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    DSASW00187160.pdf

    • Fujitsu
    • BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M03 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal (BGA
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSASW00187160.pdf preview Download Datasheet

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