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    DSASW00187164.pdf

    • Fujitsu
    • BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 416 PIN PLASTIC BGA-416P-M02 416-pin plastic BGA Lead pitch 50 mil Pin matrix 30 Sealing method Resin seal (BGA
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSASW00187164.pdf preview Download Datasheet

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