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    DSAZSAA00019034.pdf

    • NXP Semiconductors
    • Package outline BGA292: plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm SOT489-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/
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    DSAZSAA00019034.pdf preview Download Datasheet

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