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    DSAISS0006677.pdf

    • Central Semiconductor
    • PROCESS CPD07 General Purpose Rectifier 8 Amp Glass Passivated Rectifier Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 100 x 100 MILS Die Thickness 10.2 MILS
    • Original
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    DSAISS0006677.pdf preview Download Datasheet

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