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    DSA00388750.pdf

    • Intel
    • 80960 RM/RN 42.5 mm H-PBGA SHOCK TEST REPORT FOR HEATSINK THERMAL SOLUTIONS Test Performed by Kimberly Harth and Eric Gelvin, Intel Corporation CEG Packaging Engineering March 1999 Purpose Th
    • Original
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    DSA00388750.pdf preview Download Datasheet

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