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    DSA00269321.pdf

    • Central Semiconductor
    • PROCESS CPD92V Schottky Diode High Voltage Schottky Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 9.0 x 9.0 MILS Die Thickness 7.1 MILS Anode Bonding Pad Ar
    • Original
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    DSA00269321.pdf preview Download Datasheet

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