206R FSMD200 FSMD110-1206R FH FUSE SMD FSMD075-1206R fsmd200-1206 FSMD010-1206 PQ18-01E
Text: after tripping or reflow soldering of 260 for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin NOTE : Specification subject to change without notice. NO. FUZETEC , Specification Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E , recommended profile , devices may not meet the performance requirements. 2. Devices are not designed to be , and Approval Sheet Version A8 PQ18-01E Page 4/4 9. Pad LayoutsSolder Reflow and Rework


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PDF PQ18-01E FSMD1206 E211981 R50090556 FSMD075-1206 FSMD100-1206R FSMD110-1206R, FSMD150-1206R: FSMD200-1206R: 1206 fuse FD FSMD200-1206R 1206R FSMD200 FSMD110-1206R FH FUSE SMD FSMD075-1206R fsmd200-1206 FSMD010-1206 PQ18-01E
fuse smd marking f5

Abstract: FSMD075-0805R FSMD100-0805R PQ29-101E FSMD010-0805 FSMD0805 FSMD020-0805 FSMD050-0805R FSMD035 E211981
Text: resistance at 23 measured 1 hour after tripping or reflow soldering of 260 for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin NOTE : Specification subject to change without notice , Terminal pad material: Pure Tin Soldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std , recommended profile , devices may not meet the performance requirements. 2. Devices are not designed to be , and Approval Sheet Version PQ29-101E 9 Page 4/4 9. Pad LayoutsSolder Reflow and Rework


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PDF PQ29-101E FSMD0805 E211981 R50090556 FSMD010-0805 FSMD020-0805 FSMD035-0805 FSMD050-0805R FSMD075-0805R FSMD100-0805R fuse smd marking f5 FSMD075-0805R FSMD100-0805R PQ29-101E FSMD010-0805 FSMD020-0805 FSMD050-0805R FSMD035 E211981
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