DSASW00416660.pdf

Manufacturer White Electronic Designs
Partial File Text White Electronic Designs WEDPN4M72V-XB2X WEDPN4M64V-XBX PBGA MULTI-CHIP PACKAGE CONSTRUCTION ENCAPSULANT TEST Thickness around die = 0.015" to 0.020" typical Burn-In 100%-48 hours a
Type Original
Part Details Part pricing, stock, data attributes from Findchips.com

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