DSAUTAZ0016082.pdf

Manufacturer STMicroelectronics
Partial File Text ® Thermal Data POWER DIP 14-16 14 leads 16 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 3.9 W/cm°C 0.2 W/cm°C leadframe die attach copper soft solder
Type Original
Part Details Part pricing, stock, data attributes from Findchips.com

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