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    DSASW00107572.pdf

    • Altera
    • PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ series mold compound is being added as an additional
    • Original
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    DSASW00107572.pdf preview Download Datasheet

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    altera marking altera top marking ASE BGA Denko HC100 HC100-XJ HC100XJAA mold compound Nitto Nitto Denko HC100-XJ nitto hc100 nitto hc100-xj PCN0415 trace code altera
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