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    DSAZSAA00019808.pdf

    • NXP Semiconductors
    • Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-4 c y exposed die pad side X Dh A 75 51 7
    • Original
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    DSAZSAA00019808.pdf preview Download Datasheet

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